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Microchip Technology SST39VF3201-70-4I-B3KE
- Part No.:
- SST39VF3201-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF3201-70-4I-B3KE.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,819
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Product details
Overview
SST39VF3201-70-4I-B3KE from Microchip Technology is a 32 Mbit (2M × 16) CMOS Multi-Purpose Flash Plus memory IC with JEDEC-standard x16 asynchronous interface, 70 ns read access time, single 2.7–3.6 V supply operation, and bottom-block hardware write protection for industrial embedded firmware storage in microcontroller-based systems.
For engineers reviewing the SST39VF3201-70-4I-B3KE datasheet, SST39VF3201-70-4I-B3KE pinout, SST39VF3201-70-4I-B3KE application, or SST39VF3201-70-4I-B3KE equivalent, key selection considerations include its 2M×16 organization, 70 ns read timing, TFBGA-48 (B3K) package, bottom 32 KWord hardware block protection, and SuperFlash® technology enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of wear.
Technical Context
The SST39VF3201-70-4I-B3KE implements SST's proprietary SuperFlash® split-gate cell architecture with thick-oxide tunneling injector, delivering guaranteed 100,000 program/erase cycles and >100 years data retention. It supports JEDEC-standard command sets including Software Data Protection (SDP), CFI query, and Security ID with factory- and user-programmable 128-bit segments.
Operation modes include standard Read (CE# & OE# low), Word-Program (7 µs typical), Sector-Erase (2 KWord uniform), Block-Erase (32 KWord uniform), Chip-Erase (40 ms typical), and Erase-Suspend/Resume. Status detection uses DQ7 Data# Polling and DQ6/DQ2 Toggle Bits, with Auto Low Power mode reducing active read current to 3 µA after valid access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2M × 16 organization), supporting 4 MB addressable space |
| Read Access Time | 70 ns - enables direct execution from flash (XIP) in 5 MHz bus systems without wait states |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic systems and tolerant of brown-out conditions |
| Endurance | 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years in industrial control |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications |
| Word-Program Time | 7 µs typical - fixed duration independent of cycle count due to SuperFlash® architecture |
| Sector-Erase Time | 18 ms typical - uniform timing across all 512 sectors (2 KWord each) |
| Block-Erase Time | 18 ms typical - uniform timing across all 32 blocks (32 KWord each) |
Pinout & Package
Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), 6 mm × 8 mm, B3K footprint (JEDEC MO-245AC), RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | A0–A19 used for 2M×16 addressing; A20 selects top/bottom boot block in CFI/ID modes |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; latched internally during writes; tri-state when CE# or OE# high |
| CE# | Chip Enable | Active-low device select; must be low for all non-read operations (program/erase) |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read; high = high-impedance |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Write Protect | Active-low hardware lock for bottom 32 KWord block (000000H–007FFFH); floating = unprotected |
| RST# | Hardware Reset | Active-low hard reset; terminates in-progress operations and forces return to read mode |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; internal regulation eliminates need for external VPP |
| VSS | Ground | Two dedicated ground balls (pins E1, H1) for noise reduction in high-speed read cycles |
| NC | No Connect | Three unconnected balls (A1, C1, G1) - must remain unconnected per design |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed erase/program times and 100k-cycle endurance without de-rating |
| Bottom Block Protection | Hardware lock on bottom 32 KWord (000000H–007FFFH) prevents accidental overwrite of boot code |
| Erase-Suspend/Resume | Pause active sector/block erase to read or program other locations - critical for real-time firmware update safety |
| Security ID | 256-bit space: 128-bit factory-programmed ID + 128-bit user-programmable ID, both permanently non-erasable |
| CFI Compliance | Full Common Flash Interface support enables automatic driver detection and configuration in BIOS/bootloader environments |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid access - cuts standby power in always-on edge devices |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code Retention |
|---|---|
Use Scenario: Storing boot loader and application firmware in programmable logic controllers operating in harsh temperature and vibration environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into MCU address space; executes XIP with 70 ns read latency. Use Value: Bottom-block protection prevents corruption of startup code during field firmware updates; 100-year retention ensures lifetime data integrity without battery backup. |
Use Scenario: Holding certified diagnostic firmware and calibration tables in portable ultrasound and infusion pump systems requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for FDA-compliant software binaries; accessed via 16-bit parallel bus during cold start. Use Value: Factory-programmed 128-bit Security ID enables cryptographic binding of firmware to hardware; CFI support simplifies bootloader compatibility across product generations. |
| Automotive Body Control Module | Networking Equipment Configuration |
Use Scenario: Storing vehicle-specific configuration parameters and CAN protocol stacks in body control units exposed to automotive temperature cycling (-40°C to +105°C). IC Role / Device Role / Timing Role: EEPROM-replacement flash memory interfaced to 8/16-bit MCUs; operates at full speed across extended voltage range (2.7–3.6 V). Use Value: Single-supply operation eliminates level-shifting; 100k-cycle endurance supports repeated reprogramming during dealer diagnostics and recalls. |
Use Scenario: Storing switch/router configuration profiles, MAC address tables, and failover images in enterprise Ethernet switches with hot-swap capability. IC Role / Device Role / Timing Role: Dual-purpose storage for both runtime configuration and firmware recovery image; accessed via parallel bus during boot and runtime. Use Value: Erase-suspend allows background configuration save while maintaining packet forwarding; sector-erase enables atomic profile updates without service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF3201B-70-4I-B3KE | Same 32 Mbit density, 70 ns timing, and B3K TFBGA package; updated revision with enhanced ESD robustness and tighter AC parameter tolerances | Preferred for new designs requiring latest qualification; identical pinout and command set | Select when long-term supply continuity and latest AEC-Q100 stress test compliance are required |
| MX29LV320ETTI-70G | 32 Mbit x16, 70 ns, TSOP-48 package; lacks Security ID, CFI, and Erase-Suspend; uses traditional floating-gate architecture | Lower-cost option for cost-sensitive consumer electronics where security and suspend features are unnecessary | Choose only if TSOP-48 footprint is mandated and SuperFlash® advantages (fixed timing, endurance) are not design-critical |
Compared with SST39VF3201-70-4I-B3KE, the SST39VF3201B-70-4I-B3KE offers improved manufacturing consistency and lifecycle support, while the MX29LV320ETTI-70G trades advanced features for lower unit cost and legacy package compatibility - neither is pin-compatible with the B3K TFBGA footprint of the original.
Availability
SST39VF3201-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial control, medical diagnostics, automotive body electronics, and networking equipment requiring stable component supply and long-term obsolescence management.
Supply support for SST39VF3201-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now manufactures, qualifies, and supports the SST39VF family as part of its broad portfolio of nonvolatile memory solutions.
The SST39VF3201-70-4I-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for embedded systems requiring reliable, low-voltage, high-endurance parallel flash memory with integrated security and flexible erase granularity.
FAQ
What is the memory organization and total capacity of the SST39VF3201-70-4I-B3KE?
The SST39VF3201-70-4I-B3KE is organized as 2M × 16 bits, delivering a total capacity of 32 Mbit (4 MB). This configuration supports 16-bit wide data buses and maps directly to 22-bit address space (A0–A20), with A20 used for boot block selection and CFI commands. Its density and x16 interface make it suitable for microcontrollers with parallel memory interfaces requiring fast, reliable firmware storage.
Does the SST39VF3201-70-4I-B3KE support hardware write protection, and how is it implemented?
Yes, the SST39VF3201-70-4I-B3KE implements bottom-block hardware write protection via the WP# pin. When WP# is driven low, programming and erasing of the bottom 32 KWord block (addresses 000000H–007FFFH) is disabled - protecting boot code from accidental overwrite. If WP# is left floating, an internal pull-up holds it high, leaving the block unprotected. This feature is confirmed in Table 3 and Section 9 of the DS25028A datasheet.
What package type and footprint does the SST39VF3201-70-4I-B3KE use?
The SST39VF3201-70-4I-B3KE uses a 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package with B3K footprint (6 mm × 8 mm, JEDEC MO-245AC). Pin assignments match Figure 3 in DS25028A, including dedicated VSS balls at E1 and H1, and three NC balls (A1, C1, G1). This package enables high-density PCB layouts and superior thermal performance compared to TSOP alternatives.
How does the SST39VF3201-70-4I-B3KE indicate completion of program or erase operations?
The SST39VF3201-70-4I-B3KE provides two status detection methods: Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2). During program, DQ7 returns complemented data until completion, then true data; during erase, DQ7 reads '0' then '1'. DQ6 toggles during operation and stops when complete. These mechanisms eliminate need for fixed delay loops and enable efficient polling in host firmware - fully documented in Tables 2 and 7 of DS25028A.
Is the SST39VF3201-70-4I-B3KE still recommended for new designs, and what is the suggested replacement?
No - the SST39VF3201-70-4I-B3KE is marked "Not Recommended for New Designs" in DS25028A (Rev. 08/11). Microchip recommends SST39VF3201B-70-4I-B3KE as the direct replacement: same density, timing, package, and command set, with enhanced ESD robustness and tighter AC specifications. Both share identical pinout and software compatibility, ensuring seamless migration for existing designs requiring long-term supply assurance.
SST39VF3201-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF3201-70-4I-B3KE FAQ
1.How can I place an order for SST39VF3201-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF3201-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF3201-70-4I-B3KE reliable?
The price and inventory of SST39VF3201-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3201-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF3201-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3201-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF3201-70-4I-B3KE?
SST39VF3201-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF3201-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF3201-70-4I-B3KE?
For technical support, including SST39VF3201-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3201-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39VF3201-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF3201-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3201-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF3201-70-4I-B3KE?
All SST39VF3201-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3201-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF3201-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39VF3201-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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