Microchip Technology SST39VF402C-70-4I-EKE-T
- Part No.:
- SST39VF402C-70-4I-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF402C-70-4I-EKE-T.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,737
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF402C-70-4I-EKE-T from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates at 2.7–3.6 V, delivers 70 ns read access time, supports hardware top-block protection (3E000H–3FFFFH), and features erase-suspend/resume capability for real-time system responsiveness.
For engineers reviewing the SST39VF402C-70-4I-EKE-T datasheet, SST39VF402C-70-4I-EKE-T pinout, SST39VF402C-70-4I-EKE-T application, or SST39VF402C-70-4I-EKE-T equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block architecture, and validated alternatives for firmware update systems requiring high endurance and low-power standby operation.
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed 18 ms sector/block-erase and 7 µs word-program times independent of program/erase cycle count. Its command-set follows JEDEC-standard x16 flash protocols, including six-byte erase sequences and three-byte program initiation.
The SST39VF402C-70-4I-EKE-T integrates hardware block protection via WP# pin for the top 8 KWord boot sector (3E000H–3FFFFH), RY/BY# open-drain status output, and dual status detection (DQ6 toggle + DQ7 polling) for non-blocking write completion monitoring during active system operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization); supports 16-bit parallel data bus interface. |
| Read Access Time | 70 ns maximum; enables direct execution from flash (XIP) in microcontroller-based systems without wait states at moderate clock speeds. |
| Supply Voltage | 2.7–3.6 V; compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V during active programming. |
| Endurance | 100,000 program/erase cycles (typical); sufficient for field firmware updates over 10+ years in industrial control applications. |
| Data Retention | Greater than 100 years; ensures long-term reliability of stored bootloader and calibration data without refresh. |
| Standby Current | 3 µA typical; reduces power budget in battery-backed or energy-harvested edge devices during idle periods. |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (seven 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord); allows granular firmware partitioning. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC x16 flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus; AMS = A17 selects top/bottom boot block during erase operations per JEDEC standard. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; outputs latched during read, inputs latched on WE#/CE# edges; tri-state when OE# or CE# high. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required low for all write/erase commands. |
| OE# | Output Enable | Active-low output gate; controls data bus drive; must be low with CE# low for valid read access. |
| WE# | Write Enable | Active-low control for write/erase command latching; rising edge initiates internal program/erase timing. |
| WP# | Write Protect | Hardware top-boot block lock; grounded to prevent accidental erase/program of 3E000H–3FFFFH region. |
| RST# | Reset | Active-low hardware reset; terminates ongoing erase/program and forces return to read mode within TRP. |
| RY/BY# | Ready/Busy# | Open-drain status output; requires external 10–100 kΩ pull-up; low = active erase/program, high = ready. |
| VDD | Power Supply | 2.7–3.6 V supply; powers core logic and SuperFlash® array; internal VPP generation eliminates external charge pump. |
| VSS | Ground | System reference ground; two dedicated pins ensure stable return path for high-speed read/write transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during active erase, enabling background firmware updates without halting system operation. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read access, cutting dynamic power by >99% during sequential instruction fetch. |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space; supports secure device authentication and firmware binding. |
| JEDEC Pinout Compliance | Direct drop-in replacement for industry-standard x16 flash devices; eliminates PCB redesign when migrating from legacy parallel NOR flash. |
| Toggle Bit + Data# Polling | Dual-status detection (DQ6 toggle + DQ7 polling) enables robust, interrupt-driven write completion handling without polling overhead or timing margin uncertainty. |
Applications
| Industrial PLC Firmware Storage | Telecom Baseband Configuration |
|---|---|
Use Scenario: Storing field-upgradable ladder logic and I/O mapping tables in programmable logic controllers operating in harsh temperature environments. IC Role / Device Role / Timing Role: Nonvolatile firmware storage with hardware top-block protection for bootloader integrity and sector-erase granularity for modular firmware patches. Use Value: 100,000-cycle endurance and >100-year data retention ensure reliable operation across 15+ year product lifecycles without recalibration or replacement. |
Use Scenario: Holding RF calibration coefficients, protocol stack parameters, and baseband initialization code in 4G/LTE small-cell radio units. IC Role / Device Role / Timing Role: Parallel x16 configuration memory accessed directly by DSP during boot; RY/BY# enables concurrent processing while flash erases background sectors. Use Value: 70 ns read access and erase-suspend capability reduce boot time and support real-time parameter updates without service interruption. |
| Medical Diagnostic Device Bootloader | Automotive Infotainment System BIOS |
Use Scenario: Securing certified bootloader code and regulatory compliance signatures in FDA-cleared imaging equipment with audit-trail requirements. IC Role / Device Role / Timing Role: Trusted firmware root-of-trust storage with factory-programmed Security ID and user-lockable segment for cryptographic key binding. Use Value: Hardware WP# protection of top boot block prevents unauthorized modification of bootloader, satisfying IEC 62304 software safety classification. |
Use Scenario: Storing UEFI-compatible BIOS images and vehicle-specific configuration profiles in automotive head units with OTA update capability. IC Role / Device Role / Timing Role: High-reliability flash memory supporting dual-bank firmware updates; block-erase architecture isolates active and staging banks during atomic swap. Use Value: Fixed 18 ms erase time and 7 µs program time enable predictable OTA update windows under AEC-Q100 Grade 3 temperature stress (−40°C to +105°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF401C-70-4I-EKE-T | Bottom-boot architecture (00000H–01FFFH protected); identical timing, voltage, and package. | Requires firmware image relocation to bottom boot block; unsuitable where top-boot layout is fixed in existing design. | Select only if board-level WP# routing targets bottom block and bootloader resides there. |
| MX29LV400CTTI-70G | 70 ns access, 4 Mbit x16, but uses different command set (no erase-suspend) and lacks Security ID feature. | Compatible for basic read/write storage but cannot support real-time firmware patching or secure device identity binding. | Choose when cost sensitivity outweighs need for suspend/resume or hardware security features. |
Compared with SST39VF402C-70-4I-EKE-T, the SST39VF401C variant offers identical performance but inverted boot-block orientation, while the MX29LV400CTTI-70G provides pin-compatible JEDEC timing but omits critical firmware update and security capabilities essential for modern embedded systems.
Availability
SST39VF402C-70-4I-EKE-T is available at Aetrix Electronics and suitable for industrial PLCs, telecom base stations, medical diagnostic instruments, and automotive infotainment systems requiring stable component supply across extended product lifecycles.
Supply support for SST39VF402C-70-4I-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and now manufactures and supports the SuperFlash® family of NOR flash products.
The SST39VF402C-70-4I-EKE-T belongs to Microchip's Multi-Purpose Flash Plus (MPF+) product line, engineered specifically for embedded systems needing high endurance, fast parallel access, and hardware-assisted firmware security in space-constrained industrial and automotive applications.
FAQ
What is the boot-block configuration of SST39VF402C-70-4I-EKE-T?
The SST39VF402C-70-4I-EKE-T implements top-boot block protection, covering address range 3E000H–3FFFFH (8 KWord). This region is hardware-protected when WP# is grounded, ensuring bootloader integrity. The device does not support bottom-boot configuration - that functionality is exclusive to the SST39VF401C variant.
Does SST39VF402C-70-4I-EKE-T require an external VPP voltage for programming?
No, SST39VF402C-70-4I-EKE-T uses internal VPP generation for all program and erase operations. Only a single 2.7–3.6 V supply (VDD) is required - no external high-voltage source or charge pump circuitry is needed, simplifying power design and reducing bill-of-materials cost.
How does the erase-suspend feature work in SST39VF402C-70-4I-EKE-T?
The SST39VF402C-70-4I-EKE-T supports Erase-Suspend via the B0H command, pausing an active sector or block erase to allow reads from unprotected regions or word-programming in non-suspended areas. Resume uses the 30H command. DQ2 toggling indicates erase-suspended status, enabling deterministic real-time system behavior during firmware updates.
What package type is used in SST39VF402C-70-4I-EKE-T?
SST39VF402C-70-4I-EKE-T is supplied in a 48-lead TSOP (Thin Small Outline Package), 12 mm × 20 mm body size, with standard JEDEC pinout for x16 parallel flash. It is RoHS-compliant and compatible with reflow soldering processes per J-STD-020.
Can SST39VF402C-70-4I-EKE-T be used as a direct replacement for older SST39VF400 series devices?
No - SST39VF402C-70-4I-EKE-T is not a pin- or command-compatible replacement for SST39VF400 devices. It belongs to the enhanced MPF+ family with updated command sequences, erase-suspend support, and Security ID features absent in the legacy SST39VF400 series. Migration requires firmware and timing validation.
SST39VF402C-70-4I-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF402C-70-4I-EKE-T FAQ
1.How can I place an order for SST39VF402C-70-4I-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF402C-70-4I-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF402C-70-4I-EKE-T reliable?
The price and inventory of SST39VF402C-70-4I-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF402C-70-4I-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39VF402C-70-4I-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF402C-70-4I-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF402C-70-4I-EKE-T?
SST39VF402C-70-4I-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF402C-70-4I-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF402C-70-4I-EKE-T?
For technical support, including SST39VF402C-70-4I-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF402C-70-4I-EKE-T requirements.
6.How does Aetrix verify that SST39VF402C-70-4I-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF402C-70-4I-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF402C-70-4I-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39VF402C-70-4I-EKE-T?
All SST39VF402C-70-4I-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF402C-70-4I-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF402C-70-4I-EKE-T part is unused and in its original packaging.
Return procedure for SST39VF402C-70-4I-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF402C-70-4I-EKE-T Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

