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Microchip Technology SST39VF3201C-70-4I-B3KE-T-VAO

Part No.:
SST39VF3201C-70-4I-B3KE-T-VAO
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39VF3201C-70-4I-B3KE-T-VAO.pdf
Description:
IC FLASH 32MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,229

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Product details

Overview

SST39VF3201C-70-4I-B3KE-T-VAO from Microchip Technology is a 32-Mbit (2M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with bottom-block hardware write protection, 70 ns read access time, and single 2.7V–3.6V supply operation. It features uniform 2 KWord sector erase, flexible block architecture (eight 4-KWord + sixty-three 32-KWord blocks), and integrated RY/BY# status pin for system-level timing control in embedded boot code storage.

For engineers reviewing the SST39VF3201C-70-4I-B3KE-T-VAO datasheet, SST39VF3201C-70-4I-B3KE-T-VAO pinout, SST39VF3201C-70-4I-B3KE-T-VAO application, or SST39VF3201C-70-4I-B3KE-T-VAO equivalent, key selection considerations include bottom-boot block address range (000000H–001FFFH), WP#-enabled hardware protection of bottom two 4-KWord blocks, JEDEC-standard x16 pinout compatibility, and SuperFlash® technology's fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count.

Technical Context

This device implements Microchip's proprietary SuperFlash® split-gate cell architecture with thick-oxide tunneling injector, delivering superior reliability (100,000 program/erase cycles, >100 years data retention) and consistent timing performance across lifetime. Its command-set-driven operation requires six-byte sequences for sector/block/chip erase and three-byte sequences for word program, all validated against JEDEC-standard x16 flash pin assignments.

Hardware data protection includes noise/glitch immunity (<5 ns pulse rejection), VDD power-up/down detection (<1.5 V inhibit), and dedicated WP# input that physically disables programming/erasing of the bottom two 4-KWord boot blocks when asserted low. The RY/BY# open-drain output provides real-time status feedback without requiring software polling overhead.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization2M × 16 (32 Mbit); supports x16 data bus interface with full JEDEC-compliant addressing
Read Access Time70 ns; enables direct execution (XIP) from flash in microcontroller boot loaders without wait states at 14 MHz bus clock
Supply Voltage2.7 V–3.6 V; compatible with modern low-voltage I/O domains and eliminates need for external voltage translators
Endurance & Retention100,000 cycles / >100 years; validated for firmware update cycles in industrial controllers and medical devices
Word-Program Time7 µs typical; fixed duration independent of accumulated erase/program cycles due to SuperFlash® cell physics
Sector-Erase Time18 ms typical; uniform 2 KWord sectors allow fine-grained firmware patching without full chip erase
Block-Erase ArchitectureEight 4-KWord + sixty-three 32-KWord blocks; bottom-boot protection applies to lowest two 4-KWord blocks (000000H–001FFFH)

Pinout & Package

Package: 48-lead TSOP (12 mm × 20 mm), RoHS compliant. Pinout conforms to JEDEC standard for x16 parallel flash memories.

Pin/TerminalCircuit RoleDesign Meaning
A0–A20Address InputsAMS = A20; A11–A0 select sector during Sector-Erase; A15–A0 select block during Block-Erase
DQ0–DQ15Data I/OBi-directional x16 bus; outputs latched during Read; inputs latched on rising edge of WE#/CE#
WE#, CE#, OE#Control InputsStandard asynchronous SRAM-like interface: CE# enables chip, OE# gates output, WE# controls write direction
WP#Write-Protect InputActive-low hardware lock for bottom two 4-KWord boot blocks (000000H–001FFFH); floating = internally pulled high
RST#Hardware ResetForces immediate return to Read mode; required TRP low pulse to abort ongoing Program/Erase
RY/BY#Status OutputOpen-drain Ready/Busy indicator; requires external 10 kΩ–100 kΩ pull-up; low = active operation in progress
VDD, VSSPower/GroundSingle 2.7–3.6 V supply; no separate I/O voltage required
NCNo ConnectionUnbonded pins per TSOP package layout; must remain unconnected

Key Features

FeatureDesign Value
Bottom Block ProtectionHardware-enforced write/erase disable for lowest 8 KWords (000000H–001FFFH), critical for secure bootloader storage
Erase-Suspend/ResumeAllows temporary halt of sector/block erase to read or program other locations-enables real-time firmware updates without system freeze
Security ID Space128-bit factory-programmed + 128-word user-programmable ID space; locked after programming to prevent tampering
Auto Low-Power ModeReduces active read current from 6 mA to 4 µA after valid read access-cuts standby power in always-on embedded systems
CFI Query SupportStandard Common Flash Interface allows runtime identification of device geometry, timing, and command set without hard-coded assumptions

Applications

Industrial PLC Firmware StorageMedical Device Bootloader Memory

Use Scenario: Storing field-upgradable ladder logic and configuration parameters in programmable logic controllers operating in harsh EMI environments.

IC Role / Device Role / Timing Role: Nonvolatile boot code and parameter storage with hardware-protected bottom blocks preventing accidental overwrite of safety-critical startup routines.

Use Value: Bottom-block WP# ensures bootloader integrity; 70 ns access enables deterministic boot timing; 100K-cycle endurance supports decades of firmware revisions.

Use Scenario: Holding certified bootloader and regulatory-compliant firmware images in Class II medical imaging equipment requiring traceable firmware lineage.

IC Role / Device Role / Timing Role: Secure, long-retention storage for FDA-validated boot code with hardware write protection and Security ID for device authentication.

Use Value: Factory-programmed 128-bit Security ID enables cryptographic binding; bottom-boot protection prevents unauthorized modification; >100-year retention meets medical device lifecycle requirements.

Automotive Infotainment Head UnitNetworking Equipment Configuration Storage

Use Scenario: Storing UI firmware, voice recognition models, and vehicle-specific calibration data in automotive infotainment systems subject to wide temperature (-40°C to +85°C) and vibration stress.

IC Role / Device Role / Timing Role: High-reliability flash memory supporting AEC-Q100 Grade 3 qualification with robust erase-suspend capability for seamless over-the-air updates.

Use Value: SuperFlash® technology delivers stable 7 µs program time across temperature; erase-suspend allows concurrent UI rendering and firmware patching.

Use Scenario: Retaining switch/router configuration tables, MAC address tables, and security certificates in enterprise networking gear requiring zero-downtime reconfiguration.

IC Role / Device Role / Timing Role: JEDEC-standard x16 parallel interface flash used for fast, deterministic access to configuration metadata during cold boot and hot failover.

Use Value: 70 ns read access minimizes boot delay; sector-erase granularity enables atomic config updates; RY/BY# pin synchronizes host CPU with flash state transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SST39VF3202C-70-4I-B3KETop-boot block protection (1FE000H–1FFFFFH) instead of bottom-boot; identical timing, voltage, and command setUsed where protected boot code resides in highest-address memory region, e.g., legacy BIOS implementationsSelect SST39VF3202C-70-4I-B3KE only if top-boot architecture matches system memory map and bootloader placement
MX29LV320ETTI-70G32 Mbit x16, 70 ns, 2.7–3.6 V; lacks Security ID and CFI query; uses different command sequence for erase operationsLower-cost alternative where cryptographic ID and runtime flash interrogation are not requiredChoose MX29LV320ETTI-70G for cost-sensitive designs without security or dynamic configuration needs, but verify command compatibility in firmware

Compared with SST39VF3202C-70-4I-B3KE, the SST39VF3201C-70-4I-B3KE-T-VAO provides bottom-boot protection essential for new bootloader deployments, while MX29LV320ETTI-70G offers reduced BOM cost at the expense of security features and standardized query capability-making it suitable only for static, non-updatable firmware roles.

Availability

SST39VF3201C-70-4I-B3KE-T-VAO is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader memory, automotive infotainment head units, and networking equipment configuration storage requiring stable component supply across extended product lifecycles.

Supply support for SST39VF3201C-70-4I-B3KE-T-VAO includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, serving industrial, automotive, and communications markets with vertically integrated silicon and software platforms.

The SST39VF3201C belongs to Microchip's Multi-Purpose Flash Plus (MPF+) family, designed specifically for reliable, low-power, field-upgradable firmware and configuration storage in resource-constrained embedded systems requiring deterministic timing and long-term data integrity.

FAQ

What is the boot block protection scheme implemented in the SST39VF3201C-70-4I-B3KE-T-VAO?

The SST39VF3201C-70-4I-B3KE-T-VAO implements bottom-block hardware write protection: when WP# is low, the bottom two 4-KWord blocks (000000H–001FFFH, total 8 KWords) are permanently locked against Program and Erase operations. This ensures bootloader code stored in the lowest memory region remains immune to accidental corruption. Floating WP# defaults to high via internal pull-up, enabling full device access.

How does the SST39VF3201C-70-4I-B3KE-T-VAO indicate completion of a Program or Erase operation?

The SST39VF3201C-70-4I-B3KE-T-VAO provides three concurrent status mechanisms: Data# Polling (DQ7 toggles until completion, then returns true data), Toggle Bit (DQ6 toggles during operation, stops when complete), and RY/BY# (open-drain pin pulled low during active operation). RY/BY# requires an external 10–100 kΩ pull-up resistor and is valid immediately after the final WE# pulse in the command sequence.

Does the SST39VF3201C-70-4I-B3KE-T-VAO support simultaneous read and erase-suspend functionality?

Yes-the SST39VF3201C-70-4I-B3KE-T-VAO supports Erase-Suspend: issuing the B0H command halts an ongoing Sector- or Block-Erase, allowing reads from any non-suspended location or word-programming into unprotected sectors. DQ2 toggling indicates erase-suspended status, while DQ6 = '1' confirms suspended mode. Resume uses the 30H command. This enables real-time firmware updates without halting system operation.

What is the purpose and structure of the Security ID feature in the SST39VF3201C-70-4I-B3KE-T-VAO?

The SST39VF3201C-70-4I-B3KE-T-VAO includes a 136-word Security ID space: first 128 bits (16 words) are factory-programmed by Microchip and locked; remaining 128 words (000008H–000087H) are user-programmable. Programming uses the 88H/AAH/55H command sequence followed by A5H; locking uses 85H. Once locked, no further writes are possible-ensuring permanent device identity for authentication and anti-cloning in regulated systems.

Is the SST39VF3201C-70-4I-B3KE-T-VAO compatible with standard JEDEC x16 parallel flash interfaces?

Yes-the SST39VF3201C-70-4I-B3KE-T-VAO fully complies with JEDEC Standard JESD21-C for x16 flash pin assignments and command protocols. Its pinout (A0–A20, DQ0–DQ15, WE#/CE#/OE#, WP#, RST#, RY/BY#) matches industry-standard parallel NOR flash footprints, enabling drop-in replacement in existing designs using JEDEC-compliant controllers without hardware modification.

SST39VF3201C-70-4I-B3KE-T-VAO Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
32Mbit
Memory Organization:
2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (6x8)

SST39VF3201C-70-4I-B3KE-T-VAO FAQ

1.How can I place an order for SST39VF3201C-70-4I-B3KE-T-VAO through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF3201C-70-4I-B3KE-T-VAO on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF3201C-70-4I-B3KE-T-VAO reliable?

The price and inventory of SST39VF3201C-70-4I-B3KE-T-VAO are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3201C-70-4I-B3KE-T-VAO is usually 5 days.

3.What payment methods are accepted for SST39VF3201C-70-4I-B3KE-T-VAO?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3201C-70-4I-B3KE-T-VAO transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF3201C-70-4I-B3KE-T-VAO?

SST39VF3201C-70-4I-B3KE-T-VAO orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF3201C-70-4I-B3KE-T-VAO order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF3201C-70-4I-B3KE-T-VAO?

For technical support, including SST39VF3201C-70-4I-B3KE-T-VAO datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3201C-70-4I-B3KE-T-VAO requirements.

6.How does Aetrix verify that SST39VF3201C-70-4I-B3KE-T-VAO is sourced from the original manufacturer or authorized distributors?

All SST39VF3201C-70-4I-B3KE-T-VAO products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3201C-70-4I-B3KE-T-VAO meets industry standards.

7.What is the process for return or replacement of SST39VF3201C-70-4I-B3KE-T-VAO?

All SST39VF3201C-70-4I-B3KE-T-VAO units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3201C-70-4I-B3KE-T-VAO, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF3201C-70-4I-B3KE-T-VAO part is unused and in its original packaging.

Return procedure for SST39VF3201C-70-4I-B3KE-T-VAO:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39VF3201C-70-4I-B3KE-T-VAO Tags

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