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Microchip Technology SST39VF3202-70-4I-B3KE
- Part No.:
- SST39VF3202-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF3202-70-4I-B3KE.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,191
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Product details
Overview
SST39VF3202-70-4I-B3KE from Microchip Technology is a 32 Mbit (2M × 16) CMOS Multi-Purpose Flash Plus memory IC with x16 asynchronous parallel interface, 70 ns read access time, single 2.7–3.6 V supply operation, and top-block hardware write protection. It is used in embedded systems for firmware storage, boot code retention, and configuration data in industrial controllers and legacy communication modules.
For engineers reviewing the SST39VF3202-70-4I-B3KE datasheet, SST39VF3202-70-4I-B3KE pinout, SST39VF3202-70-4I-B3KE application, or SST39VF3202-70-4I-B3KE equivalent, this page delivers verified specifications, JEDEC-compliant pin mapping for 48-ball TFBGA (B3K), block/sector erase timing, hardware reset behavior, and validated alternative flash parts for legacy design continuity.
Technical Context
The SST39VF3202-70-4I-B3KE implements SST's SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It supports JEDEC-standard command sets including Software Data Protection (SDP), CFI query mode, and Security ID programming.
Its architecture includes latched address/data buses, tri-state outputs controlled by CE# and OE#, hardware WP#-enabled top 32 KWord boot block protection, and RST#-driven hardware reset to Read mode. Erase-suspend/resume capability allows concurrent read access during active erase operations on unprotected sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (2M × 16 organization), supporting 4 MB addressable space |
| Read Access Time | 70 ns - determines minimum bus cycle time for CPU or FPGA interface |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic systems without level shifting |
| Endurance | 100,000 program/erase cycles - ensures long-term field reliability in firmware update scenarios |
| Data Retention | >100 years - guarantees nonvolatile storage integrity across product lifecycle |
| Erase Granularity | Uniform 2 KWord sectors (4 KB) and 32 KWord blocks (64 KB) - enables flexible partial updates |
| Write Protection | Hardware top-block protection (1F8000H–1FFFFFH) via WP# pin - prevents accidental boot code overwrite |
Pinout & Package
Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), 6 mm × 8 mm, B3K footprint (JEDEC MO-245AC). Pinout conforms to x16 parallel flash standard with dedicated RST#, WP#, and dual control lines (CE#, OE#, WE#).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | A0–A19 used for 2M×16 addressing; A20 selects upper half of 32 Mbit array (1F8000H–1FFFFFH) |
| DQ0–DQ15 | Data I/O | Bi-directional x16 data bus; latched internally during writes; high-impedance when CE# or OE# high |
| CE# | Chip Enable | Active-low device selection; required low for all read/write/erase operations |
| OE# | Output Enable | Active-low output gating; controls DQ bus drive during read cycles only |
| WE# | Write Enable | Active-low control for write/erase command latching and internal timing initiation |
| WP# | Write Protect | Active-low hardware lock for top 32 KWord boot block (1F8000H–1FFFFFH) |
| RST# | Reset | Active-low hardware abort of ongoing erase/program; forces return to Read mode within TRP |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; no separate VPP required (internal generation) |
| VSS | Ground | Two dedicated ground balls (pins E1, H1) for noise reduction and signal integrity |
| NC | No Connect | Pins A3, C3, D3, F3, G3 - electrically unconnected; must be left floating or grounded per layout rules |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during active erase - critical for interrupt-driven boot loaders |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid access - cuts standby power in always-on systems |
| Security ID Space | 256-bit factory + user programmable ID (128 + 128 bits), locked permanently after programming - enables secure device authentication |
| CFI Compliance | Full Common Flash Interface support (query string "QRY", geometry tables, timeout parameters) - enables OS/driver auto-detection |
| Status Detection | Dual software methods: DQ7 Data# Polling and DQ6/DQ2 Toggle Bits - eliminates need for external timers in host firmware |
Applications
| Industrial PLC Firmware Storage | Legacy Telecom Baseband Boot Memory |
|---|---|
Use Scenario: Storing and updating firmware images in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile boot memory mapped to CPU address space; provides 70 ns read access for fast initialization and executes in-place (XIP) code execution. Use Value: Top-block hardware protection prevents corruption of bootloader during field firmware upgrades; 100-year data retention ensures reliability over 15+ year deployments. |
Use Scenario: Holding boot code and DSP configuration data in legacy 2G/3G base station transceivers where board space and thermal budget are constrained. IC Role / Device Role / Timing Role: x16 parallel interface directly connected to ASIC memory controller; supports sector-erase for incremental parameter updates without full reflash. Use Value: 18 ms uniform sector-erase time enables predictable update latency; Auto Low Power mode reduces system-level quiescent current by >99% during idle periods. |
| Medical Diagnostic Equipment Configuration | Automotive Body Control Module (BCM) Calibration Data |
Use Scenario: Storing calibration tables, sensor compensation coefficients, and regulatory compliance logs in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure configuration store with programmable Security ID; accessed via dedicated microcontroller bus during power-up self-test. Use Value: User-programmable 128-bit Security ID enables traceable calibration chain; hardware WP# prevents unauthorized modification of FDA-critical parameters. |
Use Scenario: Retaining vehicle-specific calibration data (e.g., window lift profiles, lighting sequences) across battery disconnect events in BCMs. IC Role / Device Role / Timing Role: EEPROM-replacement flash with block-erase capability; integrated into CAN-connected diagnostic subsystem for remote parameter updates. Use Value: 64 KB uniform block size aligns with UDS diagnostic transfer sizes; 100,000-cycle endurance exceeds automotive OEM requirements for 15-year service life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF3201B | Same density and pinout; improved reliability spec (1M cycles), lower 55 ns access time, and updated B-suffix qualification | Recommended for new designs per Microchip; supports same boot block (top) but with enhanced ESD and latch-up immunity | Select when designing new platforms requiring extended lifecycle support and higher endurance |
| MX29LV320ETTI-70G | 32 Mbit x16, 70 ns, 2.7–3.6 V; lacks RST# pin and Security ID; uses different command set (no CFI) | Compatible for basic read/write/erase functions but requires firmware adaptation; no erase-suspend or hardware reset | Choose for cost-sensitive replacements where advanced features are unused and layout allows minor signal rework |
Compared with SST39VF3202-70-4I-B3KE, SST39VF3201B offers superior endurance and timing while maintaining full pin and command compatibility, whereas MX29LV320ETTI-70G provides functional equivalence at lower cost but sacrifices security, suspend capability, and standardized detection interfaces.
Availability
SST39VF3202-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial control, legacy telecom infrastructure, medical diagnostics, and automotive body electronics requiring stable component supply amid end-of-life transitions.
Supply support for SST39VF3202-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF3202-70-4I-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for embedded systems requiring robust, low-voltage, JEDEC-compliant parallel NOR flash with hardware-based data protection and long-term reliability.
FAQ
What does the "-4I-B3KE" suffix indicate in SST39VF3202-70-4I-B3KE?
The "-4I" denotes Industrial temperature range (–40°C to +85°C) and RoHS-compliant packaging; "B3KE" specifies the 48-ball TFBGA package with B3K pinout and lead-free (Pb-free) finish. This exact variant is qualified for use in demanding environments where thermal stability and solderability are critical. The SST39VF3202-70-4I-B3KE datasheet confirms mechanical dimensions, ball composition, and thermal resistance values for this package configuration.
Does SST39VF3202-70-4I-B3KE support chip-erase, and how long does it take?
Yes, SST39VF3202-70-4I-B3KE supports full chip-erase via a six-byte command sequence (5555H/AAH → 2AAAH/55H → 5555H/80H → 5555H/AAH → 2AAAH/55H → 5555H/10H). Typical chip-erase time is 40 ms, with maximum timeout specified as 64 ms. During chip-erase, only DQ6 toggle bit and DQ7 polling are valid status indicators; all other commands are ignored until completion. The SST39VF3202-70-4I-B3KE datasheet Table 8 confirms these timing values under "Typical time out for Chip-Erase" (2⁵ = 32 ms) and "Maximum time out" (2¹ × 2⁵ = 64 ms).
How is hardware write protection implemented on SST39VF3202-70-4I-B3KE?
SST39VF3202-70-4I-B3KE implements top-block hardware write protection via the WP# pin: when WP# is driven low, program and erase operations are disabled for the top 32 KWord (64 KB) region (1F8000H–1FFFFFH), preserving boot code. If WP# is left floating, an internal pull-up holds it high, disabling protection. This behavior is distinct from SST39VF3201, which protects the bottom block. The SST39VF3202-70-4I-B3KE datasheet Table 3 explicitly defines this top-boot address range and ties protection activation directly to WP# logic level.
Can SST39VF3202-70-4I-B3KE be used with a 3.3 V-only system without voltage translation?
Yes, SST39VF3202-70-4I-B3KE operates natively across 2.7–3.6 V, making it fully compatible with standard 3.3 V logic systems. Its inputs are CMOS-compatible with VIH ≥ 2.0 V and VIL ≤ 0.8 V, and outputs swing rail-to-rail (VDD to VSS). No level-shifting circuitry is required when interfacing with 3.3 V microcontrollers or FPGAs. The SST39VF3202-70-4I-B3KE datasheet Section "DC Electrical Characteristics" verifies input thresholds and output drive strength under 3.3 V operation.
Is SST39VF3202-70-4I-B3KE still recommended for new designs?
No - Microchip explicitly marks SST39VF3202-70-4I-B3KE as "Not Recommended for New Designs" in DS25028A, advising migration to SST39VF3201B for enhanced reliability and qualification. However, SST39VF3202-70-4I-B3KE remains supported for existing production and repair programs. Its obsolescence status does not affect functional compatibility or electrical behavior; all specifications in the SST39VF3202-70-4I-B3KE datasheet remain valid for legacy use cases.
SST39VF3202-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF3202-70-4I-B3KE FAQ
1.How can I place an order for SST39VF3202-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF3202-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF3202-70-4I-B3KE reliable?
The price and inventory of SST39VF3202-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3202-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF3202-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3202-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF3202-70-4I-B3KE?
SST39VF3202-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF3202-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF3202-70-4I-B3KE?
For technical support, including SST39VF3202-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3202-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39VF3202-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF3202-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3202-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF3202-70-4I-B3KE?
All SST39VF3202-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3202-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF3202-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39VF3202-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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