My Inquiry
My Account
Microchip Technology SST39VF401C-70-4I-B3KE-T
- Part No.:
- SST39VF401C-70-4I-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF401C-70-4I-B3KE-T.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,524
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF401C-70-4I-B3KE-T from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded program/data storage in microcontroller-based systems. It operates from 2.7–3.6V, delivers 70 ns read access time, supports hardware block protection on the bottom 8 KWord boot sector (00000H–01FFFH), and features erase-suspend/resume capability for real-time firmware updates.
For engineers reviewing the SST39VF401C-70-4I-B3KE-T datasheet, SST39VF401C-70-4I-B3KE-T pinout, SST39VF401C-70-4I-B3KE-T application, or SST39VF401C-70-4I-B3KE-T equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block protection mapping, and validated alternative flash parts for industrial control, networking boot code, and automotive infotainment firmware storage.
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional NOR flash. Its command set conforms to JEDEC standard pinouts and software protocols, including CFI Query, Security ID, and Software Data Protection (SDP) with three-byte unlock sequences.
It supports multiple erase granularities: uniform 2 KWord sectors, flexible blocks (seven 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord), and full-chip erase-all initiated via six-byte command sequences. Status detection uses DQ6/DQ2 toggle bits and DQ7 data polling, with RY/BY# open-drain output requiring external 10 kΩ–100 kΩ pull-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16 (4 Mbit total); enables 16-bit parallel data bus interfacing with MCUs and SoCs |
| Read Access Time | 70 ns (max); meets timing requirements for 14 MHz bus operation without wait states |
| Supply Voltage | 2.7–3.6 V; compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V |
| Endurance | 100,000 program/erase cycles (typical); supports field firmware updates over 10+ years in deployed systems |
| Data Retention | >100 years (typical); ensures long-term reliability for unpowered storage in industrial environments |
| Boot Block Protection | Bottom 8 KWord (00000H–01FFFH); hardware-protected via WP# pin to prevent accidental bootloader corruption |
| Active Current | 5 mA (typical at 5 MHz); low power consumption during active reads reduces thermal load in dense PCB layouts |
| Standby Current | 3 µA (typical); enables ultra-low-power sleep modes in battery-backed or energy-harvesting applications |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, optimized for high-density PCB layouts and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; AMS = A17 for sector/block selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# is high |
| CE# | Chip Enable | Active-low chip select; deactivates device and places outputs in high-impedance state when high |
| OE# | Output Enable | Active-low output gate; controls data bus drive only when CE# is also low |
| WE# | Write Enable | Active-low write strobe; latches address/data on falling/rising edges per JEDEC command timing |
| WP# | Write Protect | Hardware lock for bottom boot block (00000H–01FFFH); grounded to disable erase/program on protected region |
| RST# | Reset | Hardware reset input; forces return to Read mode within TRP (min 100 ns), aborting in-progress operations |
| RY/BY# | Ready/Busy# | Open-drain status indicator; pulled low during erase/program; requires external pull-up resistor |
| VDD | Power Supply | 2.7–3.6 V supply; powers core logic and SuperFlash® array; internal regulation eliminates need for VPP |
| VSS | Ground | System ground reference for all I/O and core circuitry; two dedicated pins for noise reduction |
| NC | No Connection | Unbonded pads (e.g., A13, A9, A10, A8, A11, A12, A14, A15, A16, DQ7, DQ5, DQ2, DQ0, etc.); must be left floating |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during background erase, enabling interruptible firmware updates |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read completion-no software intervention required |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space, locked permanently to prevent tampering |
| JEDEC Standard Compliance | Pinout, command set, and timing fully aligned with JEDEC JESD21-C for drop-in compatibility with legacy x16 flash designs |
| SuperFlash® Reliability | Split-gate cell design achieves >100-year data retention and 100,000-cycle endurance without performance degradation |
| Hardware Block Protection | Bottom 8 KWord boot sector protected independently via WP# pin-critical for safeguarding bootloader integrity |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Code |
|---|---|
|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating in harsh temperature and vibration environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to MCU address space; accessed via 16-bit parallel bus with 70 ns read latency. Use Value: Bottom boot block protection prevents accidental overwrite of critical startup code during field firmware upgrades. |
Use Scenario: Holding boot ROM and OS kernel for head-unit microprocessors requiring fast, reliable cold-start execution. IC Role / Device Role / Timing Role: Primary boot memory device; initialized early in power-on sequence using JEDEC-standard read commands. Use Value: 100,000-cycle endurance supports frequent OTA updates across vehicle lifetime without memory wear-out. |
| Networking Equipment Configuration | Medical Device Calibration Data |
|
Use Scenario: Storing switch/router configuration tables, MAC address tables, and security keys in enterprise-grade network switches. IC Role / Device Role / Timing Role: Configuration memory accessed by management CPU during initialization and runtime reconfiguration. Use Value: Erase-suspend capability allows live packet forwarding while updating configuration sectors-zero service interruption. |
Use Scenario: Retaining factory calibration coefficients and sensor offset values in portable diagnostic equipment with battery backup. IC Role / Device Role / Timing Role: Secure, long-retention data storage element; accessed during power-up self-test and periodic recalibration. Use Value: >100-year data retention ensures calibration integrity across product lifecycle without periodic refresh. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF402C-70-4I-B3KE-T | Top-boot architecture (3E000H–3FFFFH protected); identical voltage, timing, and package | Used where bootloader resides in top memory region instead of bottom; not interchangeable without firmware address remapping | Select only if system firmware is located in upper 32 KWord and requires hardware write protection there |
| MX29LV400CTTI-70G | 4 Mbit x16, 70 ns, 3.0–3.6 V; no Auto Low Power mode; different CFI structure and command set | Lacks erase-suspend and Security ID; requires modified driver support due to non-identical JEDEC implementation | Choose when cost sensitivity outweighs advanced features and legacy driver compatibility is acceptable |
Compared with SST39VF401C-70-4I-B3KE-T, the SST39VF402C variant shifts hardware protection to the top boot block-requiring firmware address relocation-while MX29LV400CTTI-70G omits erase-suspend and auto-low-power, increasing software complexity and power overhead in battery-constrained designs.
Availability
SST39VF401C-70-4I-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot code, and medical device calibration data requiring stable component supply across extended production lifecycles.
Supply support for SST39VF401C-70-4I-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF401C-70-4I-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered specifically for embedded systems needing robust, low-voltage, high-reliability program and configuration storage with hardware-level boot protection.
FAQ
What is the boot block configuration of SST39VF401C-70-4I-B3KE-T?
The SST39VF401C-70-4I-B3KE-T implements bottom-boot architecture, protecting the lowest 8 KWord (00000H–01FFFH) via the WP# pin. This matches Table 4 and Figure 2 in the datasheet, distinguishing it from the top-boot SST39VF402C variant. The protection is hardware-enforced and active when WP# is grounded.
Does SST39VF401C-70-4I-B3KE-T require an external VPP voltage?
No, SST39VF401C-70-4I-B3KE-T does not require external VPP. It uses internal charge pump generation for programming and erase operations, as confirmed by "Internal VPP Generation" in the Features list and Table 9 showing VPP min/max = 0000H. Only VDD (2.7–3.6 V) and VSS are needed.
How is the Ready/Busy# (RY/BY#) signal used with SST39VF401C-70-4I-B3KE-T?
RY/BY# is an open-drain output that sinks current when active (low) during erase or program operations. SST39VF401C-70-4I-B3KE-T requires an external 10 kΩ–100 kΩ pull-up resistor to VDD to ensure proper high-state transition. It provides hardware status indication without software polling overhead.
Can SST39VF401C-70-4I-B3KE-T be used in place of SST39VF402C-70-4I-B3KE-T?
No-SST39VF401C-70-4I-B3KE-T and SST39VF402C-70-4I-B3KE-T are not interchangeable without firmware changes. The former protects the bottom boot block (00000H–01FFFH); the latter protects the top boot block (3E000H–3FFFFH). Swapping them risks corrupting unprotected bootloader regions.
What is the purpose of the Security ID feature in SST39VF401C-70-4I-B3KE-T?
The Security ID provides 128-bit factory-programmed uniqueness plus 128-word user-programmable space. SST39VF401C-70-4I-B3KE-T uses it for anti-cloning, secure boot key storage, or device authentication. Once locked via User Sec ID Program Lock-Out command, the user segment becomes permanently immutable.
SST39VF401C-70-4I-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF401C-70-4I-B3KE-T FAQ
1.How can I place an order for SST39VF401C-70-4I-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF401C-70-4I-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF401C-70-4I-B3KE-T reliable?
The price and inventory of SST39VF401C-70-4I-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF401C-70-4I-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF401C-70-4I-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF401C-70-4I-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF401C-70-4I-B3KE-T?
SST39VF401C-70-4I-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF401C-70-4I-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF401C-70-4I-B3KE-T?
For technical support, including SST39VF401C-70-4I-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF401C-70-4I-B3KE-T requirements.
6.How does Aetrix verify that SST39VF401C-70-4I-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF401C-70-4I-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF401C-70-4I-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF401C-70-4I-B3KE-T?
All SST39VF401C-70-4I-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF401C-70-4I-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF401C-70-4I-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF401C-70-4I-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF401C-70-4I-B3KE-T Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
