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Microchip Technology SST39VF402C-70-4C-B3KE

Part No.:
SST39VF402C-70-4C-B3KE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39VF402C-70-4C-B3KE.pdf
Description:
IC FLASH 4MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,305

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Product details

Overview

SST39VF402C-70-4C-B3KE from Microchip is a 4 Mbit (256K × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded firmware and configuration storage. It operates at 2.7–3.6 V, delivers 70 ns read access time, supports sector/block/chip erase, and features hardware write protection via WP# for top-boot block (3E000H–3FFFFH). It is used in industrial controllers requiring field-upgradable firmware with high data retention.

For engineers reviewing the SST39VF402C-70-4C-B3KE datasheet, SST39VF402C-70-4C-B3KE pinout, SST39VF402C-70-4C-B3KE application, or SST39VF402C-70-4C-B3KE equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block protection mapping, SuperFlash® endurance metrics, and real-world design implications for firmware update architectures.

Technical Context

This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional flash. Its command-set follows JEDEC-standard x16 pinouts and supports software data protection (SDP) with three-byte unlock sequences for program and six-byte sequences for erase.

It integrates dual status detection: Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2), plus open-drain RY/BY# for hardware-ready signaling. The top-boot block (8 KWord, 3E000H–3FFFFH) is hardware-protected when WP# is low, and the device supports Erase-Suspend/Resume for concurrent read/program during background erase.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density4 Mbit (256K × 16 organization), directly maps to 512 KB of 16-bit addressable space
Read Access Time70 ns - determines minimum bus cycle time for CPU or controller interfacing in 16-bit mode
Supply Voltage2.7–3.6 V - enables direct integration into 3.3 V systems without level-shifting or auxiliary regulators
Endurance100,000 program/erase cycles - supports frequent firmware updates over product lifetime
Data Retention>100 years - ensures long-term reliability in unpowered storage for industrial deployments
Active Current5 mA typical at 5 MHz - defines peak power draw during read bursts in low-power applications
Standby Current3 µA typical - enables ultra-low quiescent power in sleep-mode systems

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, bottom-side ball layout per Figure 4 in DS20005053B.

Pin/Terminal Circuit Role Design Meaning
A0–A17Address Inputs18-bit address bus; AMS = A17 selects top/bottom boot blocks during erase operations
DQ0–DQ15Data I/O16-bit bidirectional bus; latched internally during writes; tri-stated when CE# or OE# high
CE#Chip EnableActive-low chip select; must be low to enable any operation except standby
OE#Output EnableActive-low output gate; controls DQ bus drive only during reads
WE#Write EnableControls timing of command/data latching on falling/rising edges per JEDEC x16 protocol
WP#Write ProtectHardware lock for top 8 KWord boot block (3E000H–3FFFFH); grounded to prevent accidental erase/program
RST#ResetHardware abort of ongoing erase/program; forces return to read mode within TRP (min 100 ns)
RY/BY#Ready/Busy#Open-drain status indicator; requires external 10–100 kΩ pull-up; low = active erase/program
VDDPower Supply2.7–3.6 V supply; powers core logic and SuperFlash® array; no separate VPP required
VSSGroundReference for all I/O and internal circuitry; two dedicated pins for noise immunity
NCNo ConnectionUnbonded balls (e.g., A2, C3, D1, E1, F1, G1, H1, J1, K1, L1, L2, L3, L4, L5, L6) - must remain floating

Key Features

Feature Design Value
SuperFlash® TechnologySplit-gate cell with thick-oxide injector enables fixed 7 µs word-program and 18 ms sector-erase times across full lifecycle
Erase-Suspend/ResumeAllows reading from non-suspended sectors or programming other blocks while erase runs - critical for real-time firmware patching
Top Boot Block ProtectionHardware-enforced 8 KWord (3E000H–3FFFFH) lock via WP# prevents corruption of bootloader code during field updates
Security ID SpaceFactory-programmed 128-bit ID + 128-word user space; programmable and lockable to prevent cloning or unauthorized reprogramming
Auto Low Power ModeReduces active read current from 5 mA to 3 µA after valid access - cuts dynamic power by >99% during idle polling

Applications

Industrial PLC Firmware Storage Medical Device Configuration Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash memory serving as primary boot and application code storage, interfaced directly to ARM Cortex-M7 or Renesas RX600 MCU.

Use Value: 70 ns access time enables zero-wait-state execution; top-boot protection ensures bootloader integrity during remote OTA updates.

Use Scenario: Holding calibrated sensor offsets, user preferences, and regulatory-compliant device settings in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Configuration EEPROM replacement with higher endurance and faster rewrites, connected via standard microcontroller memory bus.

Use Value: 100,000-cycle endurance supports daily recalibration; >100-year data retention meets FDA 21 CFR Part 11 long-term recordkeeping requirements.

Telecom Base Station Bootloader Automotive Infotainment System Update Cache

Use Scenario: Hosting secure bootloader images in LTE/5G remote radio units where firmware must survive power loss during field upgrades.

IC Role / Device Role / Timing Role: Trusted boot source with hardware write-protection, accessed during cold start before main application loads.

Use Value: WP#-enabled top-boot block isolates bootloader from accidental overwrite; RY/BY# signal synchronizes upgrade progress to host controller.

Use Scenario: Caching map data patches and UI assets in head-unit systems prior to atomic swap into active partition.

IC Role / Device Role / Timing Role: High-speed parallel flash buffer supporting burst writes from SoC DMA engine during vehicle ignition-off download windows.

Use Value: 18 ms block-erase time enables sub-second cache refresh; sector-erase granularity allows selective asset updates without full image reload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF401C-70-4C-B3KEBottom-boot architecture (00000H–01FFFH protected); identical voltage, timing, and packageRequires firmware layout with protected bottom block instead of top; same PCB footprintSelect when bootloader resides in lowest address region and top-block flexibility is unnecessary
MX29LV400CTTI-70G70 ns access, 4 Mbit x16, 3.0–3.6 V only; lacks Erase-Suspend and Security ID; uses different command setNo suspend/resume capability limits real-time update use cases; no hardware boot-block protectionChoose for cost-sensitive legacy designs where SuperFlash® features are unused and voltage range matches

Compared with SST39VF401C-70-4C-B3KE and MX29LV400CTTI-70G, the SST39VF402C-70-4C-B3KE uniquely combines top-boot hardware protection, Erase-Suspend, and factory-security ID in a single 4 Mbit x16 WFBGA package-enabling secure, real-time firmware updates without layout or software redesign.

Availability

SST39VF402C-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostics equipment, and telecom base stations requiring stable component supply, long-lifecycle support, and guaranteed RoHS compliance.

Supply support for SST39VF402C-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with focus on embedded control and connectivity.

SST39VF402C-70-4C-B3KE belongs to Microchip's SuperFlash® MPF+ family, engineered for high-reliability firmware storage in harsh environments where endurance, data retention, and secure boot integrity are critical.

FAQ

What is the boot block configuration of SST39VF402C-70-4C-B3KE?

The SST39VF402C-70-4C-B3KE implements top-boot block protection covering addresses 3E000H–3FFFFH (8 KWord). This region is hardware-locked against erase/program when WP# is grounded. Unlike the SST39VF401C variant, it does not protect the bottom block. The boot block size and location are fixed per device marking and cannot be reconfigured in-circuit.

Does SST39VF402C-70-4C-B3KE require an external VPP voltage for programming?

No, SST39VF402C-70-4C-B3KE does not require external VPP. It generates internal high-voltage programming pulses using its on-chip charge pump, enabled solely by the 2.7–3.6 V VDD supply. This eliminates need for auxiliary power rails or external voltage generators, simplifying board design and reducing BOM cost.

How is write completion detected on SST39VF402C-70-4C-B3KE?

SST39VF402C-70-4C-B3KE supports three concurrent write-status detection methods: Data# Polling (DQ7 toggles until completion), Toggle Bits (DQ6 alternates during operation), and RY/BY# pin (open-drain low-active signal). All are valid after defined WE# edge counts per operation type, and may be used independently or in combination for robust system timing.

Can SST39VF402C-70-4C-B3KE be used in place of SST39VF401C-70-4C-B3KE without hardware changes?

No - although pin-compatible and electrically identical, SST39VF402C-70-4C-B3KE and SST39VF401C-70-4C-B3KE differ in boot block location (top vs. bottom) and protected address ranges. Substituting one for the other requires firmware memory map revision and validation of WP#-driven protection alignment with bootloader placement.

What is the purpose of the Security ID feature in SST39VF402C-70-4C-B3KE?

The Security ID in SST39VF402C-70-4C-B3KE provides a 128-bit factory-programmed identifier plus 128-word user-programmable space. It enables device authentication, anti-cloning, and secure firmware binding. Once locked via User Sec ID Program Lock-Out command, the user segment becomes immutable - ensuring persistent identity across field updates and lifecycle phases.

SST39VF402C-70-4C-B3KE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (6x8)

SST39VF402C-70-4C-B3KE FAQ

1.How can I place an order for SST39VF402C-70-4C-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF402C-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF402C-70-4C-B3KE reliable?

The price and inventory of SST39VF402C-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF402C-70-4C-B3KE is usually 5 days.

3.What payment methods are accepted for SST39VF402C-70-4C-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF402C-70-4C-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF402C-70-4C-B3KE?

SST39VF402C-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF402C-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF402C-70-4C-B3KE?

For technical support, including SST39VF402C-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF402C-70-4C-B3KE requirements.

6.How does Aetrix verify that SST39VF402C-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39VF402C-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF402C-70-4C-B3KE meets industry standards.

7.What is the process for return or replacement of SST39VF402C-70-4C-B3KE?

All SST39VF402C-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF402C-70-4C-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF402C-70-4C-B3KE part is unused and in its original packaging.

Return procedure for SST39VF402C-70-4C-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39VF402C-70-4C-B3KE Tags

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