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Microchip Technology SST39VF400A-70-4C-B3KE
- Part No.:
- SST39VF400A-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF400A-70-4C-B3KE.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:202
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Product details
Overview
SST39VF400A-70-4C-B3KE from Microchip Technology is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash memory IC using SuperFlash technology, operating at 2.7–3.6V with 70 ns read access time, 14 µs word-program time, and JEDEC-standard x16 asynchronous interface. It serves as nonvolatile program/data storage in embedded controllers, BIOS firmware, and industrial HMI systems.
For engineers reviewing the SST39VF400A-70-4C-B3KE datasheet, SST39VF400A-70-4C-B3KE pinout, SST39VF400A-70-4C-B3KE application, or SST39VF400A-70-4C-B3KE equivalent, key selection criteria include its 2.7V minimum VDD operation, uniform 2 KWord sector erase, 32 KWord block erase, toggle-bit/data# polling write status detection, and TSOP-48 package compatibility with legacy x16 memory sockets.
Technical Context
This device implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed erase/program timing independent of cycle count-unlike conventional flash technologies where timing degrades over endurance life. Its command-set architecture follows JEDEC standard pinouts and supports Software Data Protection via six-byte sequences for erase and three-byte sequences for program.
It features dual write-completion detection (DQ6 Toggle Bit and DQ7 Data# Polling), hardware noise/glitch protection (<5 ns pulse rejection), and VDD power-up/down write inhibition. The device supports CFI Query mode for runtime identification and is factory-shipped with Software Data Protection permanently enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization), providing 512 KB of addressable nonvolatile storage space |
| Read Access Time | 70 ns maximum - enables direct interfacing with 14 MHz microcontrollers without wait states |
| Word-Program Time | 14 µs typical - reduces firmware update latency and improves system-level programming throughput |
| Erase Capability | Uniform 2 KWord sectors (128 total) and 32 KWord blocks (8 total) - supports granular firmware patching and configuration updates |
| Supply Voltage | 2.7–3.6V - compatible with single-supply 3.3V systems and tolerant of brown-out conditions down to 2.7V |
| Data Retention | Greater than 100 years - ensures long-term reliability in unattended industrial deployments |
| Endurance | 100,000 program/erase cycles - validated for frequent field-upgrade scenarios such as gateway firmware revisions |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 used for 256K × 16 addressing; A17 selects upper half of 512 KB space - matches JEDEC x16 memory map |
| DQ0–DQ15 | Data I/O | Bi-directional x16 data bus with internal latching; tri-stated when CE# or OE# high - enables clean bus sharing |
| CE# | Chip Enable | Active-low chip select - must be low to enable read/write; high forces standby mode (3 µA) |
| OE# | Output Enable | Active-low output gate - controls data bus assertion independently of CE#, supporting multiplexed bus timing |
| WE# | Write Enable | Active-low write control - initiates command latching on falling edge and data latching on rising edge per JEDEC protocol |
| VDD | Power Supply | 2.7–3.6V supply - powers core logic and charge pump; internal VPP generation eliminates external high-voltage requirement |
| VSS | Ground | Two dedicated ground pins (pins 23 and 48) - reduce ground bounce during high-speed writes |
| NC | No Connection | Pins 9, 10, 12–15, 18, 19, 21, 22, 24, 25, 27, 28, 30, 31, 33, 34, 36, 37, 39, 40, 42, 43, 45, 46 - electrically isolated; no routing required |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash cell architecture | Split-gate design with thick-oxide tunneling injector delivers stable 70 ns read and 14 µs program timing across full 100k-cycle life |
| Uniform sector/block erase | 2 KWord sectors (4 KB) and 32 KWord blocks (64 KB) enable precise firmware partitioning without over-erasure |
| Software Data Protection | Three-byte sequence for program and six-byte sequence for erase prevent accidental writes during power transitions |
| Toggle Bit (DQ6) & Data# Polling (DQ7) | Hardware-supported status detection allows host CPU to poll asynchronously without timer overhead or fixed delays |
| CFI Query support | Standard Common Flash Interface enables automatic driver initialization and runtime device characterization |
Applications
| Industrial PLC Firmware Storage | Embedded Network Gateway Boot Code |
|---|---|
Use Scenario: Storing programmable logic controller firmware that requires field updates via serial port or SD card. IC Role / Device Role / Timing Role: Nonvolatile boot and application code storage with sector-erase granularity to preserve configuration while updating logic routines. Use Value: 100,000-cycle endurance and >100-year data retention ensure reliable operation over 15+ year PLC service life without refresh. | Use Scenario: Holding boot loader and Linux kernel image in a cellular-connected industrial gateway deployed in remote locations. IC Role / Device Role / Timing Role: Primary x16 flash memory mapped into processor address space for direct execution (XIP) and fast boot. Use Value: 70 ns read access enables zero-wait-state execution from flash, reducing boot time by ~22% versus 90 ns alternatives. |
| Medical Device Configuration Memory | Automotive Infotainment System BIOS |
Use Scenario: Storing calibration tables, user preferences, and safety-critical device settings in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration storage with hardware write-inhibit and software lock bits. Use Value: Dual protection (hardware VDD monitoring + software command lock) prevents corruption during battery swaps or voltage dips. | Use Scenario: BIOS/firmware storage in automotive head units requiring AEC-Q100 compliance and robustness against thermal cycling. IC Role / Device Role / Timing Role: JEDEC-standard x16 flash memory interfaced to ARM-based SoC for secure boot and OTA update staging. Use Value: 2.7–3.6V operation tolerates automotive battery transients (e.g., load dump, cold crank), eliminating need for external LDO buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF400A-70-4C-EKE | Same die and timing, but in 48-ball TFBGA (6 mm × 8 mm) instead of TSOP-48 - smaller footprint, different solder reflow profile | Used where board space is constrained and BGA assembly capability exists; not drop-in replaceable due to package and pinout differences | Select for compact designs with automated BGA placement; avoid if legacy TSOP socket or manual rework is required |
| MX29LV400CBTI-70G | 4 Mbit x16 flash with 70 ns access, but uses standard NOR architecture (not SuperFlash); higher program current (25 mA vs 14 mA typical), no toggle-bit detection | Requires longer polling loops or external timers for write completion; less suitable for low-power battery-backed systems | Choose only if existing design already uses Macronix toolchain and timing margins accommodate slower status detection |
Compared with SST39VF400A-70-4C-B3KE, the TFBGA variant offers miniaturization at the cost of assembly complexity, while the MX29LV400CBTI-70G trades SuperFlash reliability and low-current programming for broader ecosystem support but lacks fixed-timing erase/program guarantees.
Availability
SST39VF400A-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, embedded network gateway boot code, medical device configuration memory, and automotive infotainment system BIOS requiring stable component supply across extended product lifecycles.
Supply support for SST39VF400A-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company delivering microcontrollers, analog, FPGA, and memory solutions with emphasis on reliability, longevity, and embedded system integration.
The SST39VF series belongs to Microchip's legacy SuperFlash multi-purpose flash product line, designed specifically for cost-sensitive, high-reliability embedded applications requiring robust in-field firmware update capability and long-term data integrity.
FAQ
What is the guaranteed minimum supply voltage for SST39VF400A-70-4C-B3KE during program/erase operations?
The SST39VF400A-70-4C-B3KE requires a minimum VDD of 2.7V for all program and erase operations, as specified in its commercial and industrial operating ranges. This 2.7V lower limit enables interoperability with wide-input DC-DC converters and tolerance to brown-out events common in battery-powered or automotive environments. Operation below 2.7V inhibits write functionality via internal VDD detection circuitry, preventing partial writes or data corruption. The SST39VF400A-70-4C-B3KE maintains full read functionality down to 2.7V as well.
Does SST39VF400A-70-4C-B3KE support JEDEC-standard command sets and pinouts?
Yes, the SST39VF400A-70-4C-B3KE fully conforms to JEDEC standard pinouts for x16 asynchronous flash memories and implements the JEDEC-approved Software Data Protection command sequences. Its TSOP-48 pin assignment matches industry-standard 256K×16 flash layouts, allowing direct replacement in existing sockets designed for compatible devices. The command set-including Word-Program, Sector-Erase (30H), Block-Erase (50H), Chip-Erase (10H), and Software ID Entry (90H)-is identical to JEDEC JESD21-C specifications, ensuring driver compatibility across toolchains.
How does the SuperFlash technology in SST39VF400A-70-4C-B3KE improve endurance and timing stability?
The SST39VF400A-70-4C-B3KE uses SST's proprietary SuperFlash technology featuring a split-gate cell with thick-oxide tunneling injector, which decouples erase and program functions and eliminates oxide degradation mechanisms found in stacked-gate NOR flash. As a result, erase and program times remain fixed at 18 ms and 14 µs respectively across the full 100,000-cycle endurance rating - unlike conventional flash where timing increases with wear. This eliminates the need for system-level timing de-rating or adaptive delay algorithms. The SST39VF400A-70-4C-B3KE leverages this to guarantee consistent performance over its lifetime.
What write-completion detection methods are supported by SST39VF400A-70-4C-B3KE?
The SST39VF400A-70-4C-B3KE supports two hardware-assisted write-completion detection methods: Toggle Bit (DQ6) and Data# Polling (DQ7). During internal program or erase, DQ6 toggles between 0 and 1 on successive reads; it stops toggling upon completion. DQ7 returns complemented data during writes and true data after completion. Both methods are valid after the rising edge of the fourth WE# pulse (for program) or sixth WE# pulse (for erase), enabling efficient polling without fixed timeouts. These mechanisms are integral to the SST39VF400A-70-4C-B3KE's real-time operation.
Is SST39VF400A-70-4C-B3KE suitable for industrial temperature range applications?
Yes, the SST39VF400A-70-4C-B3KE is qualified for industrial temperature range (–40°C to +85°C) operation under the 2.7–3.6V supply condition, as documented in the DS25001A datasheet. Its SuperFlash cell structure and CMOS process ensure stable timing and data retention across this range. The device undergoes full temperature screening and is marked with the "I" suffix in industrial-grade variants - though the -4C in SST39VF400A-70-4C-B3KE explicitly denotes commercial grade (0°C to +70°C). For industrial use, confirm ordering code SST39VF400A-70-4I-B3KE or equivalent qualified variant.
SST39VF400A-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF400A-70-4C-B3KE FAQ
1.How can I place an order for SST39VF400A-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF400A-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF400A-70-4C-B3KE reliable?
The price and inventory of SST39VF400A-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF400A-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF400A-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF400A-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF400A-70-4C-B3KE?
SST39VF400A-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF400A-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF400A-70-4C-B3KE?
For technical support, including SST39VF400A-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF400A-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39VF400A-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF400A-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF400A-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF400A-70-4C-B3KE?
All SST39VF400A-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF400A-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF400A-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39VF400A-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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