My Inquiry
My Account
Microchip Technology SST39VF1681-70-4C-B3KE
- Part No.:
- SST39VF1681-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1681-70-4C-B3KE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,935
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF1681-70-4C-B3KE from Microchip Technology is a 16 Mbit (2M × 8) CMOS Multi-Purpose Flash Plus memory IC with bottom-block hardware write protection, 70 ns read access time, and single 2.7–3.6 V supply operation. It implements SuperFlash® technology for high reliability in embedded firmware storage applications requiring field-upgradable code or configuration data.
For engineers reviewing the SST39VF1681-70-4C-B3KE datasheet, SST39VF1681-70-4C-B3KE pinout, SST39VF1681-70-4C-B3KE application, or SST39VF1681-70-4C-B3KE equivalent, key selection criteria include boot-block protection location (bottom 64 KB), JEDEC-compliant x8 asynchronous interface, sector/block/chip erase flexibility, and Auto Low Power mode for low-active-read-current operation in power-constrained systems.
Technical Context
The SST39VF1681-70-4C-B3KE uses split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count and eliminating performance de-rating over lifetime. It supports standard microprocessor bus timing with latched address/data and dual status detection (DQ7 Data# Polling and DQ6 Toggle Bit) for write completion monitoring.
Hardware block protection is implemented via the WP# pin to prevent inadvertent program/erase of the bottom 64 KB boot sector (000000H–00FFFFH). The RST# pin provides hardware reset to Read mode, while CFI Query mode (via 98H command) delivers standardized device geometry and timing information for system-level compatibility validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (2,097,152 × 8 bits); supports full firmware image storage for mid-complexity microcontrollers. |
| Read Access Time | 70 ns max; enables direct execution from flash (XIP) at up to ~12 MHz system bus clock without wait states. |
| Supply Voltage | 2.7–3.6 V; compatible with 3.3 V logic domains and eliminates need for separate VPP programming voltage. |
| Endurance | 100,000 program/erase cycles typical; sufficient for infrequent field updates over 10+ year product life. |
| Data Retention | >100 years at +25°C; ensures long-term integrity of stored bootloader or calibration data without refresh. |
| Erase Granularity | Uniform 4 KB sectors and 64 KB blocks; allows selective firmware patching without full chip erase. |
| Active Current | 9 mA typical at 5 MHz; enables low-power operation in battery-backed or energy-harvested systems. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm, B3K footprint), RoHS compliant, suitable for high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus; A20 is AMS (most significant address) for sector/block selection during erase commands. |
| DQ0–DQ7 | Data Input/Output | 8-bit bidirectional data bus; DQ7 = Data# Polling bit, DQ6/DQ2 = Toggle Bits for write status monitoring. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write operations; controls standby-to-active transition. |
| OE# | Output Enable | Active-low output gate; used with CE# to control data bus tri-state behavior during read cycles. |
| WE# | Write Enable | Active-low write strobe; latches address/data and initiates internal program/erase timing sequences. |
| WP# | Write Protect | Active-low hardware lock for bottom 64 KB boot block (000000H–00FFFFH); internally pulled up if floating. |
| RST# | Reset | Active-low hardware reset; terminates ongoing operations and forces return to Read mode within TRP. |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; no VPP required; internal charge pump generates programming voltage. |
Key Features
| Feature | Design Value |
|---|---|
| Bottom Block Protection | Hardware-enforced write/erase lock on bottom 64 KB (000000H–00FFFFH), ensuring bootloader integrity. |
| Erase-Suspend/Resume | Allows temporary interruption of sector/block erase to read or program other locations, improving system responsiveness. |
| Security ID Space | 256-bit user-programmable ID (128-bit factory-locked SST ID + 128-bit customer field), non-erasable and lockable. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid read access, cutting dynamic power by >99%. |
| CFI Compliance | JEDEC-standard Common Flash Interface support enables automatic driver detection and configuration in OS/bootloader stacks. |
Applications
| Industrial HMI Firmware Storage | Medical Device Configuration Memory |
|---|---|
|
Use Scenario: Storing and updating GUI firmware images and language packs in panel-mounted HMIs operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable 70 ns access; bottom-block protection secures boot loader against corruption. Use Value: Enables safe over-the-air firmware upgrades without risk of bricking the device due to interrupted writes. |
Use Scenario: Holding calibrated sensor coefficients and regulatory-compliant device settings in portable diagnostic equipment. IC Role / Device Role / Timing Role: High-reliability parameter storage with >100-year data retention and 100,000-cycle endurance for recalibration events. Use Value: Eliminates need for external EEPROM or battery-backed SRAM, reducing BOM cost and board area. |
| Networking Equipment Boot ROM | Automotive Infotainment System Code Storage |
|
Use Scenario: Hosting boot code and FPGA configuration bitstreams in enterprise switches with hot-swap power supplies. IC Role / Device Role / Timing Role: JEDEC-compliant x8 interface ensures plug-and-play compatibility with ARM/MIPS SoCs; CFI support simplifies BIOS/UEFI integration. Use Value: Guarantees deterministic 70 ns read latency for fast boot times and eliminates timing margin uncertainty in high-speed designs. |
Use Scenario: Storing audio codec firmware and UI assets in head-unit modules requiring AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Single 3.3 V supply and industrial temperature range (-40°C to +85°C) meet automotive power and environmental requirements. Use Value: Reduces system-level power management complexity by removing need for multi-rail regulators or level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV160DBTI-70G | 16 Mbit (2M × 8), 70 ns access, but top-boot block protection only; no Auto Low Power mode. | Lacks bottom-block protection and low-power read mode; requires external power management for battery use. | Select when top-boot architecture matches existing layout and power budget permits higher active current. |
| S29AL016J70TFI020 | 16 Mbit (2M × 8), 70 ns access, bottom-boot protection, but no Erase-Suspend/Resume capability. | Cannot interrupt erase to service real-time reads; less flexible in multitasking embedded environments. | Choose when CFI support and suspend/resume are not required, and legacy AMD-compatible command set is preferred. |
Compared with MX29LV160DBTI-70G and S29AL016J70TFI020, the SST39VF1681-70-4C-B3KE uniquely combines bottom-boot hardware protection, Erase-Suspend/Resume, and Auto Low Power mode-enabling safer field updates, real-time system responsiveness, and lower average power in portable or thermally constrained applications.
Availability
SST39VF1681-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial HMI firmware storage, medical device configuration memory, and networking equipment boot ROM requiring stable component supply, long-lifecycle availability, and RoHS-compliant packaging.
Supply support for SST39VF1681-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now manufactures and supports the SST39VF1681-70-4C-B3KE as part of its broad portfolio of serial and parallel flash memory solutions.
The SST39VF1681-70-4C-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for embedded systems needing reliable, low-voltage, field-upgradable nonvolatile storage with robust hardware and software data protection.
FAQ
What is the boot block protection scheme for SST39VF1681-70-4C-B3KE?
The SST39VF1681-70-4C-B3KE implements bottom-block hardware protection: when WP# is grounded, the bottom 64 KB (address range 000000H–00FFFFH) is locked against program and erase operations. This ensures bootloader integrity. Unlike the SST39VF1682, which protects the top 64 KB, the SST39VF1681-70-4C-B3KE's protection is fixed to the lower address region per JEDEC-compliant pinout and command set.
Does SST39VF1681-70-4C-B3KE require an external VPP voltage for programming?
No, the SST39VF1681-70-4C-B3KE does not require an external VPP voltage. It uses internal charge-pump circuitry to generate the high voltage needed for program and erase operations from the single 2.7–3.6 V VDD supply. This eliminates the need for additional power rails or voltage translators, simplifying system design and reducing component count.
How is write completion detected on SST39VF1681-70-4C-B3KE?
Write completion on the SST39VF1681-70-4C-B3KE is detected using two hardware status methods: Data# Polling (DQ7 toggles until operation completes, then reflects true data) and Toggle Bit (DQ6 toggles during operation and stops when complete). Both methods are supported for byte-program, sector/block-erase, and chip-erase operations, enabling efficient polling-based firmware control without timers.
What package type is used for SST39VF1681-70-4C-B3KE?
The SST39VF1681-70-4C-B3KE is packaged in a 48-ball TFBGA (6 mm × 8 mm, B3K footprint) with ball pitch of 0.8 mm. This package meets RoHS requirements and is optimized for high-density PCB layouts. Pin assignments match JEDEC-standard x8 flash footprints, enabling drop-in compatibility with other 48-ball TFBGA flash devices in the same form factor.
Can SST39VF1681-70-4C-B3KE be used in automotive applications?
The SST39VF1681-70-4C-B3KE is rated for industrial temperature range (–40°C to +85°C) and is RoHS compliant, making it suitable for under-hood or cabin-infotainment applications where AEC-Q100 qualification is not mandated. However, it is not officially AEC-Q100 qualified; for automotive-grade assurance, users should verify system-level qualification testing and consult Microchip's automotive product roadmap for certified alternatives.
SST39VF1681-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF1681-70-4C-B3KE FAQ
1.How can I place an order for SST39VF1681-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1681-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1681-70-4C-B3KE reliable?
The price and inventory of SST39VF1681-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1681-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF1681-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1681-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1681-70-4C-B3KE?
SST39VF1681-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1681-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1681-70-4C-B3KE?
For technical support, including SST39VF1681-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1681-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39VF1681-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF1681-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1681-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF1681-70-4C-B3KE?
All SST39VF1681-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1681-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1681-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39VF1681-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF1681-70-4C-B3KE Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
