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Microchip Technology SST39VF1602C-70-4I-EKE
- Part No.:
- SST39VF1602C-70-4I-EKE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF1602C-70-4I-EKE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:184
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Product details
Overview
SST39VF1602C-70-4I-EKE from Microchip Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC designed for nonvolatile program, configuration, and data storage in embedded systems. It operates from a single 2.7–3.6V supply, delivers 70 ns read access time, supports hardware block protection on the top 8 KWord boot sector, and features uniform 2 KWord sector erase and flexible block-erase architecture.
For engineers reviewing the SST39VF1602C-70-4I-EKE datasheet, SST39VF1602C-70-4I-EKE pinout, SST39VF1602C-70-4I-EKE application, or SST39VF1602C-70-4I-EKE equivalent, this device is selected for boot code storage in industrial controllers, firmware update storage in networking equipment, and configuration retention in FPGA-based systems where JEDEC-compliant x16 flash with hardware write protection and fast erase/program timing is required.
Technical Context
The SST39VF1602C-70-4I-EKE implements SST's proprietary SuperFlash technology with split-gate cell design and thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count and eliminating performance de-rating over lifetime. Its command-set architecture conforms to JEDEC standard x16 flash pinouts and supports software data protection via six-byte erase and three-byte program sequences.
It integrates hardware-level protection via WP# pin (enabling top-boot block lock), RST# for hardware reset to read mode, and RY/BY# open-drain status output with external pull-up. The device supports Erase-Suspend/Erase-Resume for concurrent read/program during active erase, and includes CFI query capability and 256-bit Security ID (128-bit factory + 128-word user).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 organization) |
| Read Access Time | 70 ns - enables direct execution from flash in 5 MHz–20 MHz microcontroller interfaces without wait states |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic domains and tolerant of brown-out conditions down to 2.7 V |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in deployed industrial devices |
| Data Retention | >100 years - ensures configuration integrity across product lifecycle without refresh |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (one 8K, two 4K, one 16K, thirty-one 32K) - allows granular firmware partitioning and safe OTA update staging |
| Write Protection | Hardware top-boot block protection (FE000H–FFFFFH) via WP# pin - prevents accidental corruption of bootloader code |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS compliant, optimized for high-density PCB layouts in space-constrained embedded applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 1M × 16 addressing (20-bit address bus); AMS = A19 for sector/block selection during erase commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus with internal latching; tri-state when CE# or OE# high; DQ6/DQ7 used for toggle/data# polling status detection |
| CE# | Chip Enable | Active-low chip select; falling edge latches address during write; must be low to initiate any command sequence |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read; high disables outputs to reduce leakage |
| WE# | Write Enable | Active-low write control; rising edge initiates internal program/erase; falling edge latches address/data in command sequences |
| WP# | Write Protect | Active-low hardware lock for top 8 KWord boot block (FE000H–FFFFFH); floating = internally pulled high = unprotected |
| RST# | Reset | Active-low hardware reset; forces return to read mode within TRP; required before valid read after power-up if CE# held low |
| RY/BY# | Ready/Busy# | Open-drain status output requiring 10 kΩ–100 kΩ pull-up; low = active erase/program, high = ready for next operation |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; decoupling required per JEDEC layout guidelines |
| VSS | Ground | Primary ground reference; two dedicated VSS pins in WFBGA package for noise reduction |
| NC | No Connection | Unbonded pads (e.g., ball A19, C1, E1, G1 in WFBGA); must be left unconnected or grounded per layout rules |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Fixed 7 µs word-program and 18 ms sector/block-erase times across full endurance life - eliminates software de-rating and simplifies timing-critical firmware |
| Erase-Suspend/Resume | Allows reading from non-suspended sectors or programming into unlocked regions during active erase - enables real-time diagnostics and fail-safe update recovery |
| Security ID Space | 256-bit secure identity (128-bit factory + 128-word user) with lock-out capability - supports device authentication and anti-cloning in certified systems |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid access - cuts dynamic power by >99% in burst-read applications like boot loading |
| JEDEC-Compliant Command Set | Fully compatible with industry-standard x16 flash controllers and CFI-aware BIOS/bootloaders - ensures drop-in replacement in legacy designs |
Applications
| Industrial PLC Firmware Storage | Networking Equipment Bootloader |
|---|---|
Use Scenario: Storing and executing boot firmware and runtime configuration in programmable logic controllers operating in harsh temperature and EMI environments. IC Role / Device Role / Timing Role: Nonvolatile boot memory mapped to CPU address space; provides 70 ns read access for zero-wait-state execution of initialization code. Use Value: Hardware top-boot protection prevents accidental overwrite of bootloader during field firmware updates, ensuring system recoverability after failed OTA attempts. |
Use Scenario: Holding primary bootloader and fail-safe recovery image in enterprise switches and routers requiring dual-image redundancy. IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash interfaced to ARM Cortex-A series SoCs; supports CFI query for automatic driver initialization. Use Value: Uniform 2 KWord sector erase enables atomic firmware partitioning - critical for A/B update schemes where one sector hosts active image and another holds candidate. |
| FPGA Configuration Storage | Medical Device Parameter Retention |
Use Scenario: Storing bitstream configuration data for Xilinx Spartan and Intel Cyclone FPGAs in diagnostic imaging subsystems. IC Role / Device Role / Timing Role: Parallel interface flash providing synchronous configuration load at power-on; leverages RY/BY# for precise timing control during bitstream streaming. Use Value: >100-year data retention guarantees configuration integrity across 15+ year medical device service life without periodic refresh or backup battery. |
Use Scenario: Retaining calibrated sensor offsets, therapy parameters, and audit logs in portable infusion pumps and patient monitors. IC Role / Device Role / Timing Role: Secure nonvolatile memory with locked Security ID segment; stores encrypted calibration keys and usage history in tamper-resistant format. Use Value: User-programmable 128-word Security ID space enables unique device binding and cryptographic key derivation - meeting IEC 62304 and FDA cybersecurity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1601C-70-4I-EKE | Bottom-boot architecture (00000H–01FFFH protected); identical density, timing, and command set | Used where bootloader resides in lowest memory region instead of top; requires address map adjustment in firmware | Select when system design mandates bottom-boot protection and shares same PCB footprint and BOM logistics |
| MX29LV160ETTI-70G | 16 Mbit x16, 70 ns, 2.7–3.6 V; lacks Erase-Suspend and Security ID; uses different command set (non-JEDEC CFI) | Requires modified driver stack; no concurrent read/program during erase; no hardware-assisted device identity | Choose only if legacy driver compatibility exists and security/real-time suspend features are unnecessary |
Compared with SST39VF1601C-70-4I-EKE and MX29LV160ETTI-70G, the SST39VF1602C-70-4I-EKE uniquely combines top-boot hardware protection, Erase-Suspend capability, and factory-programmed Security ID - making it optimal for safety-critical, updatable, and authenticated embedded systems where firmware integrity and field serviceability are mandatory.
Availability
SST39VF1602C-70-4I-EKE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, networking equipment bootloader, and FPGA configuration storage requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for SST39VF1602C-70-4I-EKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with a focus on reliability, longevity, and embedded system integration.
The SST39VF1602C-70-4I-EKE belongs to Microchip's SST SuperFlash MPF+ family, engineered for robust, low-power, field-upgradable nonvolatile storage in industrial, networking, and medical electronics where data integrity and firmware security are mission-critical.
FAQ
What is the boot block protection scheme of the SST39VF1602C-70-4I-EKE?
The SST39VF1602C-70-4I-EKE implements top-boot hardware block protection on the highest 8 KWord (FE000H–FFFFFH) of its memory array. When the WP# pin is driven low, Program and Erase operations are disabled in that region - safeguarding bootloader code from accidental corruption. If WP# is left floating, an internal pull-up holds it high, leaving the boot block unprotected and writable.
Does the SST39VF1602C-70-4I-EKE support concurrent read and program operations?
No - the SST39VF1602C-70-4I-EKE does not support true concurrent read and program. However, it supports Erase-Suspend/Erase-Resume: during an active Sector- or Block-Erase, issuing the B0H command suspends the erase, allowing reads from non-suspended sectors or Word-Program into unlocked regions. The erase resumes only upon explicit 30H command.
What package type is used in the SST39VF1602C-70-4I-EKE variant?
The SST39VF1602C-70-4I-EKE uses a 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch) package. This ultra-compact, RoHS-compliant封装 is optimized for high-density PCB layouts and thermal performance in space-constrained embedded applications such as medical handhelds and industrial gateways.
How is end-of-write detection implemented in the SST39VF1602C-70-4I-EKE?
The SST39VF1602C-70-4I-EKE provides three hardware-supported end-of-write detection methods: Toggle Bit (DQ6 toggles during Program/Erase, stops when complete), Data# Polling (DQ7 complements during Program, returns true data when done), and RY/BY# (open-drain signal pulled low during operation, high when ready). All require proper external pull-up on RY/BY#.
Is the SST39VF1602C-70-4I-EKE compatible with standard JEDEC x16 flash controllers?
Yes - the SST39VF1602C-70-4I-EKE fully conforms to JEDEC standard pinouts and command sets for x16 parallel flash memories. It supports CFI Query mode (98H command), Software ID entry (90H), and standard Read/Program/Erase sequences, enabling plug-and-play integration with existing BIOS, U-Boot, and FPGA configuration controllers.
SST39VF1602C-70-4I-EKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF1602C-70-4I-EKE FAQ
1.How can I place an order for SST39VF1602C-70-4I-EKE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1602C-70-4I-EKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1602C-70-4I-EKE reliable?
The price and inventory of SST39VF1602C-70-4I-EKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1602C-70-4I-EKE is usually 5 days.
3.What payment methods are accepted for SST39VF1602C-70-4I-EKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1602C-70-4I-EKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1602C-70-4I-EKE?
SST39VF1602C-70-4I-EKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1602C-70-4I-EKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1602C-70-4I-EKE?
For technical support, including SST39VF1602C-70-4I-EKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1602C-70-4I-EKE requirements.
6.How does Aetrix verify that SST39VF1602C-70-4I-EKE is sourced from the original manufacturer or authorized distributors?
All SST39VF1602C-70-4I-EKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1602C-70-4I-EKE meets industry standards.
7.What is the process for return or replacement of SST39VF1602C-70-4I-EKE?
All SST39VF1602C-70-4I-EKE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1602C-70-4I-EKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1602C-70-4I-EKE part is unused and in its original packaging.
Return procedure for SST39VF1602C-70-4I-EKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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