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Microchip Technology SST39VF800A-70-4I-EKE-T
- Part No.:
- SST39VF800A-70-4I-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF800A-70-4I-EKE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:844
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Product details
Overview
SST39VF800A-70-4I-EKE-T from Microchip Technology is an 8 Mbit (512K × 16) CMOS Multi-Purpose Flash memory IC with x16 asynchronous interface, 70 ns read access time, 2.7–3.6 V single-supply operation, and JEDEC-standard pinout. It delivers uniform 2 KWord sector and 32 KWord block erase, 14 µs word-program time, and >100 years data retention for embedded firmware storage in industrial controllers.
For engineers reviewing the SST39VF800A-70-4I-EKE-T datasheet, SST39VF800A-70-4I-EKE-T pinout, SST39VF800A-70-4I-EKE-T application, or SST39VF800A-70-4I-EKE-T equivalent, this page provides verified package mapping (48-ball TFBGA), SuperFlash technology advantages, hardware/software data protection, CFI support, and real-world timing behavior for system integration.
Technical Context
The SST39VF800A-70-4I-EKE-T implements SST's proprietary SuperFlash split-gate cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. Its command-set follows JEDEC standard x16 flash protocols, including six-byte software data protection sequences for sector/block/chip erase and word-program operations.
It supports three end-of-write detection methods-Data# Polling (DQ7), Toggle Bit (DQ6), and CFI Query-and operates across -40°C to +85°C with 2.7–3.6 V supply. The device uses latched address/data inputs and tri-state outputs controlled by CE#, OE#, and WE# signals, conforming to standard microprocessor bus timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16), providing 1 MB of nonvolatile storage for boot code or configuration data |
| Read Access Time | 70 ns - determines maximum sustained read throughput in CPU-bus-coupled systems |
| Supply Voltage | 2.7–3.6 V - enables direct compatibility with 3.3 V logic rails without level-shifting |
| Endurance | 100,000 program/erase cycles - supports field-upgradable firmware with multi-year service life |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications |
| Word-Program Time | 14 µs typical - defines minimum write latency per 16-bit word during firmware updates |
| Erase Granularity | 2 KWord sectors / 32 KWord blocks - allows selective reprogramming without full-chip erasure |
Pinout & Package
Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), 6 mm × 8 mm, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | A0–A17 used for 512K×16 addressing; A18 selects upper half of 8 Mbit array in block erase mode |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus with internal latching; high-impedance when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select - disables device and reduces current to 20 µA standby when high |
| OE# | Output Enable | Active-low output gate - controls data bus visibility without affecting internal state |
| WE# | Write Enable | Active-low control for all write operations; latches command/address/data on edge transitions |
| VDD | Power Supply | 2.7–3.6 V supply input; powers core logic and memory array |
| VSS | Ground | Two dedicated ground balls (pins E8, H1) for low-noise reference and thermal dissipation |
| NC | No Connection | Unbonded pads (e.g., B1, C1, D1, F1, G1) - must remain floating per design |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide injector enables fixed 14 µs program and 18 ms erase times across full endurance life |
| Hardware + Software Protection | Glitch immunity (<5 ns), VDD power-up/down detection, and mandatory 6-byte SDP command sequence prevent accidental writes |
| JEDEC x16 Standard Compliance | Pinout, command set, and timing match industry-standard parallel flash interfaces for drop-in replacement in legacy designs |
| CFI Query Support | Enables runtime identification of geometry, voltage, and timing parameters via standardized 3-byte entry sequence at 5555H |
| Uniform Erase Architecture | 256 sectors (4 KB each) and 16 blocks (64 KB each) simplify partitioning of firmware, config, and log storage regions |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to CPU address space; accessed via standard 16-bit parallel bus with 70 ns read latency. Use Value: 100,000-cycle endurance and >100-year retention ensure reliable operation over 15+ year product lifecycles without recalibration or replacement. | Use Scenario: Holding calibrated sensor offsets, user preferences, and regulatory-compliant device settings in portable diagnostic equipment. IC Role / Device Role / Timing Role: Configuration EEPROM replacement with faster write performance and deterministic 14 µs word-program timing. Use Value: Sector-erase capability allows safe overwriting of calibration data without disturbing firmware or safety-critical boot code partitions. |
| Automotive Infotainment Boot ROM | Networking Equipment Image Storage |
Use Scenario: Storing primary bootloader and secure boot keys in automotive head units operating across -40°C to +85°C ambient range. IC Role / Device Role / Timing Role: Read-only memory during boot sequence; supports fast 70 ns access to accelerate cold-start time. Use Value: Industrial temperature rating (-40°C to +85°C) and 2.7–3.6 V supply range ensure robust operation under vehicle battery fluctuations and thermal stress. | Use Scenario: Holding dual firmware images (active/backup) and FPGA configuration bitstreams in enterprise switches and routers. IC Role / Device Role / Timing Role: Dual-image storage with atomic update via block-erase - enables fail-safe firmware rollback after power loss. Use Value: 32 KWord block erase (18 ms typical) allows rapid switching between firmware versions without extended downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF800A-70-4C-EKE-T | Commercial temperature grade (0°C to +70°C) vs. industrial (-40°C to +85°C); identical electrical specs and pinout | Not rated for extended thermal environments; unsuitable for outdoor or under-hood automotive use | Select only for cost-sensitive consumer-grade applications with controlled ambient conditions |
| MX29LV800CTTI-70G | Same density and 70 ns speed, but uses different command set (non-JEDEC-compatible); requires firmware driver modification | Lacks CFI query support and has slower chip-erase (100 ms vs. 70 ms typical) | Use only when existing design already supports Macronix command protocol and thermal requirements align |
Compared with SST39VF800A-70-4I-EKE-T, the -4C variant trades industrial temperature tolerance for lower cost, while MX29LV800CTTI-70G requires driver-level changes and offers no CFI runtime identification - making SST39VF800A-70-4I-EKE-T preferable for new designs requiring field-upgradability and broad environmental resilience.
Availability
SST39VF800A-70-4I-EKE-T is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, automotive infotainment, and networking equipment requiring stable component supply and long-term lifecycle support.
Supply support for SST39VF800A-70-4I-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF800A-70-4I-EKE-T belongs to the SST39VF family of Multi-Purpose Flash devices designed for cost-effective, reliable firmware and configuration storage in resource-constrained embedded systems with wide temperature and voltage operating ranges.
FAQ
What is the exact memory organization of the SST39VF800A-70-4I-EKE-T?
The SST39VF800A-70-4I-EKE-T is organized as 512K words × 16 bits, totaling 8 Mbit (1,048,576 bytes). This structure supports byte-wide or word-wide access depending on system bus configuration, and maps directly to standard 16-bit microprocessor data buses without external data-width conversion logic.
Does the SST39VF800A-70-4I-EKE-T require an external VPP voltage for programming?
No, the SST39VF800A-70-4I-EKE-T does not require an external VPP voltage. It generates all necessary high-voltage programming pulses internally using its on-chip charge pump, enabling single 2.7–3.6 V supply operation for both read and write functions - a key advantage over older flash technologies.
How many erase sectors and blocks does the SST39VF800A-70-4I-EKE-T support?
The SST39VF800A-70-4I-EKE-T supports 256 uniform sectors of 2 KWords (4 KB) each and 16 uniform blocks of 32 KWords (64 KB) each. This hierarchical erase architecture allows fine-grained updates (e.g., parameter tables) or bulk reprogramming (e.g., full firmware images) without compromising data integrity in adjacent regions.
Is the SST39VF800A-70-4I-EKE-T compatible with JEDEC-standard x16 flash controllers?
Yes, the SST39VF800A-70-4I-EKE-T conforms fully to JEDEC standard pinouts and command sets for x16 parallel flash memory. It supports standard read, word-program, sector-erase, block-erase, and chip-erase commands, and is interoperable with existing JEDEC-compliant flash controllers and bootloader firmware.
What package type is used for the SST39VF800A-70-4I-EKE-T?
The SST39VF800A-70-4I-EKE-T uses a 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 6 mm × 8 mm. This RoHS-compliant, lead-free package supports automated SMT assembly and provides superior thermal and electrical performance compared to TSOP alternatives, especially in high-density PCB layouts.
SST39VF800A-70-4I-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF800A-70-4I-EKE-T FAQ
1.How can I place an order for SST39VF800A-70-4I-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF800A-70-4I-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF800A-70-4I-EKE-T reliable?
The price and inventory of SST39VF800A-70-4I-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF800A-70-4I-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39VF800A-70-4I-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF800A-70-4I-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF800A-70-4I-EKE-T?
SST39VF800A-70-4I-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF800A-70-4I-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF800A-70-4I-EKE-T?
For technical support, including SST39VF800A-70-4I-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF800A-70-4I-EKE-T requirements.
6.How does Aetrix verify that SST39VF800A-70-4I-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF800A-70-4I-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF800A-70-4I-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39VF800A-70-4I-EKE-T?
All SST39VF800A-70-4I-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF800A-70-4I-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF800A-70-4I-EKE-T part is unused and in its original packaging.
Return procedure for SST39VF800A-70-4I-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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