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Microchip Technology SST39VF6402B-70-4C-B1KE
- Part No.:
- SST39VF6402B-70-4C-B1KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF6402B-70-4C-B1KE.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,928
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Product details
Overview
SST39VF6402B-70-4C-B1KE from Microchip Technology is a 64 Mbit (4M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with top-block hardware write protection, 70 ns read access time, and single 2.7–3.6 V supply operation. It supports sector/block/chip erase, erase-suspend/resume, and Security ID functionality, and is used in embedded firmware storage for industrial controllers and legacy communication modules.
For engineers reviewing the SST39VF6402B-70-4C-B1KE datasheet, SST39VF6402B-70-4C-B1KE pinout, SST39VF6402B-70-4C-B1KE application, or SST39VF6402B-70-4C-B1KE equivalent, key selection considerations include top-boot block protection address range (3F8000H–3FFFFFH), JEDEC x16 pin compatibility, SuperFlash endurance (100,000 cycles), and Auto Low Power mode (3 µA standby).
Technical Context
This device implements SuperFlash technology with split-gate cell design and thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. It uses standard microprocessor bus timing with latched address/data and supports JEDEC-standard command sequences for sector/block/chip operations.
Hardware block protection is activated via WP# pin grounding to lock the top 32 KWord boot block (3F8000H–3FFFFFH). The RST# pin provides hardware reset to Read mode, and CFI query mode enables runtime identification of geometry and timing parameters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4M × 16 (64 Mbit total; 23-bit addressing) |
| Read Access Time | 70 ns - determines maximum sustained read throughput in synchronous bus systems |
| Supply Voltage | 2.7–3.6 V - single-supply operation compatible with 3.3 V logic domains |
| Endurance | 100,000 program/erase cycles - specifies guaranteed rewrite lifetime before wear-out |
| Data Retention | >100 years - ensures nonvolatile data integrity without refresh in powered-off state |
| Active Current | 9 mA typical at 5 MHz - defines dynamic power budget during active read bursts |
| Standby Current | 3 µA typical - enables ultra-low-power hold state in battery-backed or energy-constrained systems |
| Erase Time | Sector/Block: 18 ms typical; Chip: 40 ms typical - sets minimum firmware update latency |
Pinout & Package
Package: 48-ball TFBGA (8 mm × 10 mm) and 48-lead TSOP (12 mm × 20 mm); both RoHS-compliant and JEDEC-standard x16 flash pinouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus; AMS = A21 selects top/bottom boot block during erase commands |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write/erase operations |
| OE# | Output Enable | Active-low output gate; controls DQ bus drive during read; high disables outputs |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Write Protect | Grounding protects top 32 KWord boot block (3F8000H–3FFFFFH); floating = unprotected |
| RST# | Reset | Hardware abort of ongoing erase/program; forces return to Read mode within TRP |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; dual ground pins support noise isolation in high-speed bus layouts |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Enables real-time read access during erase; allows firmware updates without halting system operation |
| Security ID | 256-bit space (128-bit factory + 128-bit user); supports secure boot authentication and device binding |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid read; no access penalty on wake-up |
| Hardware Block Protection | Top-boot configuration prevents accidental overwrite of bootloader code in field-deployed systems |
| CFI Query Support | Runtime discovery of device geometry, timing, and command set - simplifies driver portability across flash families |
Applications
| Industrial PLC Firmware Storage | Legacy Telecom Baseband Module |
|---|---|
|
Use Scenario: Storing programmable logic controller firmware images that require field updates via serial interface. IC Role / Device Role / Timing Role: Nonvolatile program memory with top-boot protection to preserve bootloader integrity during partial reflash. Use Value: 100,000-cycle endurance and >100-year retention ensure long-term reliability in unattended installations. |
Use Scenario: Holding DSP configuration tables and protocol stacks in E1/T1 line cards with limited board space. IC Role / Device Role / Timing Role: x16 asynchronous flash memory interfaced directly to 16-bit microcontroller address/data bus. Use Value: 70 ns access time meets timing margins for 12.5 MHz bus clock; TFBGA package fits dense telecom PCB layouts. |
| Medical Diagnostic Equipment Bootloader | Automotive Body Control Module (Legacy) |
|
Use Scenario: Secure storage of certified bootloader code requiring tamper-resistant execution verification. IC Role / Device Role / Timing Role: Trusted firmware root-of-trust anchor using factory-programmed 128-bit Security ID segment. Use Value: Hardware WP# lock prevents unauthorized modification of boot code; CFI query enables runtime validation. |
Use Scenario: Storing vehicle-specific calibration maps and CAN message routing logic in pre-2010 BCM designs. IC Role / Device Role / Timing Role: JEDEC-compatible x16 flash supporting legacy 8051/16-bit MCU interfaces with minimal glue logic. Use Value: Sector-erase capability enables incremental map updates without full chip reprogramming downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF6402B-70-4C-EKE | Same die, 48-ball TFBGA package with different ball pitch (0.8 mm vs. 0.75 mm) and moisture sensitivity level (MSL 3 vs. MSL 4) | Requires PCB land pattern revision; identical firmware compatibility and timing behavior | Select for higher-volume assembly where tighter pitch improves board density and MSL 3 enables longer floor life |
| SST38VF6402-70-4C-B3KE | Newer generation; same 64 Mbit x16 organization but enhanced SuperFlash with 200K endurance and 200-year retention | Drop-in replacement in most designs; requires updated CFI parsing due to extended parameter table | Preferred for new designs per Microchip recommendation; offers extended lifecycle and improved reliability margin |
Compared with SST39VF6402B-70-4C-B1KE, SST39VF6402B-70-4C-EKE differs only in mechanical packaging and handling specs, while SST38VF6402-70-4C-B3KE delivers measurable improvements in endurance and retention - making it the recommended upgrade path for production continuity and long-term reliability.
Availability
SST39VF6402B-70-4C-B1KE is available at Aetrix Electronics and suitable for industrial automation, legacy telecom infrastructure, and medical diagnostic equipment requiring stable component supply and long-lifecycle support.
Supply support for SST39VF6402B-70-4C-B1KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with emphasis on embedded control and reliability-critical applications.
The SST39VF6402B belongs to Microchip's Multi-Purpose Flash Plus (MPF+) product line, designed specifically for cost-sensitive, high-reliability embedded systems requiring robust firmware storage with hardware-based protection and industry-standard command compatibility.
FAQ
What does the "B1KE" suffix indicate in SST39VF6402B-70-4C-B1KE?
The "B1KE" suffix denotes a specific packaging and environmental variant: "B" = commercial temperature grade (0°C to +70°C), "1" = 48-ball TFBGA package, "K" = lead-free/RoHS-compliant finish, and "E" = tape-and-reel packaging. This matches the 48-ball TFBGA (8 mm × 10 mm) configuration confirmed in the datasheet Figure 3 and Table 1.
Does SST39VF6402B-70-4C-B1KE support both sector and block erase modes?
Yes, SST39VF6402B-70-4C-B1KE supports uniform 2 KWord sector erase and uniform 32 KWord block erase. Sector-erase uses command 50H with AMS–A11 address lines; block-erase uses command 30H with AMS–A15 address lines. Both operations complete in 18 ms typical, as verified in the datasheet Section "Sector/Block-Erase Operation" and Table 6.
How is hardware write protection implemented on SST39VF6402B-70-4C-B1KE?
SST39VF6402B-70-4C-B1KE implements top-block hardware protection: grounding the WP# pin prevents program/erase operations on the top 32 KWord boot block (address range 3F8000H–3FFFFFH). If WP# floats, an internal pull-up keeps it high and disables protection. This is explicitly defined in Table 3 and Section "Hardware Block Protection" of the datasheet.
What is the purpose of the RST# pin on SST39VF6402B-70-4C-B1KE?
The RST# pin on SST39VF6402B-70-4C-B1KE provides hardware-initiated reset to Read mode. Holding RST# low for ≥TRP (reset pulse width) terminates any in-progress erase or program operation and returns the device to read array state. After RST# goes high, a minimum TRHR delay is required before valid reads resume, as specified in Figure 16 and Section "Hardware Reset (RST#)".
Can SST39VF6402B-70-4C-B1KE be used in industrial temperature applications?
No - SST39VF6402B-70-4C-B1KE is rated for commercial temperature range (0°C to +70°C) only, as indicated by the "B" in its suffix and confirmed in Table 10 ("Operating Range"). For industrial (-40°C to +85°C) use, Microchip specifies SST39VF6402B-70-4I-B1KE (suffix "I"), which shares identical electrical specs but undergoes extended temperature qualification.
SST39VF6402B-70-4C-B1KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF6402B-70-4C-B1KE FAQ
1.How can I place an order for SST39VF6402B-70-4C-B1KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF6402B-70-4C-B1KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF6402B-70-4C-B1KE reliable?
The price and inventory of SST39VF6402B-70-4C-B1KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF6402B-70-4C-B1KE is usually 5 days.
3.What payment methods are accepted for SST39VF6402B-70-4C-B1KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF6402B-70-4C-B1KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF6402B-70-4C-B1KE?
SST39VF6402B-70-4C-B1KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF6402B-70-4C-B1KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF6402B-70-4C-B1KE?
For technical support, including SST39VF6402B-70-4C-B1KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF6402B-70-4C-B1KE requirements.
6.How does Aetrix verify that SST39VF6402B-70-4C-B1KE is sourced from the original manufacturer or authorized distributors?
All SST39VF6402B-70-4C-B1KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF6402B-70-4C-B1KE meets industry standards.
7.What is the process for return or replacement of SST39VF6402B-70-4C-B1KE?
All SST39VF6402B-70-4C-B1KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF6402B-70-4C-B1KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF6402B-70-4C-B1KE part is unused and in its original packaging.
Return procedure for SST39VF6402B-70-4C-B1KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF6402B-70-4C-B1KE Tags
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