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Microchip Technology SST39VF3202C-70-4I-B3KE
- Part No.:
- SST39VF3202C-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF3202C-70-4I-B3KE.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,237
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Product details
Overview
SST39VF3202C-70-4I-B3KE from Microchip Technology is a 32-Mbit (2M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with SuperFlash® technology, operating at 2.7V–3.6V, offering 70 ns read access time, hardware top-block write protection via WP#, and 100,000 program/erase endurance for embedded firmware storage in industrial controllers.
For engineers reviewing the SST39VF3202C-70-4I-B3KE datasheet, SST39VF3202C-70-4I-B3KE pinout, SST39VF3202C-70-4I-B3KE application, or SST39VF3202C-70-4I-B3KE equivalent, this page delivers verified package mapping (48-ball TFBGA), JEDEC-compliant x16 interface timing, boot-block address range (1FE000H–1FFFFFH), and confirmed erase-suspend/resume capability for real-time firmware update scenarios.
Technical Context
The SST39VF3202C-70-4I-B3KE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count-eliminating software derating. It supports three software detection methods for write completion: Data# Polling (DQ7), Toggle Bits (DQ6/DQ2), and open-drain RY/BY# with external pull-up.
Hardware block protection targets the top two 4-KWord boot blocks (1FE000H–1FFFFFH), while WP# input enables or disables protection; RST# provides hardware reset to Read mode within TRP. The device conforms to JEDEC standard x16 flash pinouts and includes CFI Query mode (98H command) for runtime identification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2M × 16 (32 Mbit), supporting byte-wide or word-wide addressing in x16 mode |
| Read Access Time | 70 ns - determines minimum bus cycle time for CPU or FPGA interface without wait states |
| Supply Voltage | 2.7V–3.6V - compatible with 3.3V logic systems; no separate VPP required due to internal generation |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications |
| Erase Architecture | Sector (2 KWord), Block (4/32 KWord), and Chip-Erase - enables granular firmware patching and full recovery |
| Security ID | 128-bit factory ID + 128-word user-programmable space - enables secure device authentication and configuration binding |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm), RoHS compliant, JEDEC-standard x16 flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus; AMS = A20 selects top/bottom boot block during erase commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-state when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write operations |
| OE# | Output Enable | Active-low output gate; controls data bus drive during reads only |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Write-Protect | Active-low hardware lock for top two 4-KWord boot blocks (1FE000H–1FFFFFH) |
| RST# | Reset | Active-low hardware reset; terminates ongoing erase/program and forces Read mode |
| RY/BY# | Ready/Busy# | Open-drain status output; requires external 10–100 kΩ pull-up; low = operation in progress |
| VDD | Power Supply | 2.7V–3.6V core supply; powers all internal logic and SuperFlash array |
| VSS | Ground | Reference ground for all signals and internal circuitry |
| NC | No Connection | Unbonded pins (e.g., ball B1, G1); must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows interrupting sector/block erase to read or program other regions - critical for real-time OS firmware updates |
| Auto Low-Power Mode | Reduces active read current from 6 mA to 4 µA after valid access - cuts power in burst-read embedded applications |
| Hardware Boot Block Protection | Immutable top-block lock via WP# pin - prevents accidental overwrite of bootloader code in field-deployed systems |
| Toggle Bit & Data# Polling | Dual software status detection (DQ6/DQ7) eliminates need for polling RY/BY# - simplifies driver design on resource-constrained MCUs |
| CFI Query Support | Standardized JEDEC CFI table accessible via 98H command - enables automatic flash driver initialization across platforms |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers subject to EMI and thermal cycling. IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash memory providing boot code and application image storage with hardware write protection. Use Value: Top-block protection prevents corruption of bootloader during field firmware upgrades; 100-year retention ensures data integrity over 15+ year product lifecycle. | Use Scenario: Holding calibrated sensor offsets, safety-critical configuration parameters, and audit logs in FDA-regulated diagnostic equipment. IC Role / Device Role / Timing Role: Secure, long-life configuration store with 128-bit factory ID and user-programmable Security ID space. Use Value: Security ID enables traceability and anti-counterfeiting; >100,000 endurance supports recalibration cycles across device service life. |
| Automotive Infotainment Boot ROM | Networking Equipment BIOS Storage |
Use Scenario: Hosting boot firmware for head-unit microcontrollers requiring AEC-Q100-compliant nonvolatile memory with fast read access. IC Role / Device Role / Timing Role: 70 ns read-access parallel flash used as primary boot ROM for ARM-based SoCs in automotive temperature grade (-40°C to +85°C). Use Value: Fixed 7 µs program time and 18 ms erase time ensure predictable update windows; SuperFlash reliability meets automotive qualification requirements. | Use Scenario: Storing UEFI BIOS and FPGA configuration bitstreams in enterprise switches and routers with hot-swap capability. IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash interfaced to PCI Express root complex or management MCU for firmware recovery. Use Value: Sector-erase granularity allows partial BIOS updates without full chip reprogramming; RY/BY# enables concurrent background erase during system operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF3201C-70-4I-B3KE | Identical architecture and timing, but bottom-block protection (000000H–001FFFH) instead of top-block | Suitable for systems where bootloader resides in lowest memory region, not top | Select only if hardware design uses bottom-boot architecture and WP# protection must cover lower 8 KB |
| MX29LV320ETTI-70G | 32-Mbit x16, 70 ns, 2.7–3.6V, but uses standard NOR erase algorithm - longer and variable erase times vs. SuperFlash fixed timing | Lacks erase-suspend/resume and Security ID; CFI support differs in extended table layout | Choose when legacy driver compatibility is prioritized over real-time update flexibility and security features |
Compared with SST39VF3201C-70-4I-B3KE, the SST39VF3202C-70-4I-B3KE provides top-boot protection matching typical ARM/PowerPC boot vector locations; versus MX29LV320ETTI-70G, it delivers deterministic 18 ms erase and integrated security ID-critical for certified medical and industrial firmware.
Availability
SST39VF3202C-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, automotive infotainment boot ROM, and networking equipment BIOS storage requiring stable component supply and long-term obsolescence management.
Supply support for SST39VF3202C-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, headquartered in Chandler, Arizona, with global manufacturing and support infrastructure.
The SST39VF3202C-70-4I-B3KE belongs to Microchip's Multi-Purpose Flash Plus (MPF+) family, designed specifically for cost-sensitive, high-reliability embedded systems requiring fast, secure, and field-upgradable nonvolatile storage.
FAQ
What is the exact boot block address range protected by hardware in SST39VF3202C-70-4I-B3KE?
The SST39VF3202C-70-4I-B3KE implements top-block hardware protection covering two 4-KWord blocks: 1FE000H–1FEFFFH and 1FF000H–1FFFFFH. This is fixed per device variant and activated when WP# is driven low. The SST39VF3202C-70-4I-B3KE datasheet Table 2 and Table 4 confirm this range applies exclusively to the -3202C suffix, distinguishing it from the bottom-protected -3201C.
Does SST39VF3202C-70-4I-B3KE support both sector and block erase, and what are their sizes?
Yes, the SST39VF3202C-70-4I-B3KE supports uniform 2 KWord (4 KB) sector erase and flexible block erase using eight 4-KWord (8 KB) blocks plus sixty-three 32-KWord (64 KB) blocks. Erase commands (50H for sector, 30H for block) are issued via JEDEC-standard six-byte sequences. These capabilities are explicitly defined in the SST39VF3202C-70-4I-B3KE functional description and timing diagrams on pages 7–8 of DS20005020C.
How does the Auto Low-Power mode function in SST39VF3202C-70-4I-B3KE, and what is its impact on active current?
The SST39VF3202C-70-4I-B3KE enters Auto Low-Power mode automatically after a valid read access, reducing active current from 6 mA (typical) to 4 µA (typical). It exits instantly on any address or control signal transition with no access time penalty. This behavior is documented in DS20005020C page 6 under "Auto-Low-Power mode" and directly impacts power budgeting in battery-backed or thermally constrained designs using SST39VF3202C-70-4I-B3KE.
Can SST39VF3202C-70-4I-B3KE be used in systems requiring Common Flash Interface (CFI) compliance?
Yes, the SST39VF3202C-70-4I-B3KE fully supports CFI Query mode via the 98H command sequence (address 555H), returning standardized identification strings and parameter tables per JEDEC JESD68. CFI data is accessible at defined addresses (e.g., 10H–12H = "QRY") as specified in DS20005020C page 12, Table 8 - enabling plug-and-play driver integration in Linux MTD and U-Boot environments.
What is the role of RY/BY# in SST39VF3202C-70-4I-B3KE, and what external component is required?
RY/BY# is an open-drain Ready/Busy# status output in SST39VF3202C-70-4I-B3KE, pulled low during program/erase operations and high when ready. Because it is open-drain, an external pull-up resistor (10 kΩ to 100 kΩ to VDD) is mandatory for proper logic-level translation. This requirement is explicitly stated in DS20005020C page 4, Table 1, and affects PCB layout and GPIO interfacing for the SST39VF3202C-70-4I-B3KE.
SST39VF3202C-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF3202C-70-4I-B3KE FAQ
1.How can I place an order for SST39VF3202C-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF3202C-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF3202C-70-4I-B3KE reliable?
The price and inventory of SST39VF3202C-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3202C-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF3202C-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3202C-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF3202C-70-4I-B3KE?
SST39VF3202C-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF3202C-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF3202C-70-4I-B3KE?
For technical support, including SST39VF3202C-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3202C-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39VF3202C-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF3202C-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3202C-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF3202C-70-4I-B3KE?
All SST39VF3202C-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3202C-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF3202C-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39VF3202C-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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