Microchip Technology SST39VF400A-70-4C-EKE-T
- Part No.:
- SST39VF400A-70-4C-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF400A-70-4C-EKE-T.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SST39VF400A-70-4C-EKE-T from Microchip Technology is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash memory IC with single-supply 2.7–3.6V operation, 70 ns read access time, sector/block erase architecture, and JEDEC-standard x16 asynchronous interface - used for firmware storage and configuration in industrial controllers, network edge devices, and embedded boot memory systems.
For engineers reviewing the SST39VF400A-70-4C-EKE-T datasheet, SST39VF400A-70-4C-EKE-T pinout, SST39VF400A-70-4C-EKE-T application, or SST39VF400A-70-4C-EKE-T equivalent, key selection criteria include voltage range compatibility (2.7–3.6V), TSOP-48 package footprint, 2 KWord uniform sector size, toggle-bit/data# polling write status detection, and SuperFlash technology's fixed 14 µs word-program timing independent of endurance cycles.
Technical Context
The SST39VF400A-70-4C-EKE-T implements SST's proprietary SuperFlash split-gate cell architecture with thick-oxide tunneling injector, enabling guaranteed 100,000 program/erase cycles and >100 years data retention. It supports standard JEDEC command sets including software data protection (SDP) via six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.
Operation modes are controlled by CE#, OE#, and WE# signals with strict timing dependencies: address latching occurs on the falling edge of the last-asserted control signal (CE# or WE#), while data latching occurs on the rising edge of the first-asserted signal. End-of-write detection uses DQ6 (Toggle Bit) and DQ7 (Data# Polling), both valid after the fourth WE# pulse for programming and sixth for erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization) - supports 16-bit parallel data bus interfaces without external data-width conversion. |
| Read Access Time | 70 ns - enables direct execution from flash (XIP) in microcontroller-based systems operating up to ~14 MHz. |
| Supply Voltage | 2.7–3.6V - compatible with modern low-voltage logic rails and eliminates need for dedicated 3.3V regulators in battery-powered or energy-sensitive designs. |
| Endurance | 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years in industrial equipment with quarterly update cadence. |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications such as medical device calibration tables or automotive ECU configuration data. |
| Word-Program Time | 14 µs typical - fixed duration independent of wear level, simplifying real-time system scheduling versus variable-timing NOR flash alternatives. |
| Erase Architecture | Uniform 2 KWord sectors (128 total) and 32 KWord blocks (8 total) - enables granular firmware partitioning and fast recovery from partial corruption. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mountable with standard reflow profile (260°C peak for 10 s).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 used for 256K-word addressing; A17 selects upper/lower half of 512K-word space per JEDEC geometry - required for block erase address decoding. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus with internal latching during writes; tri-stated when CE# or OE# high - supports multiplexed bus sharing with microcontroller peripherals. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high - enables power gating in multi-device memory subsystems. |
| OE# | Output Enable | Active-low output gate; controls data bus visibility without affecting internal state - allows read arbitration in shared-bus architectures. |
| WE# | Write Enable | Active-low write strobe; initiates command loading and latches data/address edges - critical for SDP sequence timing compliance. |
| VDD | Power Supply | 2.7–3.6V supply input; internal VPP generation eliminates need for external high-voltage charge pump - reduces BOM count and PCB area. |
| VSS | Ground | Two dedicated ground pins (pins 23 and 48) - lowers ground impedance and improves noise immunity during high-speed read/write transitions. |
| NC | No Connect | Pins 9, 10, 12–15, 18, 19, 21, 22, 24, 25, 27, 28, 30, 31, 33, 34, 36, 37, 39, 40, 42, 43, 45, 46 - must remain unconnected per design; no pull-up/down or routing required. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide tunneling injector delivers fixed 14 µs program time and 18 ms erase time across full 100,000-cycle lifetime - eliminates runtime degradation compensation in firmware update routines. |
| JEDEC-Compliant Interface | Standard x16 pinout and command set (including CFI query mode at 5555H/98H) - ensures drop-in compatibility with existing NOR flash drivers and bootloader codebases. |
| Hardware + Software Data Protection | Glitch filtering (<5 ns pulses ignored), VDD power-up/down detection (<1.5V inhibit), and mandatory 3-/6-byte SDP sequences - prevents accidental erasure during brown-out or reset conditions. |
| Uniform Erase Granularity | 128 × 2 KWord sectors (4 KByte each) and 8 × 32 KWord blocks (64 KByte each) - enables atomic firmware image updates and secure rollback partitions without over-erasing valid data. |
| Low Standby Current | 3 µA typical at VDD = 3.6V - extends battery life in always-on IoT gateways and portable diagnostic tools where flash remains powered but idle for >99% of operational time. |
Applications
| Industrial PLC Firmware Storage | Network Router Boot Memory |
|---|---|
Use Scenario: Storing programmable logic controller firmware that requires field updates via USB or Ethernet without hardware replacement. IC Role / Device Role / Timing Role: Nonvolatile boot memory holding executable code and configuration parameters; accessed during cold start and runtime firmware patching. Use Value: 70 ns read access enables zero-wait-state XIP execution on Cortex-M4F MCUs; 100,000-cycle endurance supports quarterly security patches over 10-year product lifecycle. | Use Scenario: Holding bootloader and initial OS image in enterprise-grade routers requiring secure, authenticated firmware upgrades. IC Role / Device Role / Timing Role: Primary boot device mapped to CPU address space; erased and reprogrammed only during validated OTA updates. Use Value: Sector-erase capability isolates bootloader region from application partition; software data protection prevents malicious overwrite during network stack vulnerabilities. |
| Medical Device Calibration Data | Automotive Body Control Module (BCM) |
Use Scenario: Retaining factory-calibrated sensor offsets and linearization coefficients in portable ultrasound or ECG units. IC Role / Device Role / Timing Role: Configuration memory written once at manufacturing and read-only during clinical use; accessed via SPI-to-NOR bridge or direct MCU bus. Use Value: >100-year data retention meets ISO 13485 requirements for permanent calibration records; 2.7V minimum VDD supports operation during low-battery emergency modes. | Use Scenario: Storing lighting control logic, door lock actuation profiles, and CAN message routing tables in vehicle BCMs. IC Role / Device Role / Timing Role: Secondary nonvolatile memory co-located with main MCU; updated during dealership service flashes using J2534 protocol. Use Value: Block-erase mode enables full application reload in <2 seconds; uniform 64 KByte blocks align with OEM flash programming tool chunk sizes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF400A-70-4C-B3K-E | Same die, 48-ball TFBGA (6 mm × 8 mm) package instead of TSOP-48; identical electrical specs and timing. | Requires PCB redesign for ball-grid layout and reflow profile; better thermal performance and smaller footprint. | Select for space-constrained designs where board area is premium and assembly supports BGA handling. |
| MX29LV400CTTI-70G | 4 Mbit x16 NOR flash with 70 ns access, but uses traditional floating-gate architecture; 100,000 cycles and 20-year retention (vs. >100 years). | Lacks SuperFlash fixed-timing guarantee; erase times increase with wear, requiring dynamic timeout adjustment in host firmware. | Select only if legacy driver support exists and lifetime data retention is not mission-critical. |
Compared with SST39VF400A-70-4C-EKE-T, the TFBGA variant offers identical functionality in a smaller package but demands layout changes, while the MX29LV400CTTI-70G provides pin-compatible voltage and timing but sacrifices long-term data integrity and wear-leveling predictability.
Availability
SST39VF400A-70-4C-EKE-T is available at Aetrix Electronics and suitable for industrial automation, networking infrastructure, and medical electronics requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.
Supply support for SST39VF400A-70-4C-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its serial and parallel flash portfolio.
The SST39VF400A-70-4C-EKE-T belongs to the SST39VFx00A family of Multi-Purpose Flash devices designed specifically for cost-sensitive, high-reliability embedded systems needing robust firmware storage with minimal external circuitry.
FAQ
What is the maximum operating temperature range for the SST39VF400A-70-4C-EKE-T?
The SST39VF400A-70-4C-EKE-T is rated for commercial operation from 0°C to +70°C. It does not support the extended industrial range (–40°C to +85°C) specified for other variants like SST39VF400A-70-4I-EKE-T. This makes SST39VF400A-70-4C-EKE-T suitable for indoor, climate-controlled environments such as office network gear or lab instrumentation, but not for under-hood automotive or outdoor telecom enclosures.
Does the SST39VF400A-70-4C-EKE-T require an external VPP voltage for programming?
No, the SST39VF400A-70-4C-EKE-T integrates internal VPP generation and operates from a single 2.7–3.6V supply for all read, program, and erase functions. This eliminates the need for external high-voltage circuitry, reducing bill-of-materials cost and PCB complexity. The device complies with JEDEC standard pinouts and requires no VPP pin connection - confirmed in Table 1 and Absolute Maximum Ratings sections of DS25001A.
How many erase sectors does the SST39VF400A-70-4C-EKE-T contain, and what is their size?
The SST39VF400A-70-4C-EKE-T contains 128 uniform erase sectors, each sized at 2 KWords (4 KBytes). This is derived from Table 8 (Device Geometry Information for SST39LF/VF400A), where y = 127 → 128 sectors, and z = 16 → 16 × 256 Bytes = 4 KBytes per sector. Sector addressing uses AMS–A11 lines, with AMS = A17 for this 4 Mbit density.
Can the SST39VF400A-70-4C-EKE-T be used as a direct replacement for the SST39LF400A-70-4C-EKE-T?
No - although both share identical pinout, density, and timing, the SST39VF400A-70-4C-EKE-T operates down to 2.7V, while the SST39LF400A-70-4C-EKE-T requires 3.0–3.6V. Substituting the VF variant into an LF-designed system may cause instability below 3.0V, and substituting the LF variant into a VF system risks failure to program/erase at 2.7–2.99V. Voltage range mismatch invalidates direct replacement claims.
What command sequence is required to enter CFI Query mode on the SST39VF400A-70-4C-EKE-T?
To enter CFI Query mode on the SST39VF400A-70-4C-EKE-T, issue the three-byte sequence: write 0xAA to address 0x5555, then 0x55 to address 0x2AAA, then 0x98 to address 0x5555. This is documented in Table 4 and confirmed in Table 5 of DS25001A. Once entered, CFI data (e.g., vendor ID, device geometry) can be read starting at address 0x0010, and exit is performed with the CFI Exit command (0xF0 to any address).
SST39VF400A-70-4C-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF400A-70-4C-EKE-T FAQ
1.How can I place an order for SST39VF400A-70-4C-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF400A-70-4C-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF400A-70-4C-EKE-T reliable?
The price and inventory of SST39VF400A-70-4C-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF400A-70-4C-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39VF400A-70-4C-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF400A-70-4C-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF400A-70-4C-EKE-T?
SST39VF400A-70-4C-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF400A-70-4C-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF400A-70-4C-EKE-T?
For technical support, including SST39VF400A-70-4C-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF400A-70-4C-EKE-T requirements.
6.How does Aetrix verify that SST39VF400A-70-4C-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF400A-70-4C-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF400A-70-4C-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39VF400A-70-4C-EKE-T?
All SST39VF400A-70-4C-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF400A-70-4C-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF400A-70-4C-EKE-T part is unused and in its original packaging.
Return procedure for SST39VF400A-70-4C-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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