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Microchip Technology SST39VF200A-70-4C-B3KE
- Part No.:
- SST39VF200A-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF200A-70-4C-B3KE.pdf
- Description:
- IC FLASH 2MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,219
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Product details
Overview
SST39VF200A-70-4C-B3KE from Microchip Technology is a 2 Mbit (128K × 16) CMOS Multi-Purpose Flash memory IC with single-supply 2.7–3.6V operation, 70 ns read access time, JEDEC-standard x16 asynchronous interface, and SuperFlash® split-gate technology for embedded firmware storage in industrial controllers and communication modules.
For engineers reviewing the SST39VF200A-70-4C-B3KE datasheet, SST39VF200A-70-4C-B3KE pinout, SST39VF200A-70-4C-B3KE application, or SST39VF200A-70-4C-B3KE equivalent, key selection criteria include voltage range compatibility (2.7–3.6V), TSOP-48 package footprint, sector/block erase architecture, toggle-bit/data# polling status detection, and software data protection compliance.
Technical Context
The SST39VF200A-70-4C-B3KE implements an x16 asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting Word-Program, Sector-Erase (2 KWord), Block-Erase (32 KWord), and Chip-Erase operations via JEDEC-standard command sequences. It uses SST's proprietary SuperFlash technology with split-gate cells and thick-oxide tunneling injectors.
It features hardware write inhibition during power-up/down, noise/glitch immunity (<5 ns pulses ignored), and dual software status detection (DQ6 Toggle Bit and DQ7 Data# Polling) for reliable end-of-write verification. The device supports CFI Query mode and Software Product ID for system-level identification and configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Mbit (128K × 16), enabling storage of boot code or configuration data for mid-complexity microcontrollers |
| Read Access Time | 70 ns - determines maximum bus clock rate for zero-wait-state reads in 8/16-bit host systems |
| Supply Voltage Range | 2.7–3.6V - supports wide-input industrial power rails without external regulators |
| Erase Endurance | 100,000 cycles - ensures long-term field reliability for firmware update applications |
| Data Retention | Greater than 100 years - guarantees nonvolatile data integrity across product lifecycle |
| Word-Program Time | 14 µs typical - enables fast in-system programming without excessive host CPU overhead |
| Package Type | 48-lead TSOP (12 mm × 20 mm) - standard surface-mount footprint compatible with legacy PCB layouts |
Pinout & Package
48-lead TSOP (12 mm × 20 mm), standard JEDEC-compliant x16 parallel flash package with exposed pad not present; RoHS-compliant, lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | A0–A15 select 128K words; A16 is most-significant address (AMS) for sector/block addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read cycles only |
| WE# | Write Enable | Active-low control for program/erase command latching and timing initiation |
| VDD | Power Supply | 2.7–3.6V core supply; internal VPP generation eliminates need for external high-voltage source |
| VSS | Ground | Two dedicated ground pins (pins 23 and 47) for noise reduction and signal integrity |
| NC | No Connect | Pins 9, 10, 12–15, 18, 19, 21, 22, 24, 25, 26, 27, 29, 30, 32, 33, 35, 36, 37, 39, 40, 42, 43, 45, 46 - must remain unconnected per design |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell + thick-oxide injector delivers fixed 14 µs program and 18 ms erase times - no performance degradation over lifetime |
| Uniform Erase Architecture | 64 independent 2 KWord sectors + 4 uniform 32 KWord blocks - enables granular firmware updates without full-chip erasure |
| JEDEC-Compliant Command Set | Fully compatible with industry-standard x16 flash command protocols - simplifies migration from other vendors' parts |
| Hardware + Software Data Protection | Glitch filtering, VDD monitoring, and mandatory 3-byte/6-byte unlock sequences prevent accidental writes during power transitions |
| CFI & Software ID Support | Standard CFI query mode and manufacturer/device ID (00BFH/2789H) enable automatic system-level part identification and configuration |
Applications
| Industrial PLC Firmware Storage | Telecom Line Card Configuration |
|---|---|
Use Scenario: Storing firmware images and parameter tables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with 70 ns read access enabling deterministic boot timing and real-time task loading. Use Value: 100,000 erase cycles and >100-year retention ensure multi-decade deployment without field replacement. | Use Scenario: Holding configuration profiles and calibration data for modular telecom line cards requiring hot-swap capability. IC Role / Device Role / Timing Role: Parallel x16 interface provides low-latency access to configuration registers during card initialization. Use Value: Sector-erase capability allows selective reprogramming of individual line card settings without disrupting adjacent functions. |
| Medical Diagnostic Equipment Boot Memory | Automotive Body Control Module (BCM) |
Use Scenario: Secure boot image storage in FDA-cleared diagnostic imaging systems requiring validated firmware integrity. IC Role / Device Role / Timing Role: Primary boot ROM accessed at power-on reset; supports software ID and CFI for automated BOM verification. Use Value: Dual status detection (DQ6/DQ7) ensures robust write completion confirmation critical for safety-critical updates. | Use Scenario: Storing vehicle-specific calibration maps and feature-enable bits in automotive BCMs operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade temperature rating (-40°C to +85°C) and 2.7–3.6V operation match automotive battery voltage transients. Use Value: Hardware write inhibit prevents corruption during cold cranking or load dump events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV200CTTI-70G | 2 Mbit x16, 70 ns, 2.7–3.6V, but uses different command set and lacks CFI support | Requires modified driver firmware; no automatic identification capability | Choose if existing design already uses Macronix command protocol and CFI is unnecessary |
| EN29LV200T-70IP | 2 Mbit x16, 70 ns, 2.7–3.6V, supports JEDEC commands but has slower 25 µs program time and 25,000-cycle endurance | Lower endurance limits field upgrade frequency; higher active current (12 mA vs. 9 mA) | Acceptable for low-update-frequency applications where cost is primary constraint |
Compared with MX29LV200CTTI-70G and EN29LV200T-70IP, the SST39VF200A-70-4C-B3KE offers superior endurance (100k vs. ≤25k cycles), faster program time (14 µs vs. ≥25 µs), and integrated CFI/ID support-making it optimal for systems requiring field firmware updates, automated BOM validation, and long service life.
Availability
SST39VF200A-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical diagnostic equipment, and automotive body control modules requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.
Supply support for SST39VF200A-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with acquisition of Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF200A-70-4C-B3KE belongs to the SST39VF family of Multi-Purpose Flash devices designed specifically for cost-sensitive, industrial-grade embedded systems requiring reliable in-system programmability, wide voltage operation, and JEDEC interoperability.
FAQ
What is the exact memory organization of the SST39VF200A-70-4C-B3KE?
The SST39VF200A-70-4C-B3KE is organized as 128K words × 16 bits (2 Mbit total). Its address space spans A0–A16, with A16 serving as the most-significant address (AMS) for sector and block selection. This configuration supports direct interfacing with 16-bit microprocessor buses without address translation logic.
Does the SST39VF200A-70-4C-B3KE require an external VPP voltage for programming?
No, the SST39VF200A-70-4C-B3KE does not require an external VPP voltage. It integrates internal charge pump circuitry to generate the high voltage needed for program and erase operations from the single 2.7–3.6V VDD supply - eliminating external high-voltage components and simplifying board design.
How is write completion detected on the SST39VF200A-70-4C-B3KE?
Write completion on the SST39VF200A-70-4C-B3KE is detected using two software methods: Data# Polling (DQ7 toggles until operation completes, then returns true data) and Toggle Bit (DQ6 alternates between 0 and 1 during operation, then stabilizes). Both are valid after the fourth (program) or sixth (erase) WE# pulse rising edge.
What package type is used for the SST39VF200A-70-4C-B3KE?
The SST39VF200A-70-4C-B3KE is supplied in a 48-lead TSOP (Thin Small Outline Package) measuring 12 mm × 20 mm, with standard JEDEC pinout for x16 flash memories. This package is RoHS-compliant, lead-free, and compatible with standard reflow soldering profiles up to 260°C for 10 seconds.
Is the SST39VF200A-70-4C-B3KE suitable for industrial temperature applications?
Yes, the SST39VF200A-70-4C-B3KE is rated for industrial temperature operation from -40°C to +85°C under 2.7–3.6V supply conditions. This makes it suitable for deployment in industrial automation, outdoor telecom infrastructure, and automotive body electronics where extended thermal range is required.
SST39VF200A-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF200A-70-4C-B3KE FAQ
1.How can I place an order for SST39VF200A-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF200A-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF200A-70-4C-B3KE reliable?
The price and inventory of SST39VF200A-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF200A-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF200A-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF200A-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF200A-70-4C-B3KE?
SST39VF200A-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF200A-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF200A-70-4C-B3KE?
For technical support, including SST39VF200A-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF200A-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39VF200A-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF200A-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF200A-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF200A-70-4C-B3KE?
All SST39VF200A-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF200A-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF200A-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39VF200A-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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