Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology SST39VF1602C-70-4C-MAQE

Part No.:
SST39VF1602C-70-4C-MAQE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-WFBGA
Datasheet:
AetrixSST39VF1602C-70-4C-MAQE.pdf
Description:
IC FLASH 16MBIT PARALLEL 48WFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,484

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SST39VF1602C-70-4C-MAQE from Microchip Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with 70 ns read access time, single 2.7–3.6 V supply operation, and hardware top-block protection for boot code storage in embedded microcontroller systems.

For engineers reviewing the SST39VF1602C-70-4C-MAQE datasheet, SST39VF1602C-70-4C-MAQE pinout, SST39VF1602C-70-4C-MAQE application, or SST39VF1602C-70-4C-MAQE equivalent, this page delivers verified package mapping (48-ball WFBGA), JEDEC-compliant x16 interface timing, sector/block/erase capabilities, and real-world flash replacement considerations for industrial control, networking firmware, and automotive ECUs.

Technical Context

The SST39VF1602C-70-4C-MAQE implements SST's proprietary SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed 7 µs word-program and 18 ms sector-erase times independent of cycle count. It supports JEDEC-standard x16 command sets including Software Data Protection (SDP) and Common Flash Interface (CFI) query mode.

Its architecture includes uniform 2 KWord sectors and flexible block sizes (eight 32 KWord, one 16 KWord, two 4 KWord, and one 8 KWord blocks), with top-boot block protection covering FE000H–FFFFFH. The device uses toggle-bit (DQ6/DQ2) and data# polling (DQ7) for write status detection and features RY/BY# open-drain ready/busy signaling.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization1M × 16 (16 Mbit total); enables direct 16-bit bus interfacing with MCUs without data width translation
Read Access Time70 ns; meets timing requirements for 14 MHz synchronous bus operation in legacy embedded systems
Supply Voltage2.7–3.6 V; compatible with single-supply 3.3 V logic domains and eliminates need for voltage translators
Endurance100,000 program/erase cycles; supports field firmware updates over 10+ years in deployed equipment
Data RetentionGreater than 100 years; ensures long-term reliability for unpowered archival storage in industrial environments
Active Current9 mA typical at 5 MHz; reduces thermal load in space-constrained PCB layouts
Standby Current3 µA typical; enables ultra-low-power sleep modes in battery-backed applications

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side solderable.

Pin/Terminal Circuit Role Design Meaning
A0–A19Address Inputs16-bit address bus (A0–A15) + 4 MSB (A16–A19) for sector/block selection; AMS = A19 per JEDEC x16 standard
DQ0–DQ15Data I/O16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high
CE#Chip EnableActive-low chip select; enables device for read/write when low; high-Z output when high
OE#Output EnableActive-low output gate; controls data bus drive during read; no effect on write operations
WE#Write EnableActive-low write strobe; latches address/data on falling/rising edges per JEDEC timing
WP#Write ProtectHardware top-boot block lock; grounded to protect FE000H–FFFFFH; internally pulled up if floating
RST#ResetHardware reset input; forces return to read mode; required TRP low pulse to abort ongoing erase/program
RY/BY#Ready/Busy#Open-drain status output; low = active erase/program; requires external 10–100 kΩ pull-up
VDDPower Supply2.7–3.6 V core and I/O supply; decoupling capacitor required per layout guidelines
VSSGroundPrimary ground reference for all signals; separate VSS pins support low-noise routing
NCNo ConnectionUnbonded pads (e.g., ball A19, C1, D1, E1, F1, G1, H1, J1, K1, L1); must remain unconnected

Key Features

Feature Design Value
Erase-Suspend/ResumeAllows temporary halt of sector/block erase to read or program other locations-critical for real-time firmware patching
Auto Low Power ModeReduces active read current from 9 mA to 3 µA after valid read; eliminates need for software-controlled power gating
Security ID Space128-bit factory-programmed SST ID + 128-word user-programmable segment; supports secure boot authentication
Uniform Sector Erase2 KWord sectors enable fine-grained firmware update partitioning without over-erasing unrelated code sections
Flexible Block ArchitectureOne 8 KWord, two 4 KWord, one 16 KWord, and thirty-one 32 KWord blocks optimize erase granularity for bootloader + application layout

Applications

Industrial PLC Firmware Storage Automotive ECU Bootloader Memory

Use Scenario: Storing and updating ladder logic programs and configuration parameters in programmable logic controllers operating in harsh temperature environments.

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to MCU address space; provides 70 ns read access for deterministic scan-cycle execution.

Use Value: 100,000-cycle endurance and >100-year data retention ensure reliable operation across 15+ year product lifecycles without field replacement.

Use Scenario: Hosting boot code and calibration tables in engine control units requiring AEC-Q100-compliant flash with fast erase for OTA updates.

IC Role / Device Role / Timing Role: Top-boot protected flash storing critical startup routines; WP# pin hardwired to prevent accidental corruption during power transients.

Use Value: Hardware top-block protection (FE000H–FFFFFH) isolates bootloader from application-level erase commands, meeting ISO 26262 ASIL-B functional safety requirements.

Networking Equipment Configuration Medical Device Parameter Storage

Use Scenario: Retaining switch/router configuration profiles, MAC tables, and security keys across power cycles in enterprise-grade network infrastructure.

IC Role / Device Role / Timing Role: JEDEC-compliant x16 interface directly connected to ARM-based SoC; supports CFI queries for runtime flash identification.

Use Value: Sector-erase capability enables selective reconfiguration without disrupting active packet forwarding-reducing downtime during maintenance windows.

Use Scenario: Storing FDA-mandated calibration coefficients, usage logs, and device serial numbers in portable diagnostic instruments with battery backup.

IC Role / Device Role / Timing Role: Low-power nonvolatile memory with 3 µA standby current; interfaces via parallel bus to low-power microcontroller in sleep mode.

Use Value: Auto Low Power Mode cuts active read current by >99% versus standard flash, extending battery life in handheld devices beyond 12 months.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF1601C-70-4C-MAQEBottom-boot architecture (00000H–01FFFH protected); identical timing, voltage, and endurance specsUsed where bootloader resides in lowest memory region instead of top; incompatible pin-for-pin due to different protected address mapSelect only if bottom-boot protection matches system firmware layout-no PCB change needed but software address mapping differs
MX29LV160ETTI-70GSame 16 Mbit x16 organization, 70 ns access, 2.7–3.6 V, but uses different SDP command set and lacks Security ID featureRequires modified driver code for erase/program sequences; no hardware-assisted secure ID storage for regulatory traceabilityChoose for cost-sensitive designs where CFI compatibility is sufficient and security ID is not required

Compared with SST39VF1601C-70-4C-MAQE and MX29LV160ETTI-70G, the SST39VF1602C-70-4C-MAQE uniquely combines top-boot hardware protection, integrated Security ID, and SuperFlash's cycle-independent timing-making it optimal for safety-critical firmware storage where both physical layout and cryptographic identity matter.

Availability

SST39VF1602C-70-4C-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU bootloader memory, and networking equipment configuration requiring stable component supply and long-term obsolescence management.

Supply support for SST39VF1602C-70-4C-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with design centers and manufacturing facilities across North America, Asia, and Europe.

The SST39VF1602C-70-4C-MAQE belongs to Microchip's SST SuperFlash MPF+ family, engineered specifically for embedded systems requiring high-reliability, low-voltage, and fast-update nonvolatile memory in space-constrained industrial and automotive applications.

FAQ

What is the exact memory organization and density of the SST39VF1602C-70-4C-MAQE?

The SST39VF1602C-70-4C-MAQE is organized as 1M × 16, delivering 16 Mbit (2,097,152 bytes) of nonvolatile flash memory. Its address space spans 00000H to FFFFFH, with top-boot block protection covering FE000H–FFFFFH. This configuration supports direct 16-bit parallel bus interfacing without data multiplexing or width conversion circuitry.

Does the SST39VF1602C-70-4C-MAQE support hardware write protection, and how is it implemented?

Yes, the SST39VF1602C-70-4C-MAQE implements hardware top-block protection via the WP# pin. When WP# is grounded, the top 8 KWord block (FE000H–FFFFFH) is locked against program and erase operations. If WP# is left floating, an internal pull-up holds it high, disabling protection. This mechanism operates independently of software commands and remains active during power transitions.

What package type is used for the SST39VF1602C-70-4C-MAQE, and what are its key mechanical dimensions?

The SST39VF1602C-70-4C-MAQE uses a 48-ball WFBGA package measuring 4 mm × 6 mm with 0.5 mm ball pitch. It features a bottom-side solderable footprint optimized for high-density PCB layouts and automated assembly. Pin assignments match Figure 4-3 in DS20005018B, and the package is RoHS-compliant with lead-free terminations.

How does the SST39VF1602C-70-4C-MAQE indicate completion of program or erase operations?

The SST39VF1602C-70-4C-MAQE provides three concurrent status mechanisms: (1) RY/BY# open-drain pin (low = busy), (2) Data# Polling via DQ7 (complement → true data transition), and (3) Toggle Bit on DQ6 (toggling → stable). All methods are valid after defined WE# edge counts per operation type and require no external clock or timer resources.

Is the SST39VF1602C-70-4C-MAQE compatible with JEDEC-standard flash command sets?

Yes, the SST39VF1602C-70-4C-MAQE fully conforms to JEDEC Standard JESD21-C for x16 flash memories. It supports standard command sequences for read, word-program, sector/block/chip-erase, and includes CFI query mode (entry via 555H/AAH/2AAH/55H/555H/98H) for runtime identification of device parameters and command set compliance.

SST39VF1602C-70-4C-MAQE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-WFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-WFBGA (6x4)

SST39VF1602C-70-4C-MAQE FAQ

1.How can I place an order for SST39VF1602C-70-4C-MAQE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF1602C-70-4C-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF1602C-70-4C-MAQE reliable?

The price and inventory of SST39VF1602C-70-4C-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1602C-70-4C-MAQE is usually 5 days.

3.What payment methods are accepted for SST39VF1602C-70-4C-MAQE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1602C-70-4C-MAQE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF1602C-70-4C-MAQE?

SST39VF1602C-70-4C-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF1602C-70-4C-MAQE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF1602C-70-4C-MAQE?

For technical support, including SST39VF1602C-70-4C-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1602C-70-4C-MAQE requirements.

6.How does Aetrix verify that SST39VF1602C-70-4C-MAQE is sourced from the original manufacturer or authorized distributors?

All SST39VF1602C-70-4C-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1602C-70-4C-MAQE meets industry standards.

7.What is the process for return or replacement of SST39VF1602C-70-4C-MAQE?

All SST39VF1602C-70-4C-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1602C-70-4C-MAQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF1602C-70-4C-MAQE part is unused and in its original packaging.

Return procedure for SST39VF1602C-70-4C-MAQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39VF1602C-70-4C-MAQE Tags

  • SST39VF1602C-70-4C-MAQE
  • SST39VF1602C-70-4C-MAQE PDF
  • SST39VF1602C-70-4C-MAQE Datasheet
  • SST39VF1602C-70-4C-MAQE Specifications
  • SST39VF1602C-70-4C-MAQE Images
  • Microchip Technology
  • Microchip Technology SST39VF1602C-70-4C-MAQE
  • Buy SST39VF1602C-70-4C-MAQE
  • SST39VF1602C-70-4C-MAQE Price
  • SST39VF1602C-70-4C-MAQE Distributor
  • SST39VF1602C-70-4C-MAQE Supplier
  • SST39VF1602C-70-4C-MAQE Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER