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Microchip Technology SST39VF402C-70-4C-B3KE-T
- Part No.:
- SST39VF402C-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF402C-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,894
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Product details
Overview
SST39VF402C-70-4C-B3KE-T from Microchip is a 4 Mbit (256K × 16) Multi-Purpose Flash Plus (MPF+) memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates at 2.7–3.6 V, delivers 70 ns read access time, supports hardware block protection on the top 8 KWord boot sector, and features erase-suspend/resume capability for real-time system responsiveness.
For engineers reviewing the SST39VF402C-70-4C-B3KE-T datasheet, SST39VF402C-70-4C-B3KE-T pinout, SST39VF402C-70-4C-B3KE-T application, or SST39VF402C-70-4C-B3KE-T equivalent, this page provides verified package mapping (48-ball WFBGA), JEDEC-compliant x16 parallel interface timing, boot-block protection address range (3E000H–3FFFFH), and validated alternatives for firmware update subsystems requiring reliable, low-voltage flash with fast word-program (7 µs typical).
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional NOR flash. Its command-set follows JEDEC-standard x16 pinouts and supports three software protection modes: hardware WP#-based top-boot block lock, six-byte sector/block-erase sequences, and three-byte word-program initiation.
The SST39VF402C-70-4C-B3KE-T integrates dual status detection: RY/BY# open-drain output (requires external 10–100 kΩ pull-up) and dual-bit polling (DQ7 for data validity, DQ6/DQ2 for toggle-based operation completion). It supports CFI Query mode via 555H/98H sequence and includes factory-programmed 128-bit Security ID plus user-programmable 128-word segment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16 (4 Mbit total); enables direct connection to 16-bit microcontroller data buses without glue logic |
| Read Access Time | 70 ns (max); meets timing requirements for 14 MHz bus interfaces in legacy industrial MCUs |
| Supply Voltage Range | 2.7–3.6 V; compatible with single-supply 3.3 V systems and brown-out tolerant down to 2.7 V |
| Endurance | 100,000 program/erase cycles (typical); supports field firmware updates over 10+ years in deployed equipment |
| Data Retention | >100 years (typical); ensures configuration integrity across product lifecycle without refresh |
| Word-Program Time | 7 µs (typical); reduces firmware patch latency versus standard NOR flash (e.g., 15–25 µs) |
| Block-Erase Time | 18 ms (typical); enables rapid reconfiguration of functional modules without full chip erase |
| Security ID | 128-bit factory ID + 128-word user space; supports secure boot authentication and device binding |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, optimized for high-density PCB layouts in space-constrained industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Latched on falling edge of CE# or WE#; A17 is most significant bit for 256K addressing (00000H–3FFFFH) |
| DQ0–DQ15 | Data I/O (x16) | Tri-state outputs when OE# or CE# high; latched during write; support JEDEC-standard data polling (DQ7) and toggle (DQ6/DQ2) |
| CE# | Chip Enable | Active-low selection; device enters standby (3 µA) when high; required low for all write/erase commands |
| OE# | Output Enable | Active-low gating of DQ outputs; must be low with CE# low for valid read data |
| WE# | Write Enable | Controls latching of address/data; rising edge initiates internal program/erase; critical for command sequence timing |
| WP# | Hardware Write Protect | Grounded to lock top 8 KWord boot block (3E000H–3FFFFH); floating = internally pulled high = unprotected |
| RST# | Hardware Reset | Active-low; forces immediate return to read mode; required TRP min pulse width to abort ongoing operations |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low = active erase/program; requires external pull-up; supports multi-device daisy-chaining |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; decoupling capacitor placement near VDD/VSS balls critical for noise immunity during erase |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during background erase-enables GUI responsiveness in HMI systems |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access; eliminates need for software-controlled power-down sequencing |
| Uniform Sector Architecture | 2 KWord sectors enable fine-grained firmware partitioning (e.g., bootloader, app, config) without wasted erase overhead |
| Flexible Block Erase | Seven 32 KWord + one 16 KWord + two 4 KWord + one 8 KWord blocks-optimized for modular firmware updates in telecom base stations |
| SuperFlash® Reliability | Fixed 18 ms erase time regardless of accumulated cycles-eliminates runtime degradation compensation in safety-critical firmware |
| JEDEC Pinout Compliance | Direct drop-in replacement for industry-standard x16 parallel NOR flash; no PCB redesign needed for migration |
Applications
| Industrial PLC Firmware Storage | Telecom Base Station Configuration |
|---|---|
Use Scenario: Storing ladder logic firmware and I/O mapping tables in programmable logic controllers subject to temperature cycling (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware boot-block protection preventing corruption of startup routines during power faults. Use Value: 100,000-cycle endurance ensures >10 years of field updates; 70 ns access enables deterministic scan cycle timing in 10 ms PLC loops. |
Use Scenario: Holding radio parameter sets, calibration data, and protocol stacks in 4G/LTE remote radio units with frequent field upgrades. IC Role / Device Role / Timing Role: Dual-mode configuration memory supporting simultaneous read (active radio) and background erase/program (update pending). Use Value: Erase-suspend allows real-time parameter reads during 18 ms block erase-no service interruption during OTA updates. |
| Medical Device Bootloader | Automotive ECU Calibration Data |
Use Scenario: Securing certified bootloader code in Class IIa medical infusion pumps requiring FDA audit trails and anti-tamper verification. IC Role / Device Role / Timing Role: Trusted execution anchor storing signed firmware images and factory-generated Security ID for cryptographic binding. Use Value: 128-bit factory ID + locked user segment prevents cloning; top-boot protection isolates bootloader from accidental overwrite during app updates. |
Use Scenario: Storing engine calibration maps and diagnostic trouble codes in Tier-1 automotive ECUs operating under wide voltage transients (2.7–3.6 V). IC Role / Device Role / Timing Role: Robust configuration memory with brown-out tolerant programming-retains data integrity during cranking voltage dips. Use Value: 2.7 V minimum VDD enables reliable writes during cold-start conditions; >100-year retention meets OEM 15-year vehicle lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF402C-70-4C-EKE | Same die, 48-ball TFBGA (6 mm × 8 mm) package; 0.8 mm ball pitch vs. 0.5 mm in B3KE-T | Larger footprint; less suitable for ultra-compact modules but easier rework in prototyping | Select for manual assembly or thermal stress-sensitive designs where larger pad pitch improves solder joint reliability |
| MX29LV400CTTI-70G | 4 Mbit x16, 70 ns, 3.0–3.6 V only; lacks erase-suspend and Security ID; uses different command set | No real-time suspend capability; requires full erase before partial updates; no hardware security binding | Select only if cost is primary constraint and system firmware does not require concurrent read/write or secure boot features |
Compared with SST39VF402C-70-4C-B3KE-T, the TFBGA variant offers relaxed layout constraints but sacrifices board area efficiency, while the MX29LV400CTTI-70G omits critical real-time and security features-making it unsuitable for safety-certified or OTA-updatable systems.
Availability
SST39VF402C-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom base station configuration, medical device bootloaders, and automotive ECU calibration data requiring stable component supply across long production lifecycles.
Supply support for SST39VF402C-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its serial and parallel flash portfolio.
The SST39VF402C-70-4C-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered specifically for embedded systems demanding high reliability, low-voltage operation, and real-time firmware update capability in harsh environments.
FAQ
What is the boot block protection scheme for SST39VF402C-70-4C-B3KE-T?
The SST39VF402C-70-4C-B3KE-T implements top hardware block protection on the 8 KWord sector spanning addresses 3E000H–3FFFFH. When WP# is grounded, program and erase operations to this region are disabled. If WP# is left floating, an internal pull-up keeps it high, leaving the boot block unprotected-allowing full read/write access. This matches the SST39VF402C device designation per Table 4 in the datasheet.
Does SST39VF402C-70-4C-B3KE-T support both sector and block erase modes?
Yes, SST39VF402C-70-4C-B3KE-T supports uniform 2 KWord sector erase and flexible block erase using seven 32 KWord, one 16 KWord, two 4 KWord, and one 8 KWord blocks. Sector erase uses AMS–A11 address lines; block erase uses AMS–A15. Both modes require six-byte command sequences per Table 7, with erase-suspend/resume available in either mode.
How is end-of-write detection implemented in SST39VF402C-70-4C-B3KE-T?
SST39VF402C-70-4C-B3KE-T provides three end-of-write detection methods: RY/BY# open-drain output (low during operation), Data# Polling on DQ7 (complement toggles until completion), and Toggle Bits on DQ6/DQ2 (alternating 0/1 until done). DQ7 polling is valid after the fourth WE# pulse for program, sixth for erase; DQ6 toggle is valid after the sixth WE# pulse for all write operations.
What package type is used by SST39VF402C-70-4C-B3KE-T?
SST39VF402C-70-4C-B3KE-T uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), as confirmed by the "B3KE" suffix and Figure 4 in the datasheet. This ultra-compact package supports high-density routing in space-constrained industrial and medical modules, with balls arranged in A–L rows and 1–6 columns per the top-view diagram.
Can SST39VF402C-70-4C-B3KE-T operate reliably at 2.7 V during write operations?
Yes, SST39VF402C-70-4C-B3KE-T is fully specified for write (program/erase) operations across 2.7–3.6 V, unlike the SST39LF402C which requires 3.0–3.6 V. The datasheet explicitly states "2.7–3.6V for SST39VF401C/402C" in Features and Product Description sections, and VDD min/max values in Table 9 confirm 2.7 V (27H) and 3.6 V (36H) for program/erase.
SST39VF402C-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF402C-70-4C-B3KE-T FAQ
1.How can I place an order for SST39VF402C-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF402C-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF402C-70-4C-B3KE-T reliable?
The price and inventory of SST39VF402C-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF402C-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF402C-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF402C-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF402C-70-4C-B3KE-T?
SST39VF402C-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF402C-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF402C-70-4C-B3KE-T?
For technical support, including SST39VF402C-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF402C-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39VF402C-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF402C-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF402C-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF402C-70-4C-B3KE-T?
All SST39VF402C-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF402C-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF402C-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF402C-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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