Microchip Technology SST39VF3202-70-4C-B3KE-T
- Part No.:
- SST39VF3202-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF3202-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SST39VF3202-70-4C-B3KE-T from Microchip Technology is a 32 Mbit (2M × 16) CMOS Multi-Purpose Flash Plus memory IC with x16 asynchronous parallel interface, 70 ns read access time, single 2.7–3.6 V supply operation, and top-block hardware write protection. It implements SuperFlash technology for high reliability in embedded firmware storage applications requiring field-upgradable code or configuration data.
For engineers reviewing the SST39VF3202-70-4C-B3KE-T datasheet, SST39VF3202-70-4C-B3KE-T pinout, SST39VF3202-70-4C-B3KE-T application, or SST39VF3202-70-4C-B3KE-T equivalent, key selection considerations include its 48-ball TFBGA (6 mm × 8 mm) package, JEDEC-standard x16 command set, sector/block/chip erase capabilities, Erase-Suspend/Resume support, and 100,000-cycle endurance with >100-year data retention.
Technical Context
The SST39VF3202-70-4C-B3KE-T uses SST's proprietary SuperFlash split-gate cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. Its control logic supports standard microprocessor bus timing with CE#, OE#, and WE# inputs, and includes dedicated RST# and WP# pins for hardware reset and top 32 KWord block protection.
It implements JEDEC-compliant command sequences-including three-byte Software Data Protection for programming and six-byte sequences for sector/block/chip erase-and provides dual status detection via DQ7 (Data# Polling) and DQ6/DQ2 (Toggle Bits). The device also supports CFI Query mode and factory/user Security ID space (128 + 128 bits).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2M × 16), organized as 2,097,152 words × 16 bits - supports full firmware image storage for mid-complexity embedded systems. |
| Read Access Time | 70 ns - enables direct execution from flash (XIP) in systems with ≤14 MHz bus clocks without wait states. |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic domains and tolerant of brown-out conditions down to 2.7 V. |
| Endurance & Retention | 100,000 program/erase cycles / >100 years data retention - validated for long-life industrial control and networking equipment. |
| Erase Architecture | Uniform 2 KWord sectors (1,024 total) and 32 KWord blocks (64 total) - allows granular firmware updates without full chip erase. |
| Write Protection | Hardware top-block protection (16 KB = 32 KWords at 1F8000H–1FFFFFH) via WP# pin - prevents accidental overwrite of boot code. |
| Power Consumption | 9 mA active current (5 MHz), 3 µA standby/auto-low-power - reduces system-level power budget in always-on edge devices. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm), ball pitch 0.8 mm, RoHS compliant. Pinout conforms to JEDEC standard x16 flash interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | A0–A19 used for 2M×16 addressing; A20 selects upper address space (SST39VF3202 only); AMS = A20 per JEDEC command protocol. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during write; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write operations; controls address/data latch timing. |
| OE# | Output Enable | Active-low output gate; enables data output only when CE# and OE# both low; supports shared bus arbitration. |
| WE# | Write Enable | Active-low write strobe; controls latching of data and initiation of internal program/erase cycles. |
| WP# | Write Protect | Active-low hardware lock for top 32 KWord block (1F8000H–1FFFFFH); grounded to prevent inadvertent erase/program. |
| RST# | Reset | Active-low hardware reset; terminates ongoing operations and forces return to read mode within TRP (min 100 ns). |
| VDD | Power Supply | 2.7–3.6 V core supply; internal charge pump generates VPP for erase/program - no external high-voltage source required. |
| VSS | Ground | Two dedicated ground balls (pins E1, H1) - ensures stable reference for high-speed read/write timing. |
| NC | No Connect | Three unconnected balls (A3, C1, D1 per TFBGA B3K layout) - must remain floating per design specification. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows temporary halt of sector/block erase to read or program other locations - essential for real-time firmware update without system freeze. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid access - cuts quiescent power by >99% during idle polling intervals. |
| Security ID Space | 256-bit factory + user programmable ID (128 + 128 bits), locked post-programming - enables secure device authentication and license binding. |
| CFI Support | JEDEC-standard Common Flash Interface query mode accessible via 5555H/2AAAH/5555H/98H sequence - enables automatic driver detection and configuration. |
| SuperFlash Reliability | Fixed 7 µs word-program and 18 ms sector/block erase times across full lifetime - eliminates software de-rating and simplifies timing margin analysis. |
Applications
| Industrial PLC Firmware Storage | Networking Equipment Boot Code |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware top-block protection ensuring bootloader integrity during field upgrades. Use Value: 100,000-cycle endurance and >100-year retention guarantee firmware persistence over 15+ year product lifecycles without refresh. |
Use Scenario: Holding boot ROM and FPGA configuration bitstreams in managed switches and routers requiring secure, field-upgradable firmware. IC Role / Device Role / Timing Role: x16 parallel interface flash providing fast 70 ns read access for zero-wait-state CPU boot and configuration loading. Use Value: Erase-suspend capability allows simultaneous diagnostics and partial firmware patching without interrupting packet forwarding. |
| Medical Device Configuration Memory | Automotive Infotainment System Code Storage |
|
Use Scenario: Storing calibration tables, safety-critical parameters, and regulatory compliance logs in FDA-cleared diagnostic instruments. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using factory/user Security ID and hardware WP# to prevent unauthorized parameter modification. Use Value: Dual-status detection (DQ7 + DQ6) ensures deterministic end-of-write verification for audit-trail integrity in regulated environments. |
Use Scenario: Hosting infotainment OS kernel and UI assets in automotive head units where vibration, thermal cycling, and EMI are present. IC Role / Device Role / Timing Role: TFBGA-packaged flash with robust SuperFlash cell structure delivering stable operation under 10 g mechanical shock and -40°C/+105°C extended temp range. Use Value: Uniform 2 KWord sector erase enables delta updates of navigation maps without erasing entire OS partition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF3201B-70-4C-B3KE-T | Bottom-block protection (000000H–007FFFH), same density/timing/package - differs only in protected block location and revision suffix. | Used where bootloader resides in lowest memory region instead of top; requires PCB address decoding adjustment. | Select when legacy design uses bottom-boot architecture or requires newer revision with updated qualification. |
| MX29LV320ETTI-70G | 32 Mbit x16, 70 ns, 2.7–3.6 V, but uses different command set (non-JEDEC), no Erase-Suspend, no Security ID, 55-ball TSOP package. | Lower-cost replacement where advanced features (suspend/resume, security) are unused and board layout allows TSOP footprint. | Choose only if firmware driver compatibility is confirmed and top-block protection is not required. |
Compared with SST39VF3202-70-4C-B3KE-T, SST39VF3201B offers identical performance with inverted block protection, while MX29LV320ETTI lacks suspend/resume and security features - making the original optimal for secure, real-time upgradable systems.
Availability
SST39VF3202-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLCs, networking equipment, medical diagnostics, and automotive infotainment systems requiring stable component supply and long-term lifecycle support.
Supply support for SST39VF3202-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF3202-70-4C-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for cost-sensitive, high-reliability embedded systems needing field-upgradable firmware with minimal power and board space overhead.
FAQ
What is the memory organization and density of the SST39VF3202-70-4C-B3KE-T?
The SST39VF3202-70-4C-B3KE-T is organized as 2M × 16, delivering 32 Mbit (4 MByte) of nonvolatile storage. Its address space spans 000000H to 1FFFFFH, with the top 32 KWord block (1F8000H–1FFFFFH) hardware-protected via WP#. This configuration supports full firmware images for ARM Cortex-M and similar microcontrollers without external memory expansion.
Does the SST39VF3202-70-4C-B3KE-T support Erase-Suspend functionality?
Yes, the SST39VF3202-70-4C-B3KE-T supports Erase-Suspend and Erase-Resume commands (B0H and 30H). When suspended, it allows reading from any non-erasing sector or programming into unprotected regions - critical for real-time systems that must maintain responsiveness during firmware updates. DQ2 toggling indicates erase-suspended status per sector.
What package type and footprint does the SST39VF3202-70-4C-B3KE-T use?
The SST39VF3202-70-4C-B3KE-T uses a 48-ball TFBGA package (6 mm × 8 mm, 0.8 mm pitch), designated B3K in Microchip documentation. It has three NC balls (A3, C1, D1) and two VSS balls (E1, H1) - exact layout matches Figure 3 in DS25028A. This compact, surface-mount package supports high-density PCB designs typical in networking and automotive modules.
How does hardware write protection work on the SST39VF3202-70-4C-B3KE-T?
Hardware write protection on the SST39VF3202-70-4C-B3KE-T is implemented via the WP# pin, which protects the top 32 KWord block (1F8000H–1FFFFFH) when pulled low. If WP# floats, an internal pull-up holds it high, disabling protection. This mechanism prevents accidental erase or program of boot code - a key requirement for fail-safe embedded systems.
Is the SST39VF3202-70-4C-B3KE-T recommended for new designs?
No - Microchip explicitly marks the SST39VF3202-70-4C-B3KE-T as "Not Recommended for New Designs" in DS25028A. It recommends migrating to newer alternatives like SST39VF3201B for bottom-boot variants or evaluating Microchip's latest serial flash families. However, the SST39VF3202-70-4C-B3KE-T remains fully supported for existing production and legacy design refreshes.
SST39VF3202-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF3202-70-4C-B3KE-T FAQ
1.How can I place an order for SST39VF3202-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF3202-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF3202-70-4C-B3KE-T reliable?
The price and inventory of SST39VF3202-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3202-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF3202-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3202-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF3202-70-4C-B3KE-T?
SST39VF3202-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF3202-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF3202-70-4C-B3KE-T?
For technical support, including SST39VF3202-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3202-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39VF3202-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF3202-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3202-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF3202-70-4C-B3KE-T?
All SST39VF3202-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3202-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF3202-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF3202-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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