Microchip Technology SST39VF1682-70-4I-B3KE
- Part No.:
- SST39VF1682-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1682-70-4I-B3KE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:143
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Product details
Overview
SST39VF1682-70-4I-B3KE from Microchip Technology is a 16 Mbit (2M × 8) Multi-Purpose Flash Plus (MPF+) memory IC designed for nonvolatile program, configuration, and data storage in embedded systems. It operates from a single 2.7–3.6 V supply, delivers 70 ns read access time, supports hardware top-block protection (64 KB), and uses SuperFlash® technology for 100,000 program/erase cycles and >100 years data retention. It is commonly used in industrial controllers and firmware-updatable communication modules.
For engineers reviewing the SST39VF1682-70-4I-B3KE datasheet, SST39VF1682-70-4I-B3KE pinout, SST39VF1682-70-4I-B3KE application, or SST39VF1682-70-4I-B3KE equivalent, this page provides verified technical context, JEDEC-compliant x8 interface details, block/sector erase timing, Auto Low Power mode behavior, and real-world design implications for boot code storage and field firmware updates.
Technical Context
The SST39VF1682-70-4I-B3KE implements a JEDEC-standard x8 asynchronous flash interface with latched address/data and CMOS I/O compatibility. Its SuperFlash® split-gate cell architecture enables fixed 7 µs byte-program and uniform 18 ms sector/block-erase times-performance independent of accumulated write cycles.
It features dual write-detection methods (DQ7 Data# Polling and DQ6/DQ2 Toggle Bits), hardware reset (RST#), write protect (WP#) for top 64 KB boot block, and CFI query support. The device enters Auto Low Power mode after valid reads, reducing active current from 9 mA to 3 µA without access penalty.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (2,097,152 × 8 bits); supports full firmware image or boot loader storage in space-constrained designs. |
| Read Access Time | 70 ns max; enables direct execution (XIP) from flash in microcontroller-based systems without wait states at moderate clock speeds. |
| Supply Voltage | 2.7–3.6 V single supply; compatible with 3.3 V logic domains and eliminates need for separate VPP programming voltage. |
| Endurance | 100,000 program/erase cycles (typical); sufficient for frequent field firmware updates over product lifetime. |
| Data Retention | >100 years; ensures long-term reliability in unpowered storage for industrial and automotive applications. |
| Erase Granularity | Uniform 4 KB sectors and 64 KB blocks; allows precise firmware patching without erasing entire device. |
| Power Consumption | 9 mA active (5 MHz), 3 µA standby/auto-low-power; reduces system-level power budget in always-on edge devices. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm, B3K footprint). Pin assignments conform to JEDEC standard x8 flash pinout. WP# enables hardware protection of top 64 KB boot block; RST# provides synchronous hardware reset to Read mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus; A20 is most significant bit (AMS); selects sector (A12–A20) or block (A16–A20) during erase. |
| DQ0–DQ7 | Data I/O | 8-bit bidirectional data bus; tri-stated when CE# or OE# high; supports latched read/write with status polling on DQ6/DQ7. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write; controls address/data latch timing with WE#. |
| OE# | Output Enable | Active-low output gate; determines data validity on DQ bus during read; high disables outputs. |
| WE# | Write Enable | Active-low control for program/erase command sequencing; rising edge latches data; falling edge latches address. |
| WP# | Write Protect | Active-low hardware lock for top 64 KB boot block (1F0000H–1FFFFFH); prevents accidental firmware corruption. |
| RST# | Reset | Active-low hardware reset; terminates in-progress operations and forces return to Read mode within TRP. |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; decoupling required per JEDEC guidelines to maintain signal integrity during fast transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows reading or programming other sectors during active erase-critical for real-time systems requiring background firmware updates. |
| Security ID Space | 256-bit user-programmable ID (128-bit factory + 128-bit user); enables secure device authentication and firmware binding. |
| Auto Low Power Mode | Automatically reduces active current to 3 µA after valid read; eliminates need for software-controlled power-down sequences. |
| JEDEC-Compliant Command Set | Supports standard CFI query, software ID entry, and industry-standard erase/program commands-ensures driver compatibility across toolchains. |
| Hardware Block Protection | Top 64 KB boot block protected via WP# pin; prevents overwrite of bootloader during application firmware updates. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware and I/O mapping tables in programmable logic controllers operating in harsh environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with guaranteed 100-year retention and 100k-cycle endurance for field upgrades. Use Value: Eliminates need for external EEPROM or battery-backed SRAM; top-block protection prevents bootloader corruption during remote firmware patches. |
Use Scenario: Holding calibrated sensor offsets, patient-specific therapy parameters, and regulatory compliance logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, low-power configuration memory supporting infrequent writes and long-term data integrity. Use Value: Security ID feature enables tamper-evident parameter binding; Auto Low Power mode extends battery life in handheld units. |
| Telecom Baseband Modem Boot ROM | Automotive Infotainment System Flash |
Use Scenario: Hosting boot code and DSP firmware for LTE/Wi-Fi baseband processors requiring fast 70 ns read access and robust ESD immunity. IC Role / Device Role / Timing Role: XIP-capable boot memory with deterministic 7 µs byte-program and 18 ms sector-erase for rapid recovery. Use Value: Fixed erase times (no degradation over cycles) simplify bootloader timing margins; TFBGA package supports high-density RF module layouts. |
Use Scenario: Storing navigation map data, UI assets, and OTA update partitions in automotive head units operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade flash with extended temperature rating and hardware write protection for safety-critical boot regions. Use Value: Top-block protection isolates boot partition from application updates; >100-year retention meets automotive lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV160CBTI-70G | 16 Mbit x16 interface; 70 ns access; requires 3.0–3.6 V; no Auto Low Power mode; bottom-boot configuration only. | Requires x16 data bus routing; lacks suspend/resume and security ID; not pin-compatible due to different pinout and bus width. | Select only if x16 interface and bottom-boot protection align with existing PCB layout and firmware driver stack. |
| S29AL016J70TFI020 | 16 Mbit x8; 70 ns access; 2.7–3.6 V; supports CFI but no Security ID; top/bottom boot selectable via strapping pins. | No hardware erase-suspend; higher typical active current (12 mA); lacks Auto Low Power mode and RST# pin. | Prefer when CFI compatibility is critical and lower standby power is not required; verify RST# dependency in host reset sequence. |
Compared with MX29LV160CBTI-70G and S29AL016J70TFI020, the SST39VF1682-70-4I-B3KE uniquely combines top-boot hardware protection, erase-suspend capability, Security ID, and Auto Low Power mode-making it optimal for secure, low-power, field-upgradable embedded systems where boot integrity and energy efficiency are design priorities.
Availability
SST39VF1682-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostics, telecom modems, and automotive infotainment systems requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for SST39VF1682-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and now manufactures and supports the SST39VF1682-70-4I-B3KE as part of its broad legacy flash portfolio.
This device belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered specifically for cost-sensitive, low-power embedded applications requiring reliable firmware and configuration storage with enhanced security and field-update flexibility.
FAQ
What is the difference between SST39VF1682-70-4I-B3KE and SST39VF1681?
The SST39VF1682-70-4I-B3KE implements top-block hardware protection (protecting addresses 1F0000H–1FFFFFH), while the SST39VF1681 protects the bottom 64 KB (000000H–00FFFFH). Both share identical density, timing, and command sets-but the WP# pin behavior and protected region differ. SST39VF1682-70-4I-B3KE is selected when bootloader resides in upper memory and must be safeguarded against accidental overwrite during application updates.
Does SST39VF1682-70-4I-B3KE require an external VPP voltage for programming?
No. The SST39VF1682-70-4I-B3KE generates internal VPP for program and erase operations using its 2.7–3.6 V VDD supply-eliminating the need for external high-voltage circuitry. This simplifies board design and improves reliability compared to older flash technologies requiring dedicated VPP pins.
How does the Auto Low Power mode function in SST39VF1682-70-4I-B3KE?
The SST39VF1682-70-4I-B3KE automatically enters Auto Low Power mode after a valid read cycle completes, reducing active current from 9 mA to 3 µA. It exits instantly on any address or control signal transition-no timing penalty or software intervention required. This behavior is inherent to the SST39VF1682-70-4I-B3KE silicon and requires no configuration.
Can SST39VF1682-70-4I-B3KE be used in place of SST39VF1682-70-4C-B3KE?
Yes-the SST39VF1682-70-4I-B3KE is the industrial-grade version (–40°C to +85°C), while SST39VF1682-70-4C-B3KE is commercial grade (0°C to +70°C). All electrical specifications, pinout, and timing are identical except for temperature range. SST39VF1682-70-4I-B3KE is a drop-in replacement in industrial environments where extended thermal operation is required.
What is the purpose of the Security ID feature in SST39VF1682-70-4I-B3KE?
The SST39VF1682-70-4I-B3KE includes a 256-bit Security ID space: 128 bits pre-programmed by SST (factory ID) and 128 bits user-programmable. It enables cryptographic binding of firmware to hardware, anti-cloning, and secure boot verification. Once locked via User Sec ID Program Lock-Out command, the user segment becomes immutable-ensuring persistent device identity in SST39VF1682-70-4I-B3KE deployments.
SST39VF1682-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF1682-70-4I-B3KE FAQ
1.How can I place an order for SST39VF1682-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1682-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1682-70-4I-B3KE reliable?
The price and inventory of SST39VF1682-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1682-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF1682-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1682-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1682-70-4I-B3KE?
SST39VF1682-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1682-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1682-70-4I-B3KE?
For technical support, including SST39VF1682-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1682-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39VF1682-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF1682-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1682-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF1682-70-4I-B3KE?
All SST39VF1682-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1682-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1682-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39VF1682-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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