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Microchip Technology SST39VF401C-70-4I-MAQE
- Part No.:
- SST39VF401C-70-4I-MAQE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39VF401C-70-4I-MAQE.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,821
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Product details
Overview
SST39VF401C-70-4I-MAQE from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and legacy system upgrades. It operates at 2.7–3.6 V, delivers 70 ns read access time, supports hardware block protection on the bottom 8 KWord boot sector (00000H–01FFFH), and features erase-suspend/resume for real-time data access during background flash operations.
For engineers reviewing the SST39VF401C-70-4I-MAQE datasheet, SST39VF401C-70-4I-MAQE pinout, SST39VF401C-70-4I-MAQE application, or SST39VF401C-70-4I-MAQE equivalent, key selection criteria include its TSOP-48 package, JEDEC-compliant x16 parallel interface, bottom-boot architecture, 100,000-cycle endurance, and support for software data protection via six-byte command sequences.
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional flash technologies where timing degrades over endurance life. Its control logic accepts standard microprocessor write sequences with latching on CE# or WE# edges, and integrates dedicated status signaling via RY/BY# (open-drain), DQ6 toggle bit, and DQ7 data# polling.
The SST39VF401C-70-4I-MAQE uses AMS = A17 addressing for sector/block selection, supports uniform 2 KWord sectors and flexible block sizes (eight blocks: one 8-, two 4-, one 16-, seven 32-KWord), and includes factory-programmed 128-bit Security ID plus user-programmable 128-word segment with lock-out capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization); supports byte-wide or word-wide data transfers in x16 mode. |
| Read Access Time | 70 ns max; enables direct replacement of legacy 70 ns EPROMs and fast boot code execution. |
| Supply Voltage | 2.7–3.6 V; single-supply operation compatible with 3.3 V systems and tolerant of brown-out conditions down to 2.7 V. |
| Endurance | 100,000 program/erase cycles typical; ensures long-term field reliability in firmware update applications. |
| Data Retention | >100 years; guarantees nonvolatile storage integrity across product lifecycles without refresh. |
| Active Current | 5 mA typical at 5 MHz; low dynamic power supports energy-constrained embedded designs. |
| Standby Current | 3 µA typical; ultra-low quiescent draw enables battery-backed retention in always-on systems. |
| Block Protection | Hardware bottom-boot protection (00000H–01FFFH); prevents accidental overwrite of critical boot code when WP# is grounded. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mount. Pinout conforms to JEDEC standard for x16 parallel flash memories.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus; AMS = A17 used for sector/block selection during erase commands. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; outputs valid data during read, accepts input during program; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required low for all write/erase operations. |
| OE# | Output Enable | Active-low output gate; controls data bus drive; must be low with CE# low to enable read data output. |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edge per JEDEC timing; initiates internal program/erase. |
| WP# | Write Protect | Active-low hardware lock for bottom 8 KWord boot block; prevents erase/program when grounded. |
| RST# | Reset | Active-low hardware reset; forces return to read mode and aborts in-progress operations within TRP. |
| RY/BY# | Ready/Busy# | Open-drain status indicator; pulled low during program/erase; requires external 10–100 kΩ pull-up. |
| VDD | Power Supply | 2.7–3.6 V supply; powers core logic and SuperFlash® array; internal VPP generation eliminates external high-voltage source. |
| VSS | Ground | Reference ground for all signals and internal circuitry; two dedicated pins for noise immunity. |
| NC | No Connection | Unbonded pins (e.g., A13, A9, A12 in TSOP); must remain unconnected per design. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during background erase, enabling deterministic interrupt response in RTOS environments. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read access, eliminating need for explicit standby entry commands. |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space with lock-out, supporting secure device authentication and traceability. |
| Common Flash Interface (CFI) | Enables host software to auto-detect device geometry, timing, and command set-critical for generic flash drivers and bootloader portability. |
| JEDEC Pinout & Command Set | Guarantees drop-in compatibility with industry-standard x16 flash controllers and eliminates custom driver development. |
| SuperFlash® Technology | Delivers fixed 7 µs word-program and 18 ms sector-erase times regardless of accumulated cycles-removing runtime de-rating in field-deployed systems. |
Applications
| Industrial PLC Firmware Storage | Legacy System BIOS Replacement |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh factory environments with wide temperature swings and electrical noise. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into CPU address space; provides 70 ns read access for deterministic scan-cycle execution. Use Value: Bottom-boot hardware protection prevents corruption of startup routines during remote firmware updates; 100-year data retention eliminates field recalibration. |
Use Scenario: Replacing obsolete 27C040 EPROMs in legacy medical imaging equipment requiring field-upgradable diagnostic firmware without board redesign. IC Role / Device Role / Timing Role: Drop-in x16 parallel flash replacement with identical pinout and JEDEC command set; supports in-system programming via existing EPROM programmer interface. Use Value: 2.7–3.6 V operation eliminates level-shifter requirements; 100,000-cycle endurance enables frequent calibration updates over 15+ year service life. |
| Telecom Line Card Configuration | Automotive ECU Bootloader Storage |
|
Use Scenario: Holding configuration tables and protocol stacks for carrier-grade DSLAM line cards subject to thermal cycling and long-term deployment. IC Role / Device Role / Timing Role: Configuration memory accessed during power-on initialization; leverages RY/BY# and DQ6 toggle for reliable status monitoring in multi-device systems. Use Value: Erase-suspend allows live diagnostics to read operational parameters while background sector reprogramming occurs-reducing service downtime. |
Use Scenario: Storing certified bootloader code in automotive engine control units where functional safety (ISO 26262) mandates verified boot integrity and tamper resistance. IC Role / Device Role / Timing Role: Secure boot memory with factory-programmed Security ID used for cryptographic signature verification during cold start. Use Value: Hardware WP# lock on bottom boot sector ensures bootloader remains immutable; CFI query enables runtime validation of flash geometry before code execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF402C-70-4I-MAQE | Top-boot architecture (protects 3E000H–3FFFFH); otherwise identical voltage, timing, and feature set. | Used where boot code resides in top memory region; incompatible for bottom-boot systems without address remapping. | Select only if target system requires top-boot protection and matches 3E000H–3FFFFH address range. |
| MX29LV400CTTI-70G | 4 Mbit x16, 70 ns, 3.0–3.6 V; lacks erase-suspend, Security ID, and Auto Low Power mode; uses different command set. | Lower-cost option for static firmware storage without runtime reprogramming needs; requires driver modification. | Choose when budget constraints outweigh advanced features and legacy driver compatibility is not required. |
Compared with SST39VF401C-70-4I-MAQE, the SST39VF402C variant offers top-boot protection instead of bottom-boot-requiring PCB-level address routing changes-while the MX29LV400CTTI sacrifices erase-suspend and security features for cost reduction, necessitating firmware driver updates.
Availability
SST39VF401C-70-4I-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy system BIOS replacement, and telecom line card configuration requiring stable component supply across extended production lifecycles.
Supply support for SST39VF401C-70-4I-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller, analog, and flash memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF401C-70-4I-MAQE belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered specifically for reliable, low-power, in-system programmable firmware and configuration storage in industrial, telecom, and automotive embedded systems.
FAQ
What is the boot block configuration of the SST39VF401C-70-4I-MAQE?
The SST39VF401C-70-4I-MAQE implements bottom-boot hardware block protection covering the 8 KWord address range 00000H–01FFFH. This is fixed by silicon design and cannot be reconfigured. When WP# is grounded, program and erase operations are inhibited in this region-ensuring bootloader code integrity. The SST39VF401C-70-4I-MAQE differs from the SST39VF402C variant, which protects the top 8 KWord (3E000H–3FFFFH).
Does the SST39VF401C-70-4I-MAQE require an external VPP voltage for programming?
No, the SST39VF401C-70-4I-MAQE does not require an external VPP voltage. It uses internal charge-pump circuitry to generate the high voltage needed for erase and program operations from the single 2.7–3.6 V VDD supply. This eliminates the need for additional power rails or high-voltage programming hardware-simplifying system design and reducing BOM cost.
How does the erase-suspend feature work in the SST39VF401C-70-4I-MAQE?
The SST39VF401C-70-4I-MAQE supports erase-suspend via the B0H command, which halts an ongoing sector or block erase and places the device in read mode within ~20 µs. During suspend, reads from non-erasing sectors return valid data; reads from suspended sectors output DQ2 toggle and DQ6 = '1'. Resume uses the 30H command. This enables real-time diagnostics without interrupting background flash maintenance.
What package type is used for the SST39VF401C-70-4I-MAQE?
The SST39VF401C-70-4I-MAQE is packaged in a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm footprint and standard JEDEC pinout. The 'MAQE' suffix explicitly denotes this TSOP-48 variant. It is not offered in TFBGA or WFBGA packages under this part number-those variants carry distinct suffixes (e.g., 'MAQ' for WFBGA).
Can the SST39VF401C-70-4I-MAQE be used with a 5 V microcontroller interface?
No, the SST39VF401C-70-4I-MAQE is strictly a 3.3 V device with absolute maximum VDD of 3.6 V and no 5 V tolerance on I/O pins. Direct connection to a 5 V microcontroller will damage the device. Level translation (e.g., TXB0108 or discrete MOSFET buffers) is mandatory for interfacing with 5 V buses. Its CMOS I/O is compatible only with 3.3 V logic families.
SST39VF401C-70-4I-MAQE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39VF401C-70-4I-MAQE FAQ
1.How can I place an order for SST39VF401C-70-4I-MAQE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF401C-70-4I-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF401C-70-4I-MAQE reliable?
The price and inventory of SST39VF401C-70-4I-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF401C-70-4I-MAQE is usually 5 days.
3.What payment methods are accepted for SST39VF401C-70-4I-MAQE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF401C-70-4I-MAQE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF401C-70-4I-MAQE?
SST39VF401C-70-4I-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF401C-70-4I-MAQE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF401C-70-4I-MAQE?
For technical support, including SST39VF401C-70-4I-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF401C-70-4I-MAQE requirements.
6.How does Aetrix verify that SST39VF401C-70-4I-MAQE is sourced from the original manufacturer or authorized distributors?
All SST39VF401C-70-4I-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF401C-70-4I-MAQE meets industry standards.
7.What is the process for return or replacement of SST39VF401C-70-4I-MAQE?
All SST39VF401C-70-4I-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF401C-70-4I-MAQE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF401C-70-4I-MAQE part is unused and in its original packaging.
Return procedure for SST39VF401C-70-4I-MAQE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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