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Microchip Technology SST39VF1602C-70-4I-B3KE
- Part No.:
- SST39VF1602C-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1602C-70-4I-B3KE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,158
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Product details
Overview
SST39VF1602C-70-4I-B3KE from Silicon Storage Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus memory IC with top-boot block protection, 70 ns read access time, 2.7–3.6 V single-supply operation, and JEDEC-standard x16 asynchronous interface. It delivers 100,000 program/erase cycles and >100 years data retention for embedded firmware storage in industrial controllers and legacy system upgrades.
For engineers reviewing the SST39VF1602C-70-4I-B3KE datasheet, SST39VF1602C-70-4I-B3KE pinout, SST39VF1602C-70-4I-B3KE application, or SST39VF1602C-70-4I-B3KE equivalent, this page provides verified package mapping (48-ball WFBGA), sector/block erase architecture, hardware write protection behavior, and real-world timing values including 7 µs word-program and 18 ms sector-erase - all confirmed from official SST documentation.
Technical Context
The SST39VF1602C-70-4I-B3KE implements SuperFlash split-gate technology with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. Its command-set architecture supports JEDEC-standard software data protection (SDP) via six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.
It features dual status detection: Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2), plus open-drain RY/BY# for hardware-ready signaling. The device includes dedicated WP# for top 8 KWord boot-block protection and RST# for hardware reset to read mode - both validated for use in power-critical embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words): supports full firmware images for microcontrollers with x16 bus interfaces. |
| Read Access Time | 70 ns: enables direct execution from flash (XIP) in systems with ≤14 MHz bus timing budgets. |
| Supply Voltage | 2.7–3.6 V: compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V. |
| Endurance | 100,000 program/erase cycles: sufficient for field-upgradable firmware with infrequent updates over 10+ year product life. |
| Data Retention | >100 years at 25°C: ensures long-term reliability in unpowered storage applications like BIOS/UEFI modules. |
| Word-Program Time | 7 µs typical: reduces firmware update latency and minimizes CPU wait states during in-system programming. |
| Sector-Erase Time | 18 ms typical: allows fast partial reprogramming of configuration sectors without full chip erase overhead. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; A19–A11 select blocks during erase, A11–A0 select sectors/words during read/program. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; tri-stated when CE# or OE# high; latched on rising edge of WE#/CE# during writes. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required low for all operations except reset. |
| OE# | Output Enable | Active-low output gate; controls data bus drivers during read; must be low with CE# for valid output. |
| WE# | Write Enable | Controls write latching; falling edge latches address, rising edge latches data per JEDEC x16 protocol. |
| WP# | Hardware Write Protect | Active-low; protects top 8 KWord boot block (FE000H–FFFFFH) from program/erase when grounded. |
| RST# | Hardware Reset | Active-low; forces immediate return to read mode; requires TRP ≥ 100 ns low pulse to abort ongoing erase/program. |
| RY/BY# | Ready/Busy Output | Open-drain status signal; pulled low during erase/program; requires external 10–100 kΩ pull-up to VDD. |
| VDD | Power Supply | 2.7–3.6 V supply; internal charge pump generates VPP for erase/program - no external high-voltage source needed. |
| VSS | Ground | Two dedicated ground balls (pins E1, H1) ensure stable reference for high-speed read/write transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Top Boot Block Protection | Hardware-enforced write/erase lock on top 8 KWord (FE000H–FFFFFH), preventing accidental corruption of boot code. |
| Erase-Suspend/Resume | Allows reading or programming non-suspended sectors during active erase - critical for real-time firmware patching. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid read access, cutting dynamic power by >99% in polling loops. |
| Security ID Space | Factory-programmed 128-bit SST ID + 128-word user-programmable space, locked permanently after programming. |
| CFI Query Support | JEDEC-standard Common Flash Interface enables automatic driver detection and runtime parameter negotiation in OS-level flash management. |
Applications
| Industrial PLC Firmware Storage | Legacy Embedded System Upgrade |
|---|---|
Use Scenario: Storing ladder logic and configuration data in programmable logic controllers operating in harsh environments with wide temperature swings. IC Role / Device Role / Timing Role: Nonvolatile x16 memory mapped to CPU address space; serves as primary firmware store with hardware boot-block protection. Use Value: 100,000-cycle endurance and >100-year retention ensure reliable operation across decades of unattended industrial deployment. |
Use Scenario: Replacing obsolete EPROMs in legacy medical devices where PCB layout cannot accommodate new footprints. IC Role / Device Role / Timing Role: Pin-compatible drop-in replacement for 48-pin TSOP-based flash; maintains same JEDEC command set and timing. Use Value: 70 ns access time and 2.7–3.6 V supply match original design margins while eliminating UV-erasure maintenance. |
| Network Router Boot Image | Automotive Infotainment Configuration |
Use Scenario: Holding compressed bootloader and kernel image in enterprise-grade routers requiring secure, field-upgradable firmware. IC Role / Device Role / Timing Role: Memory-mapped boot device accessed via x16 bus during cold start; WP# tied low to protect boot sector. Use Value: Erase-suspend capability allows background OTA updates without interrupting packet forwarding or management traffic. |
Use Scenario: Storing UI language packs, calibration tables, and user preferences in automotive head units with strict AEC-Q100 alignment needs. IC Role / Device Role / Timing Role: Secondary nonvolatile storage interfaced to MCU via standard parallel bus; operates within -40°C to +85°C range. Use Value: RoHS-compliant WFBGA package meets automotive board space constraints while maintaining 100K-cycle field update capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV160ETTI-70G | 16 Mbit x16, 70 ns, top-boot, but uses different command set (no CFI support) and lacks erase-suspend. | Requires modified driver code; unsuitable for real-time suspend/resume use cases. | Select only if legacy driver compatibility is prioritized over advanced erase control. |
| S29GL032N90TFI010 | 32 Mbit x16, 90 ns, top-boot, supports CFI and erase-suspend, but higher voltage (2.7–3.6 V same) and larger WFBGA (6×8 mm). | Offers double density and extended feature set but requires PCB redesign due to 48-ball TFBGA footprint. | Choose when future-proofing for larger firmware or needing guaranteed 20-year data retention at 85°C. |
Compared with MX29LV160ETTI-70G and S29GL032N90TFI010, the SST39VF1602C-70-4I-B3KE uniquely balances JEDEC-compliant CFI, erase-suspend, and compact 4×6 mm WFBGA - making it optimal for space-constrained industrial upgrades where firmware agility and footprint continuity are critical.
Availability
SST39VF1602C-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy embedded system upgrades, network router boot image retention, and automotive infotainment configuration requiring stable component supply across extended production lifecycles.
Supply support for SST39VF1602C-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Storage Technology (SST), acquired by Microchip Technology in 2010, specialized in high-reliability NOR flash using proprietary SuperFlash technology for embedded applications.
The SST39VF1602C-70-4I-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for cost-sensitive, space-constrained systems requiring robust firmware storage with hardware boot protection and field-upgrade flexibility.
FAQ
What is the exact boot-block configuration of the SST39VF1602C-70-4I-B3KE?
The SST39VF1602C-70-4I-B3KE implements top-boot block protection, covering the address range FE000H–FFFFFH (8 KWords). This is hardwired in silicon and differs from the bottom-boot SST39VF1601C. WP# must be held low to activate protection; floating WP# leaves the boot block unprotected per internal pull-up.
Does the SST39VF1602C-70-4I-B3KE require an external VPP voltage for programming?
No. The SST39VF1602C-70-4I-B3KE integrates an internal charge pump that generates all necessary high voltages for erase and program operations. Only a single 2.7–3.6 V VDD supply is required - no external VPP pin or circuitry is needed.
How does the Auto Low Power mode function in the SST39VF1602C-70-4I-B3KE?
After a valid read cycle completes, the SST39VF1602C-70-4I-B3KE automatically enters Auto Low Power mode, reducing active current from 9 mA to 3 µA. It exits instantly on any address or control signal transition - with zero access time penalty - making it ideal for polled status checking in low-power systems.
Can the SST39VF1602C-70-4I-B3KE be used in place of a TSOP-packaged SST39VF1602C?
Yes, but only with PCB redesign. The SST39VF1602C-70-4I-B3KE uses a 48-ball WFBGA (4 mm × 6 mm), whereas TSOP variants use 48-lead rectangular packages (12 mm × 20 mm). Electrical functionality, timing, and command set are identical - only the mechanical footprint differs.
What status detection methods are supported by the SST39VF1602C-70-4I-B3KE during write operations?
The SST39VF1602C-70-4I-B3KE supports three concurrent status detection methods: Data# Polling (DQ7), Toggle Bits (DQ6/DQ2), and Ready/Busy# (RY/BY#) open-drain output. All are valid after the appropriate WE#/CE# edge and enable flexible host-side timing without fixed delays.
SST39VF1602C-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF1602C-70-4I-B3KE FAQ
1.How can I place an order for SST39VF1602C-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1602C-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1602C-70-4I-B3KE reliable?
The price and inventory of SST39VF1602C-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1602C-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF1602C-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1602C-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1602C-70-4I-B3KE?
SST39VF1602C-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1602C-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1602C-70-4I-B3KE?
For technical support, including SST39VF1602C-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1602C-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39VF1602C-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF1602C-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1602C-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF1602C-70-4I-B3KE?
All SST39VF1602C-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1602C-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1602C-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39VF1602C-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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