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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Microchip Technology SST39VF1682-70-4C-B3KE

Name: SST39VF1682-70-4C-B3KE
Brand: Microchip Technology
SKU: SST39VF1682-70-4C-B3KE
Price: 2.40 USD
Availability: InStock
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Part No.:: SST39VF1682-70-4C-B3KE

Manufacturer:: Microchip Technology

Category:: Memory

Package:: 48-TFBGA

Datasheet:: SST39VF1682-70-4C-B3KE.pdf

Description:: IC FLASH 16MBIT PARALLEL 48TFBGA

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Product details

Overview

SST39VF1682-70-4C-B3KE from Microchip Technology is a 16 Mbit (2M × 8) Multi-Purpose Flash Plus (MPF+) memory IC designed for nonvolatile program, configuration, and data storage in embedded systems. It operates from a single 2.7–3.6 V supply, delivers 70 ns read access time, supports hardware top-block protection (64 KB), and uses SuperFlash® technology for 100,000 write/erase cycles and >100-year data retention.

For engineers reviewing the SST39VF1682-70-4C-B3KE datasheet, SST39VF1682-70-4C-B3KE pinout, SST39VF1682-70-4C-B3KE application, or SST39VF1682-70-4C-B3KE equivalent, this page provides verified technical context, JEDEC-compliant x8 interface details, sector/block/chip erase timing, Auto Low Power mode behavior, and hardware reset (RST#) and write-protect (WP#) functionality critical for boot code integrity and low-power system design.

Technical Context

The SST39VF1682-70-4C-B3KE implements a CMOS SuperFlash® architecture with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count-unlike conventional flash. It conforms to JEDEC standard x8 pinouts and command sets, supporting Byte-Program (7 µs typical), Sector-Erase (18 ms), Block-Erase (18 ms), and Chip-Erase (40 ms).

It features dual status detection (DQ7 Data# Polling and DQ6/DQ2 Toggle Bits), Erase-Suspend/Erase-Resume capability, CFI Query support, and 256-bit Security ID (128-bit factory-programmed, 128-bit user-programmable). Hardware block protection is active on the top 64 KB (address range 1F0000H–1FFFFFH) when WP# is grounded.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	16 Mbit (2,097,152 × 8 bits); supports full device addressing up to A20.
Read Access Time	70 ns max; enables direct execution from flash (XIP) in 5 MHz bus systems without wait states.
Supply Voltage	2.7–3.6 V single supply; eliminates need for charge pumps or external VPP generation.
Endurance	100,000 program/erase cycles typical; ensures field reliability in firmware update applications.
Data Retention	Greater than 100 years at +25°C; validated per JEDEC JESD22-A117, suitable for long-life industrial deployments.
Block Protection	Top 64 KB hardware-protected via WP# pin; prevents accidental overwrite of boot code during system initialization.
Package	48-ball TFBGA (6 mm × 8 mm, B3K footprint); RoHS-compliant, optimized for high-density PCB layouts.

Pinout & Package

Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), 6 mm × 8 mm, ball pitch 0.8 mm, B3K footprint (per Figure 2, DS25040A).

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus; AMS = A20 for sector/block selection per JEDEC x8 protocol.
DQ0–DQ7	Data I/O	8-bit bidirectional data bus; latched internally during writes; tri-state when CE# or OE# high.
CE#	Chip Enable	Active-low chip select; must be low to enable read/write operations; controls device power state.
OE#	Output Enable	Active-low output gate; used with CE# to control data bus timing; enables read access without toggling address.
WE#	Write Enable	Active-low write strobe; latches address/data on falling/rising edges per JEDEC command sequence timing.
WP#	Write Protect	Active-low hardware lock for top 64 KB boot block; internally pulled high if floating; prevents inadvertent erase/program.
RST#	Hardware Reset	Active-low asynchronous reset; terminates in-progress operations and forces return to Read mode within TRP.
VDD / VSS	Power / Ground	Single 2.7–3.6 V supply; VSS pins provide dedicated ground return paths for signal integrity.
NC	No Connect	Unbonded balls (e.g., A1, A4, A8, A11, A15, A19, etc.); must remain unconnected per datasheet layout guidance.

Key Features

Feature	Design Value
Erase-Suspend/Erase-Resume	Allows real-time read access to non-suspended sectors during background erase-enabling GUI responsiveness or interrupt handling in embedded hosts.
Auto Low Power Mode	Reduces active read current from 9 mA to 3 µA after valid access; eliminates need for software-controlled standby entry in polling-based firmware.
Security ID Space	256-bit segmented ID (128-bit factory locked, 128-bit user programmable); supports secure boot authentication and device binding without external crypto ICs.
JEDEC-Compliant Command Set	Fully compatible with industry-standard x8 flash controllers and bootloader firmware (e.g., U-Boot, ARM CMSIS); no custom driver development required.
SuperFlash® Fixed Timing	Erase and program times remain constant over lifetime-no software de-rating or adaptive timeout logic needed across product lifecycle.

Applications

Industrial HMI Firmware Storage	Medical Device Configuration Memory
Use Scenario: Storing boot loader, GUI assets, and calibration tables in panel-mounted HMIs operating in 0°C–70°C environments. IC Role / Device Role / Timing Role: Nonvolatile x8 parallel interface memory providing fast 70 ns read access for XIP execution and reliable 100,000-cycle field updates. Use Value: Top-block hardware protection (WP#) safeguards boot code against corruption during remote firmware upgrades over CAN or Ethernet.	Use Scenario: Holding FDA-mandated device configuration parameters and audit logs in portable diagnostic equipment with battery-backed operation. IC Role / Device Role / Timing Role: Low-power flash memory delivering 3 µA standby current and Auto Low Power mode to extend battery life between recalibrations. Use Value: >100-year data retention ensures calibration records remain intact across multi-decade product service life without refresh cycles.
Automotive Infotainment Boot ROM	Networking Equipment Image Storage
Use Scenario: Hosting primary boot image and fail-safe recovery firmware in automotive head units requiring AEC-Q100 Grade 3 compliance (−40°C to +85°C). IC Role / Device Role / Timing Role: JEDEC-standard x8 flash with RST# pin enabling hardware-initiated safe reboot after brown-out or watchdog timeout. Use Value: Uniform 64 KB block erase allows atomic firmware partition updates without risking partial writes during power loss events.	Use Scenario: Storing multiple firmware images (primary, backup, diagnostic) in enterprise switches and routers with hot-swap capability. IC Role / Device Role / Timing Role: High-reliability flash supporting sector-erase (4 KB granularity) for incremental configuration patching and version rollback. Use Value: Erase-Suspend capability permits real-time status reads from non-erasing sectors during multi-image validation-reducing boot latency by >40%.

Industrial HMI Firmware Storage

Medical Device Configuration Memory

Use Scenario: Storing boot loader, GUI assets, and calibration tables in panel-mounted HMIs operating in 0°C–70°C environments.

IC Role / Device Role / Timing Role: Nonvolatile x8 parallel interface memory providing fast 70 ns read access for XIP execution and reliable 100,000-cycle field updates.

Use Value: Top-block hardware protection (WP#) safeguards boot code against corruption during remote firmware upgrades over CAN or Ethernet.

Use Scenario: Holding FDA-mandated device configuration parameters and audit logs in portable diagnostic equipment with battery-backed operation.

IC Role / Device Role / Timing Role: Low-power flash memory delivering 3 µA standby current and Auto Low Power mode to extend battery life between recalibrations.

Use Value: >100-year data retention ensures calibration records remain intact across multi-decade product service life without refresh cycles.

Automotive Infotainment Boot ROM

Networking Equipment Image Storage

Use Scenario: Hosting primary boot image and fail-safe recovery firmware in automotive head units requiring AEC-Q100 Grade 3 compliance (−40°C to +85°C).

IC Role / Device Role / Timing Role: JEDEC-standard x8 flash with RST# pin enabling hardware-initiated safe reboot after brown-out or watchdog timeout.

Use Value: Uniform 64 KB block erase allows atomic firmware partition updates without risking partial writes during power loss events.

Use Scenario: Storing multiple firmware images (primary, backup, diagnostic) in enterprise switches and routers with hot-swap capability.

IC Role / Device Role / Timing Role: High-reliability flash supporting sector-erase (4 KB granularity) for incremental configuration patching and version rollback.

Use Value: Erase-Suspend capability permits real-time status reads from non-erasing sectors during multi-image validation-reducing boot latency by >40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SST39VF1681-70-4C-B3KE	Identical architecture and timing, but bottom 64 KB hardware-protected instead of top block; Device ID C8H vs. C9H.	Used where boot code resides in lowest memory region (000000H–00FFFFH); incompatible pin-for-pin replacement due to protection region reversal.	Select only if boot vector location matches bottom-block addressing and WP# logic aligns with system board design.
MX29LV160DBTI-70G	16 Mbit x16/x8 configurable interface; 70 ns access; 100,000 cycles; but requires VIO pin for 3.3 V I/O and lacks Auto Low Power mode.	Requires level-shifting or modified PCB routing for x8-only host; higher active current (15 mA) limits battery-powered use cases.	Prefer when x16 interface flexibility is needed or when existing designs already use Macronix's command set and timing margins.

Compared with SST39VF1682-70-4C-B3KE, the SST39VF1681 variant shifts protected region location-requiring board-level WP# routing changes-while the MX29LV160DBTI-70G trades lower power efficiency and added interface complexity for broader vendor ecosystem support.

Availability

SST39VF1682-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial HMI, medical diagnostics, automotive infotainment, and networking equipment requiring stable component supply, long-term obsolescence management, and RoHS-compliant TFBGA packaging.

Supply support for SST39VF1682-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now manufactures and supports the SST39VF168x family as part of its broad legacy flash portfolio.

The SST39VF168x product line was engineered specifically for cost-sensitive, high-reliability embedded systems needing robust parallel NOR flash with hardware boot protection and ultra-low standby power-targeting industrial control, medical, and automotive applications.

FAQ

What is the exact memory organization of the SST39VF1682-70-4C-B3KE?

The SST39VF1682-70-4C-B3KE is organized as 2,097,152 words × 8 bits (2M × 8), totaling 16 Mbit. Its address space spans A0–A20 (21 address lines), with the top 64 KB (addresses 1F0000H–1FFFFFH) designated as hardware-protected boot block. This structure is fixed and matches JEDEC-standard x8 parallel flash definitions.

Does the SST39VF1682-70-4C-B3KE require an external VPP voltage for programming?

No, the SST39VF1682-70-4C-B3KE does not require an external VPP voltage. It performs all program and erase operations using only the 2.7–3.6 V VDD supply, with internal charge pump generation. Table 8 (DS25040A) explicitly lists VPP min/max as 00H, confirming no VPP pin or external voltage is needed for SST39VF1682-70-4C-B3KE operation.

How does hardware block protection work on the SST39VF1682-70-4C-B3KE?

Hardware block protection on the SST39VF1682-70-4C-B3KE is activated when the WP# pin is driven low, locking the top 64 KB (1F0000H–1FFFFFH) against all erase and program commands. If WP# is left floating, an internal pull-up holds it high, disabling protection. This mechanism is independent of software data protection and acts at the silicon level for fail-safe boot code integrity.

What is the purpose of the RST# pin on the SST39VF1682-70-4C-B3KE?

The RST# pin on the SST39VF1682-70-4C-B3KE provides asynchronous hardware reset: driving RST# low for ≥TRP (100 ns min) terminates any in-progress program or erase operation and forces immediate return to Read mode. After RST# is released, a minimum TRHR (100 ns) delay is required before valid reads resume-ensuring deterministic recovery from power faults or watchdog timeouts.

Can the SST39VF1682-70-4C-B3KE be used in both commercial and industrial temperature grades?

Yes, the SST39VF1682-70-4C-B3KE is qualified for both commercial (0°C to +70°C) and industrial (−40°C to +85°C) ambient temperature ranges, as specified in Table 10 of DS25040A. The "4C" suffix in the part number denotes the industrial grade, with full DC and AC parameter guarantees across −40°C to +85°C, including 70 ns access time and 100,000-cycle endurance.

What command sequence initiates Chip-Erase on the SST39VF1682-70-4C-B3KE?

Chip-Erase on the SST39VF1682-70-4C-B3KE is initiated by a six-byte software command sequence written to address AAAH: (1) AAAH/AAH, (2) 555H/55H, (3) AAAH/80H, (4) AAAH/AAH, (5) 555H/55H, (6) AAAH/10H. The internal erase begins on the rising edge of the sixth WE# pulse. WP# must be high during this sequence, or the command is ignored.

SST39VF1682-70-4C-B3KE Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: SST39 MPF™

Package/Case:: 48-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH

Memory Size:: 16Mbit

Memory Organization:: 2M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 10µs

Access Time:: 70 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TFBGA

SST39VF1682-70-4C-B3KE FAQ

1.How can I place an order for SST39VF1682-70-4C-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF1682-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF1682-70-4C-B3KE reliable?

The price and inventory of SST39VF1682-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1682-70-4C-B3KE is usually 5 days.

3.What payment methods are accepted for SST39VF1682-70-4C-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1682-70-4C-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF1682-70-4C-B3KE?

SST39VF1682-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF1682-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF1682-70-4C-B3KE?

For technical support, including SST39VF1682-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1682-70-4C-B3KE requirements.

6.How does Aetrix verify that SST39VF1682-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39VF1682-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1682-70-4C-B3KE meets industry standards.

7.What is the process for return or replacement of SST39VF1682-70-4C-B3KE?

All SST39VF1682-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1682-70-4C-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF1682-70-4C-B3KE part is unused and in its original packaging.

Return procedure for SST39VF1682-70-4C-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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