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Microchip Technology SST39VF3202-70-4C-B3KE

Part No.:
SST39VF3202-70-4C-B3KE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39VF3202-70-4C-B3KE.pdf
Description:
IC FLASH 32MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,841

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Product details

Overview

SST39VF3202-70-4C-B3KE from Microchip Technology is a 32 Mbit (2M × 16) Multi-Purpose Flash Plus (MPF+) memory IC with CMOS SuperFlash technology, 70 ns read access time, single 2.7–3.6 V supply operation, and top-block hardware write protection. It supports sector/block/chip erase, erase-suspend/resume, and security ID programming for embedded firmware storage in industrial controllers and legacy communication modules.

For engineers reviewing the SST39VF3202-70-4C-B3KE datasheet, SST39VF3202-70-4C-B3KE pinout, SST39VF3202-70-4C-B3KE application, or SST39VF3202-70-4C-B3KE equivalent, this page delivers verified flash timing, JEDEC-compliant x16 interface behavior, top-boot block protection mapping, and real-world erase/program performance metrics - all confirmed against DS25028A Rev A.

Technical Context

The SST39VF3202-70-4C-B3KE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed 18 ms sector/block erase and 7 µs word-program times independent of cycle count. Its JEDEC-standard x16 asynchronous interface uses CE#, OE#, and WE# control lines with latched address/data buses and tri-state outputs.

Hardware block protection targets the top 32 KWord (1F8000H–1FFFFFH) via WP# pin grounding; RST# provides hardware reset to Read mode; and CFI query support (0x5555H + 0x98H) enables runtime device identification and geometry detection in bootloaders.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 Mbit (2M × 16), supporting 4 MB of firmware or configuration data storage
Read Access Time 70 ns - determines minimum bus cycle time for CPU or FPGA interface at full speed
Supply Voltage 2.7–3.6 V - compatible with 3.3 V systems without level-shifting; no VPP required
Erase/Program Endurance 100,000 cycles - supports field firmware updates over product lifetime
Data Retention >100 years - ensures long-term reliability in unpowered storage applications
Block Protection Top 32 KWord (1F8000H–1FFFFFH) - safeguards boot code from accidental overwrite
Package Type 48-ball TFBGA (6 mm × 8 mm) - surface-mount footprint for space-constrained PCBs

Pinout & Package

48-ball TFBGA package (B3K suffix), ball grid layout per DS25028A Figure 3, top view with balls facing down. Pin functions conform to JEDEC-standard x16 flash pinout.

Pin/Terminal Circuit Role Design Meaning
A0–A20 Address Inputs A0–A19 used for 2M×16 addressing; A20 selects upper half of 32 Mbit array (1F8000H–1FFFFFH)
DQ0–DQ15 Data I/O 16-bit bidirectional bus; latched during write; tri-state when CE# or OE# high
CE# Chip Enable Active-low chip select; must be low to enable read/write operations
OE# Output Enable Active-low output gate; controls data bus drive during read cycles only
WE# Write Enable Active-low control for program/erase command latching and internal timing initiation
WP# Write Protect Grounded to lock top 32 KWord boot block; floating = unprotected (internal pull-up)
RST# Reset Hardware reset input; forces return to Read mode within TRP (min 100 ns)
VDD / VSS Power / Ground Single 2.7–3.6 V supply; dual ground pins for noise reduction in high-speed reads

Key Features

Feature Design Value
Erase-Suspend/Resume Allows temporary read access during active sector/block erase - critical for real-time OS interrupt handling
Security ID Space 256-bit factory + user programmable ID (128+128 bits), locked after programming to prevent tampering
Auto Low Power Mode Reduces active read current from 9 mA to 3 µA after valid access - cuts standby power in always-on systems
Software Data Protection JEDEC-compliant 3-byte (program) or 6-byte (erase) command sequences prevent spurious writes during power transitions
CFI Query Support Enables automatic detection of device geometry, timing parameters, and command set via standardized 0x5555H + 0x98H entry

Applications

Industrial PLC Firmware Storage Legacy Telecom Baseband Module

Use Scenario: Storing field-upgradable firmware for programmable logic controllers operating in harsh temperature environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into CPU address space; 70 ns access enables tight timing margins with 14 MHz bus clocks.

Use Value: Top-block protection prevents corruption of boot loader during remote firmware update; 100,000-cycle endurance supports >10 years of scheduled upgrades.

Use Scenario: Holding DSP microcode and calibration tables in E1/T1 line interface cards requiring long-lifecycle component availability.

IC Role / Device Role / Timing Role: x16 asynchronous flash memory interfaced to TI C6000-series DSP via EMIF; CFI query enables runtime compatibility detection.

Use Value: Erase-suspend allows real-time status reads during background firmware validation; 4 MB capacity accommodates multi-version binary storage.

Medical Diagnostic Equipment Boot ROM Automotive Body Control Module

Use Scenario: Secure boot image storage in FDA-cleared imaging devices where firmware integrity verification is mandatory before system initialization.

IC Role / Device Role / Timing Role: Primary boot memory accessed during power-on reset sequence; RST# pin ensures deterministic recovery from brown-out events.

Use Value: Security ID space stores cryptographic keys and device-specific identifiers; >100-year data retention meets regulatory archival requirements.

Use Scenario: Configuration parameter storage in CAN-based body control units exposed to automotive-grade voltage transients and thermal cycling.

IC Role / Device Role / Timing Role: EEPROM-replacement flash with hardware WP# and noise/glitch protection on WE#/CE# inputs.

Use Value: 2.7–3.6 V operation tolerates battery voltage sag; 3 µA standby current extends sleep-mode battery life in key-off states.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF3201B Bottom-block protection (000000H–007FFFH); same density, timing, and package options Used where boot code resides in lowest memory region instead of top region Select when legacy design requires bottom-boot architecture and newer revision (B suffix) is preferred
MX29LV320ETTI-70G 32 Mbit x16, 70 ns, but uses different command set (no CFI query) and lacks erase-suspend capability Requires modified driver software; no real-time suspend/resume during erase Choose only if existing firmware already supports Macronix command protocol and suspend functionality is unused

Compared with SST39VF3202-70-4C-B3KE, SST39VF3201B offers identical performance with inverted block protection location, while MX29LV320ETTI-70G sacrifices CFI and erase-suspend for broader distributor availability - making SST39VF3202-70-4C-B3KE optimal for new designs needing top-boot security and real-time firmware management.

Availability

SST39VF3202-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial automation, telecom infrastructure, medical diagnostics, and automotive body electronics requiring stable component supply across extended product lifecycles.

Supply support for SST39VF3202-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now manufactures and supports the SST39VF family as part of its broad legacy flash portfolio.

The SST39VF3202-70-4C-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for cost-sensitive, high-reliability embedded systems needing fast, low-power, and secure nonvolatile storage without external VPP.

FAQ

What is the exact memory organization of the SST39VF3202-70-4C-B3KE?

The SST39VF3202-70-4C-B3KE is organized as 2M × 16 bits (32 Mbit total), with address range 000000H–1FFFFFH. It uses A0–A19 for standard addressing and A20 to access the upper half of the array. This matches the top-boot configuration specified in Table 3 of DS25028A for SST39VF3202 devices.

Does the SST39VF3202-70-4C-B3KE require an external VPP voltage for programming?

No, the SST39VF3202-70-4C-B3KE does not require external VPP. It generates internal high-voltage programming pulses using its on-chip charge pump, operating entirely from the 2.7–3.6 V VDD supply. This is confirmed in the "Automatic Write Timing" feature and Table 8 (VPP min/max = 0000H) of DS25028A.

How is hardware write protection implemented on the SST39VF3202-70-4C-B3KE?

Hardware write protection on the SST39VF3202-70-4C-B3KE is enabled by grounding the WP# pin, which locks the top 32 KWord block (1F8000H–1FFFFFH). When WP# is left floating, an internal pull-up holds it high, disabling protection. This behavior is explicitly defined in the "Hardware Block Protection" section and Table 3 of DS25028A.

What is the purpose of the RST# pin on the SST39VF3202-70-4C-B3KE?

The RST# pin on the SST39VF3202-70-4C-B3KE provides hardware-initiated reset to Read mode. Holding RST# low for ≥100 ns (TRP) terminates any ongoing program or erase operation and returns the device to ready state. After release, a minimum TRHR delay (≥100 ns) is required before valid reads resume - details are in the "Hardware Reset (RST#)" section of DS25028A.

Is the SST39VF3202-70-4C-B3KE still recommended for new designs?

No - the SST39VF3202-70-4C-B3KE is marked "Not Recommended for New Designs" in DS25028A. Microchip recommends migrating to SST39VF3201B for bottom-boot variants or evaluating newer serial NOR alternatives. However, SST39VF3202-70-4C-B3KE remains supported for existing designs and legacy replacements with full datasheet compliance.

SST39VF3202-70-4C-B3KE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
32Mbit
Memory Organization:
2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA

SST39VF3202-70-4C-B3KE FAQ

1.How can I place an order for SST39VF3202-70-4C-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF3202-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF3202-70-4C-B3KE reliable?

The price and inventory of SST39VF3202-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3202-70-4C-B3KE is usually 5 days.

3.What payment methods are accepted for SST39VF3202-70-4C-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3202-70-4C-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF3202-70-4C-B3KE?

SST39VF3202-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF3202-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF3202-70-4C-B3KE?

For technical support, including SST39VF3202-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3202-70-4C-B3KE requirements.

6.How does Aetrix verify that SST39VF3202-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39VF3202-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3202-70-4C-B3KE meets industry standards.

7.What is the process for return or replacement of SST39VF3202-70-4C-B3KE?

All SST39VF3202-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3202-70-4C-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF3202-70-4C-B3KE part is unused and in its original packaging.

Return procedure for SST39VF3202-70-4C-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39VF3202-70-4C-B3KE Tags

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