My Inquiry
My Account
Microchip Technology SST39VF3202C-70-4I-EKE-T
- Part No.:
- SST39VF3202C-70-4I-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF3202C-70-4I-EKE-T.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,504
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF3202C-70-4I-EKE-T from Microchip Technology is a 32-Mbit (2M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with SuperFlash® technology, operating at 2.7V–3.6V, offering 70 ns read access time, hardware top-block write protection, and 100,000 program/erase endurance cycles. It serves as nonvolatile program/data storage in embedded controllers requiring fast, reliable, low-power firmware updates.
For engineers reviewing the SST39VF3202C-70-4I-EKE-T datasheet, SST39VF3202C-70-4I-EKE-T pinout, SST39VF3202C-70-4I-EKE-T application, or SST39VF3202C-70-4I-EKE-T equivalent, key selection factors include boot-block architecture (top 8 KWord protected), JEDEC-compliant x16 interface timing, RY/BY# status signaling, and dual-package availability (TSOP/TBGA) for space-constrained industrial designs.
Technical Context
This device implements a split-gate SuperFlash cell with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional flash-thus eliminating software derating over lifetime. Its command-set architecture supports sector (2 KWord), block (4/32 KWord), and chip-erase modes via standardized six-byte sequences aligned with JEDEC x16 pinouts.
Hardware data protection includes noise/glitch immunity (<5 ns pulse rejection), VDD power-up/down detection (<1.5 V inhibit), and WP#-controlled top-boot-block lock (addresses 1FE000H–1FFFFFH). The RY/BY# open-drain output provides real-time erase/program status without polling overhead, while Auto-Low-Power mode reduces active read current to 4 µA after valid access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2M × 16 (32 Mbit); enables 16-bit parallel data bus interfacing with microcontrollers and DSPs without external multiplexing. |
| Read Access Time | 70 ns; meets timing requirements for 14 MHz bus operation with standard address/data setup/hold margins. |
| Supply Voltage | 2.7V–3.6V; compatible with single-supply 3.3V systems and tolerant of brown-out conditions down to 2.7V. |
| Endurance | 100,000 cycles (typical); supports frequent field firmware updates over 10+ years in industrial control applications. |
| Data Retention | >100 years; ensures long-term reliability in unpowered storage scenarios such as backup configuration memory. |
| Active Current | 6 mA (typical @ 5 MHz); enables low-power operation in battery-backed or energy-harvesting edge devices. |
| Standby Current | 4 µA (typical); minimizes quiescent power draw during system sleep states without sacrificing wake-up latency. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, JEDEC-standard x16 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus (AMS = A20); selects byte/word location; A11–A20 used for sector/block addressing during erase commands. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during write; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; enables device for read/write; high state forces standby mode with 4 µA current. |
| OE# | Output Enable | Active-low output gate; controls data bus drive; high or floating disables outputs regardless of CE# state. |
| WE# | Write Enable | Active-low write strobe; latches address/data on falling/rising edges per JEDEC timing; initiates internal program/erase. |
| WP# | Write Protect | Active-low hardware lock for top two 4-KWord boot blocks (1FE000H–1FFFFFH); prevents accidental firmware corruption. |
| RST# | Reset Input | Active-low hardware reset; terminates ongoing erase/program and returns device to read mode within TRP (≤100 ns). |
| RY/BY# | Ready/Busy Output | Open-drain status signal; pulled low during erase/program; requires external 10–100 kΩ pull-up to VDD for high-level indication. |
| VDD | Power Supply | 2.7V–3.6V core supply; powers logic and memory array; decoupling capacitor required per JEDEC layout guidelines. |
| VSS | Ground | Signal and power ground reference; two dedicated pins ensure low-impedance return path for high-speed switching. |
| NC | No Connection | Unbonded pins (A19/A20 in TSOP; A19/A20/A16 in TFBGA); must remain unconnected per Microchip design rules. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Cell Architecture | Split-gate + thick-oxide tunneling injector delivers fixed 18 ms erase/7 µs program times across full lifecycle-no software derating needed. |
| Erase-Suspend/Resume | Allows temporary halt of sector/block erase to read/program other regions-critical for real-time firmware patching without system interruption. |
| Security ID Space | 128-bit factory-programmed + 128-word user-programmable ID area; supports secure device authentication and anti-cloning in OEM deployments. |
| Auto-Low-Power Mode | Reduces active read current from 6 mA to 4 µA after valid access-cuts dynamic power by >99% during burst-read sequences. |
| JEDEC x16 Pin Compatibility | Direct drop-in replacement for legacy 32-Mbit x16 NOR flash; eliminates PCB redesign when upgrading from older Microchip or third-party parts. |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Code |
|---|---|
Use Scenario: Storing and updating ladder-logic firmware in programmable logic controllers deployed in factory automation environments with wide temperature ranges (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile program memory holding boot code and runtime firmware; accessed via 16-bit parallel bus with 70 ns read latency to meet deterministic scan-cycle deadlines. Use Value: Top-block hardware protection (WP#-enabled) prevents corruption of critical boot sectors during remote OTA updates, ensuring fail-safe restart capability. | Use Scenario: Holding primary bootloader and safety-critical initialization routines in automotive head units where ASIL-B compliance requires verified firmware integrity. IC Role / Device Role / Timing Role: x16 NOR flash providing immediate execution-from-flash (XIP) capability; RY/BY# pin enables precise timing coordination between MCU and flash during secure boot verification. Use Value: 100-year data retention and 100,000-cycle endurance support multi-year vehicle lifecycles with zero field failures due to flash wear-out. |
| Medical Device Configuration Memory | Networking Equipment Parameter Storage |
Use Scenario: Storing calibrated sensor coefficients, user preferences, and regulatory audit logs in portable diagnostic equipment subject to IEC 62304 software lifecycle requirements. IC Role / Device Role / Timing Role: Secure configuration storage with 128-bit factory Security ID; accessed via standard microprocessor bus during power-on self-test (POST). Use Value: User-programmable Security ID segment allows OEM binding of calibration data to specific hardware units-preventing unauthorized parameter tampering. | Use Scenario: Retaining MAC addresses, VLAN settings, and firmware version metadata in enterprise switches and routers undergoing frequent feature upgrades. IC Role / Device Role / Timing Role: Dual-boot capable flash supporting A/B partitioning; top-block protection isolates primary boot image from secondary update partition. Use Value: Sector-erase (18 ms typical) enables rapid reconfiguration of network parameters without full chip erase-reducing downtime during service calls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF3201C-70-4I-EKE-T | Bottom-block protection (000000H–001FFFH) instead of top-block; identical timing, voltage, endurance, and package options. | Suitable for systems where boot code resides in lowest memory region rather than highest; requires address map revision. | Select when legacy design uses bottom-boot architecture or requires compatibility with SST39VF3201C-based BOMs. |
| MX29LV320ETTI-70G | 32-Mbit x16, 70 ns access, 2.7–3.6 V, but uses different command set (no CFI Query mode) and lacks Security ID feature. | Requires modified driver firmware for erase/program sequences; no hardware-based device authentication capability. | Choose only if existing software stack already supports Macronix command protocol and Security ID is not required. |
Compared with SST39VF3201C-70-4I-EKE-T, the SST39VF3202C-70-4I-EKE-T provides top-boot protection essential for high-address firmware images, while MX29LV320ETTI-70G offers cost parity but sacrifices security and CFI interoperability-making SST39VF3202C the preferred choice for new designs demanding robustness and field-upgrade safety.
Availability
SST39VF3202C-70-4I-EKE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, and medical device configuration memory requiring stable component supply across extended product lifecycles.
Supply support for SST39VF3202C-70-4I-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller, analog, FPGA, and memory solutions, serving industrial, automotive, and communications markets with vertically integrated silicon and development tools.
The SST39VF3202C belongs to Microchip's Multi-Purpose Flash Plus (MPF+) family, designed specifically for embedded systems needing high-reliability, low-voltage, pin-compatible NOR flash with enhanced security and flexible erase granularity.
FAQ
What is the memory organization and bus width of the SST39VF3202C-70-4I-EKE-T?
The SST39VF3202C-70-4I-EKE-T is organized as 2M × 16, delivering 32 Mbit total capacity with a 16-bit parallel data bus (DQ0–DQ15). This configuration supports direct interfacing with 16-bit microcontrollers and DSPs without external data multiplexing, and its JEDEC-standard pinout ensures compatibility with existing x16 memory sockets. The device uses A0–A20 for addressing, with AMS = A20.
How does hardware write protection work on the SST39VF3202C-70-4I-EKE-T?
Hardware write protection on the SST39VF3202C-70-4I-EKE-T is implemented via the WP# pin, which-when driven low-protects the top two 4-KWord boot blocks (1FE000H–1FFFFFH) from program and erase operations. This prevents accidental overwriting of critical boot code. If WP# is left floating, an internal pull-up holds it high, disabling protection. The SST39VF3202C-70-4I-EKE-T differs from SST39VF3201C by protecting the top rather than bottom boot blocks.
What are the supported erase granularities for the SST39VF3202C-70-4I-EKE-T?
The SST39VF3202C-70-4I-EKE-T supports three erase modes: sector-erase (uniform 2 KWord sectors), block-erase (eight 4-KWord blocks + sixty-three 32-KWord blocks), and chip-erase (full 32-Mbit array). Sector-erase completes in 18 ms (typical), block-erase in 18 ms (typical), and chip-erase in 35 ms (typical). All erase operations use standardized six-byte command sequences compliant with JEDEC protocols.
Does the SST39VF3202C-70-4I-EKE-T support ready/busy status signaling?
Yes, the SST39VF3202C-70-4I-EKE-T features an open-drain RY/BY# pin that asserts low during active program or erase operations and transitions high when complete. An external 10–100 kΩ pull-up resistor to VDD is required. This hardware status signal eliminates the need for software polling (e.g., DQ6 toggle or DQ7 polling), reducing CPU overhead and improving system responsiveness during firmware updates.
What security features are included in the SST39VF3202C-70-4I-EKE-T?
The SST39VF3202C-70-4I-EKE-T integrates a 136-word Security ID space: 128 bits factory-programmed by Microchip and 128 words user-programmable. Users can lock the user segment after programming to prevent overwrite. Security ID access uses a dedicated three-byte command (88H), and neither segment supports erasure-ensuring permanent, tamper-resistant device identification. This feature is absent in most competing 32-Mbit NOR flash devices.
SST39VF3202C-70-4I-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF3202C-70-4I-EKE-T FAQ
1.How can I place an order for SST39VF3202C-70-4I-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF3202C-70-4I-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF3202C-70-4I-EKE-T reliable?
The price and inventory of SST39VF3202C-70-4I-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF3202C-70-4I-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39VF3202C-70-4I-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF3202C-70-4I-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF3202C-70-4I-EKE-T?
SST39VF3202C-70-4I-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF3202C-70-4I-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF3202C-70-4I-EKE-T?
For technical support, including SST39VF3202C-70-4I-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF3202C-70-4I-EKE-T requirements.
6.How does Aetrix verify that SST39VF3202C-70-4I-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF3202C-70-4I-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF3202C-70-4I-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39VF3202C-70-4I-EKE-T?
All SST39VF3202C-70-4I-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF3202C-70-4I-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF3202C-70-4I-EKE-T part is unused and in its original packaging.
Return procedure for SST39VF3202C-70-4I-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF3202C-70-4I-EKE-T Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
