Microchip Technology SST39VF1602C-70-4I-B3KE-T
- Part No.:
- SST39VF1602C-70-4I-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1602C-70-4I-B3KE-T.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,812
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF1602C-70-4I-B3KE-T from Silicon Storage Technology is a 16 Mbit (1M × 16) x16 asynchronous Multi-Purpose Flash Plus memory IC with top-boot block protection, 70 ns read access time, single 2.7–3.6 V supply operation, and JEDEC-standard pinout. It delivers fast Word-Program (7 µs typical), sector/block/chip erase (18/18/40 ms typical), and supports hardware write protection, erase-suspend/resume, and Security ID for embedded firmware storage in industrial control panels.
For engineers reviewing the SST39VF1602C-70-4I-B3KE-T datasheet, SST39VF1602C-70-4I-B3KE-T pinout, SST39VF1602C-70-4I-B3KE-T application, or SST39VF1602C-70-4I-B3KE-T equivalent, this page provides verified pin functions, boot-block address mapping (FE000H–FFFFFH), RY/BY# status signaling, WP#-enabled top-block protection, and CFI-compliant identification - all critical for legacy system upgrades and BOM continuity planning.
Technical Context
The SST39VF1602C-70-4I-B3KE-T implements SuperFlash split-gate technology for fixed erase/program timing independent of cycle count, enabling deterministic firmware update timing without software de-rating. Its architecture features uniform 2 KWord sectors and flexible non-uniform blocks (thirty-one 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord), with top-boot block protection covering FE000H–FFFFFH.
It supports three end-of-write detection methods: Ready/Busy# (open-drain, requires external pull-up), Data# Polling (DQ7), and Toggle Bits (DQ6/DQ2), and includes hardware reset (RST#), latched address/data, and CFI query mode for automated system identification - all compliant with JEDEC standard pinouts and command sets for x16 flash memories.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16) - supports 2 MB of firmware or configuration data in x16 bus interface systems. |
| Read Access Time | 70 ns - enables direct connection to 14 MHz microcontrollers without wait states. |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V. |
| Word-Program Time | 7 µs typical - reduces firmware patch latency and improves field update throughput. |
| Erase Cycle Endurance | 100,000 cycles typical - supports >10 years of daily reprogramming in industrial logging applications. |
| Data Retention | Greater than 100 years - ensures long-term reliability for unattended infrastructure equipment. |
| Top Boot Block Size | 8 KWord (FE000H–FFFFFH) - protects bootloader code from accidental overwrite during application updates. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, suitable for high-density PCB layouts in space-constrained industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; A19–A11 select block during erase, A11–A0 select sector or word. |
| DQ0–DQ15 | Data I/O | x16 bidirectional data bus; tri-stated when CE# or OE# is high; supports JEDEC-standard read/write protocols. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required low for all operations. |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read; high = high-impedance state. |
| WE# | Write Enable | Active-low write strobe; latches address/data on falling/rising edges per JEDEC timing; initiates command sequences. |
| WP# | Write Protect | Active-low hardware lock for top 8 KWord boot block; grounded = protection enabled (FE000H–FFFFFH). |
| RST# | Hardware Reset | Active-low asynchronous reset; terminates in-progress erase/program and forces return to read mode. |
| RY/BY# | Ready/Busy# | Open-drain status output; pulled low during erase/program; requires external 10–100 kΩ pull-up to VDD. |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; internal VPP generation eliminates need for external high-voltage pump. |
| VSS | Ground | Primary ground reference for all signals and internal circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Fixed 7 µs program and 18 ms erase times across full lifecycle - eliminates software timing margining and simplifies firmware update logic. |
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during erase - enables concurrent status monitoring and interrupt-driven system operation. |
| Security ID Space | 128-bit factory-programmed SST ID + 128-word user-programmable segment - supports secure device authentication and OEM branding. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid read - cuts power by >99% during idle polling in battery-backed systems. |
| JEDEC Pin & Command Compliance | Fully compatible with industry-standard x16 flash controllers and BIOS/UEFI firmware stacks - enables drop-in replacement in legacy designs. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash memory providing boot code and application image storage with top-boot protection. Use Value: 100,000-cycle endurance and 100-year data retention ensure reliable operation over 15+ year equipment lifecycles without field recalibration. |
Use Scenario: Holding calibrated sensor parameters and regulatory-compliant device settings in portable diagnostic instruments. IC Role / Device Role / Timing Role: Secure configuration memory with hardware write protection and Security ID for traceability and anti-counterfeiting. Use Value: WP#-enabled top-block protection prevents corruption of FDA-mandated calibration data during routine software updates. |
| Telecom Base Station Bootloader | Automotive Infotainment System Flash |
Use Scenario: Hosting primary bootloader and recovery image in LTE baseband units requiring fail-safe firmware recovery. IC Role / Device Role / Timing Role: Top-boot flash memory with RST#-initiated hard reset and CFI query support for automated version verification. Use Value: 70 ns read access enables immediate execution from reset vector; erase-suspend allows background diagnostics during boot sequence. |
Use Scenario: Storing UI assets, map data, and OTA update staging area in automotive head units operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade (I-temp) parallel flash with Auto Low Power Mode for reduced thermal load during display-off states. Use Value: 2.7–3.6 V operation tolerates automotive battery transients; 3 µA standby current extends battery runtime during key-off monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1601C-70-4I-B3KE-T | Bottom-boot architecture (00000H–01FFFH protected); identical timing, voltage, and package. | Used where bootloader resides in lowest memory region instead of top; incompatible pin-level replacement due to different boot-block mapping. | Select only if existing design uses bottom-boot layout and WP# protection must cover lower 8 KWord. |
| MX29LV160DTTC-70G | Same density, 70 ns access, 2.7–3.6 V, but uses different command set and lacks Security ID; no CFI support. | Requires firmware driver modification; not suitable for systems relying on CFI auto-detection or secure ID binding. | Choose for cost-sensitive replacements where CFI and Security ID are unused; verify command sequence compatibility before integration. |
Compared with SST39VF1602C-70-4I-B3KE-T, SST39VF1601C-70-4I-B3KE-T offers identical performance but inverted boot-block location, while MX29LV160DTTC-70G sacrifices CFI and security features for broader distributor availability - making SST39VF1602C-70-4I-B3KE-T optimal for secure, standards-compliant industrial firmware storage.
Availability
SST39VF1602C-70-4I-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, telecom bootloader hosting, and automotive infotainment system flash requiring stable component supply and long-term lifecycle support.
Supply support for SST39VF1602C-70-4I-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Storage Technology (SST), now part of Microchip Technology, specialized in high-reliability NOR flash memory using proprietary SuperFlash technology for embedded systems.
The SST39VF1602C belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for cost-sensitive, long-lifecycle industrial and telecom applications requiring deterministic timing, hardware data protection, and JEDEC interoperability.
FAQ
What is the boot block configuration of SST39VF1602C-70-4I-B3KE-T?
The SST39VF1602C-70-4I-B3KE-T implements top-boot block protection, covering the address range FE000H–FFFFFH (8 KWord). This is controlled by the WP# pin: when grounded, it prevents program and erase operations on that top block. The SST39VF1602C-70-4I-B3KE-T differs from the SST39VF1601C variant, which protects the bottom 8 KWord (00000H–01FFFH).
Does SST39VF1602C-70-4I-B3KE-T support CFI (Common Flash Interface)?
Yes, the SST39VF1602C-70-4I-B3KE-T fully supports CFI via a standardized three-byte entry sequence (555H/AAH → 2AAH/55H → 555H/98H) or one-byte alternative (55H/98H). Once entered, CFI data at addresses 10H–35H provides geometry, timing, and command-set information - enabling automatic system identification and driver compatibility without hardcoded assumptions.
How does the Auto Low Power Mode function in SST39VF1602C-70-4I-B3KE-T?
The SST39VF1602C-70-4I-B3KE-T automatically enters Auto Low Power Mode after a valid read operation, reducing active current from 9 mA to 3 µA. It exits instantly on any address or control signal transition (e.g., CE# toggle) with no access time penalty. This mode is disabled at power-up until the first address transition occurs - ensuring predictable startup behavior in SST39VF1602C-70-4I-B3KE-T-based systems.
What are the valid methods to detect completion of a Program or Erase operation in SST39VF1602C-70-4I-B3KE-T?
The SST39VF1602C-70-4I-B3KE-T provides three hardware-supported detection methods: Ready/Busy# (open-drain RY/BY# pin), Data# Polling (DQ7 toggles/complements), and Toggle Bits (DQ6 and DQ2). All are valid after defined WE#/CE# edge counts per operation type - e.g., DQ6 toggling begins after the sixth WE# pulse in sector-erase - enabling robust, interrupt-driven firmware update logic in SST39VF1602C-70-4I-B3KE-T implementations.
Is SST39VF1602C-70-4I-B3KE-T compatible with standard x16 flash controllers?
Yes, the SST39VF1602C-70-4I-B3KE-T conforms fully to JEDEC standard pinouts and command sets for x16 flash memories. Its address/data/control signal mapping, timing parameters (70 ns read, 7 µs program), and protocol behavior (e.g., latching on WE#/CE# edges) match industry expectations - allowing direct integration with FPGA-based controllers, ASIC boot interfaces, and legacy microprocessor buses without adapter logic.
SST39VF1602C-70-4I-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF1602C-70-4I-B3KE-T FAQ
1.How can I place an order for SST39VF1602C-70-4I-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1602C-70-4I-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1602C-70-4I-B3KE-T reliable?
The price and inventory of SST39VF1602C-70-4I-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1602C-70-4I-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF1602C-70-4I-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1602C-70-4I-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1602C-70-4I-B3KE-T?
SST39VF1602C-70-4I-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1602C-70-4I-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1602C-70-4I-B3KE-T?
For technical support, including SST39VF1602C-70-4I-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1602C-70-4I-B3KE-T requirements.
6.How does Aetrix verify that SST39VF1602C-70-4I-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF1602C-70-4I-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1602C-70-4I-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF1602C-70-4I-B3KE-T?
All SST39VF1602C-70-4I-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1602C-70-4I-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1602C-70-4I-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF1602C-70-4I-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF1602C-70-4I-B3KE-T Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

