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Microchip Technology SST39VF801C-70-4C-B3KE
- Part No.:
- SST39VF801C-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF801C-70-4C-B3KE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,181
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Product details
Overview
SST39VF801C-70-4C-B3KE from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates at 2.7–3.6 V, delivers 70 ns read access time, supports hardware block protection on the bottom 8 KWord boot sector, and features sector/block/chip erase with erase-suspend/resume capability.
For engineers reviewing the SST39VF801C-70-4C-B3KE datasheet, SST39VF801C-70-4C-B3KE pinout, SST39VF801C-70-4C-B3KE application, or SST39VF801C-70-4C-B3KE equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block protection mapping, SuperFlash® endurance and retention specs, and real-world use cases in legacy industrial systems requiring field-upgradable firmware.
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector-erase times independent of cycle count. It uses standard microprocessor bus timing with latched address/data and supports three software status detection methods: Data# Polling (DQ7), Toggle Bit (DQ6/DQ2), and Ready/Busy# (open-drain RY/BY#).
The SST39VF801C-70-4C-B3KE conforms to JEDEC-standard x16 flash pinouts and command sets, includes hardware write protection via WP# for bottom boot block (00000H–01FFFH), and integrates Security ID space with factory-programmed 128-bit ID and 128-word user-programmable segment-locked after programming to prevent corruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 16 (8 Mbit total); enables direct 16-bit data bus interfacing without byte-lane multiplexing |
| Read Access Time | 70 ns (max); guarantees deterministic timing for 14 MHz synchronous read operation in legacy microcontroller systems |
| Supply Voltage | 2.7–3.6 V; compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V |
| Endurance | 100,000 program/erase cycles (typical); supports frequent firmware updates in field-deployed equipment |
| Data Retention | >100 years (typical); ensures long-term reliability in unattended industrial applications |
| Active Current | 5 mA (typical at 5 MHz); low power consumption during active reads reduces thermal load in dense PCB layouts |
| Standby Current | 3 µA (typical); enables ultra-low-power sleep mode in battery-backed or energy-constrained systems |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side solder ball layout per Figure 4 in DS25041A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | AMS = A18; A18–A0 provide full 512K-word addressing; AMS–A11 select sector, AMS–A15 select block |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; outputs tri-stated when CE# or OE# high; latched internally during writes |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required low for all operations |
| OE# | Output Enable | Active-low output gate; controls DQ0–DQ15 drive; high disables outputs regardless of CE# state |
| WE# | Write Enable | Active-low control for program/erase; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Hardware Write Protect | Grounding protects bottom 8 KWord boot block (00000H–01FFFH); floating = internal pull-up = unprotected |
| RST# | Hardware Reset | Active-low reset; terminates ongoing program/erase and forces return to read mode within TRP |
| RY/BY# | Ready/Busy# | Open-drain status indicator; requires external 10–100 kΩ pull-up; low = operation in progress |
| VDD | Power Supply | 2.7–3.6 V supply; powers core logic and SuperFlash® array; decoupling required per layout guidelines |
| VSS | Ground | Reference ground for all signals; two dedicated VSS pins ensure stable reference under switching noise |
| NC | No Connection | Unbonded pins (e.g., A13, A9, A10 in WFBGA); must be left unconnected or tied to VSS per design rules |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide tunneling injector enables fixed 7 µs program and 18 ms erase times across full lifecycle |
| Bottom Boot Block Protection | Hardware WP#-enabled protection of 8 KWord (00000H–01FFFH) for secure bootloader storage |
| Erase-Suspend/Resume | Allows temporary suspension of sector/block erase to read other locations or program unprotected sectors |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user-programmable segment, lockable to prevent overwrite |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read access, with zero access-time penalty on wake |
| JEDEC Compliance | Fully compliant with JEDEC standard pinouts and command sets for x16 flash, ensuring drop-in compatibility |
Applications
| Industrial PLC Firmware Storage | Telecom Line Card Configuration |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to microcontroller's 16-bit data bus; accessed via CE#/OE#/WE# handshake with 70 ns timing. Use Value: Bottom boot block protection ensures bootloader integrity during field firmware upgrades; 100,000-cycle endurance supports decades of maintenance cycles. |
Use Scenario: Holding configuration profiles and DSP parameter sets for TDM-based line cards in legacy telecom switches. IC Role / Device Role / Timing Role: x16 parallel flash memory providing fast read access for initialization and runtime parameter loading. Use Value: Erase-suspend capability allows real-time diagnostics during background reconfiguration without service interruption. |
| Medical Device Bootloader | Automotive Diagnostic Module |
Use Scenario: Secure storage of certified bootloader code in Class II medical instruments requiring regulatory traceability. IC Role / Device Role / Timing Role: Protected boot memory region (00000H–01FFFH) isolated by WP#; accessed only during cold start. Use Value: Factory-programmed Security ID enables device authentication; >100-year data retention meets FDA long-term record requirements. |
Use Scenario: Storing OBD-II protocol stacks and calibration tables in aftermarket diagnostic tools operating in automotive 12 V environments. IC Role / Device Role / Timing Role: 2.7–3.6 V operation tolerates vehicle battery fluctuations; RY/BY# pin enables host MCU to manage concurrent tasks. Use Value: Auto low power mode extends battery life during intermittent usage; sector-erase permits selective update of calibration data without full chip erase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-B3KE | Top-boot architecture (7E000H–7FFFFH protected); identical timing, voltage, and package | Used where bootloader resides in top sector instead of bottom; not interchangeable without firmware address remapping | Select only if system firmware expects top-boot layout and WP# protection targets upper 8 KWord |
| MX29LV800CTTC-70G | Same 8 Mbit x16 organization, 70 ns access, but uses different command set and lacks erase-suspend/resume | Requires modified driver software; no hardware boot-block protection-relies solely on software locking | Choose when cost sensitivity outweighs need for advanced suspend/resume or hardware WP# security |
Compared with SST39VF801C-70-4C-B3KE, the SST39VF802C variant shifts protected boot region to top address space-requiring firmware alignment-while the MX29LV800CTTC offers lower cost but sacrifices erase-suspend functionality and hardware block protection, increasing software validation burden.
Availability
SST39VF801C-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom line card configuration, medical device bootloaders, and automotive diagnostic modules requiring stable component supply across extended product lifecycles.
Supply support for SST39VF801C-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now designs, manufactures, and supports the SST39VF family of high-reliability flash memories.
The SST39VF801C-70-4C-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered specifically for legacy industrial and communications systems needing JEDEC-compatible, low-voltage, high-endurance parallel flash with hardware boot protection.
FAQ
What is the boot block configuration of the SST39VF801C-70-4C-B3KE?
The SST39VF801C-70-4C-B3KE implements bottom boot block protection: the lowest 8 KWord (00000H–01FFFH) is hardware-protected when WP# is grounded. This matches Table 4 and Table 2 in DS25041A, distinguishing it from the top-boot SST39VF802C variant. The SST39VF801C-70-4C-B3KE uses this layout to safeguard bootloader code in systems where firmware starts execution from low memory addresses.
Does the SST39VF801C-70-4C-B3KE require an external VPP voltage?
No, the SST39VF801C-70-4C-B3KE does not require external VPP. Internal charge pump generation supplies all necessary high-voltage programming/erasing functions from the single 2.7–3.6 V VDD rail. Table 9 in DS25041A explicitly lists VPP min/max as 0000H, confirming no VPP pin or external voltage source is needed for SST39VF801C-70-4C-B3KE operation.
How is end-of-write detection implemented in the SST39VF801C-70-4C-B3KE?
The SST39VF801C-70-4C-B3KE supports three simultaneous end-of-write detection methods: Data# Polling (DQ7 toggles until completion), Toggle Bit (DQ6 toggles during operation), and Ready/Busy# (RY/BY# open-drain output pulled low during active program/erase). All are valid after defined WE# edge counts per Table 7, and the SST39VF801C-70-4C-B3KE datasheet confirms their use in both sector and chip-level operations.
Can the SST39VF801C-70-4C-B3KE be used in a 5 V system?
No, the SST39VF801C-70-4C-B3KE is strictly a 2.7–3.6 V device. Its absolute maximum VDD rating is 3.6 V, and operation above this risks permanent damage. It is incompatible with 5 V buses unless level-shifted; the SST39VF801C-70-4C-B3KE datasheet specifies no 5 V tolerance, and Table 9 confirms VDD max for program/erase is 3.6 V.
What package type does the SST39VF801C-70-4C-B3KE use?
The SST39VF801C-70-4C-B3KE uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), as confirmed by the "-B3KE" suffix and Figure 4 in DS25041A. This differs from the TSOP and TFBGA variants-B3KE specifically denotes WFBGA, and pin assignments match the WFBGA layout including NC placements at A13, A9, and A10.
SST39VF801C-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF801C-70-4C-B3KE FAQ
1.How can I place an order for SST39VF801C-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4C-B3KE reliable?
The price and inventory of SST39VF801C-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4C-B3KE?
SST39VF801C-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4C-B3KE?
For technical support, including SST39VF801C-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39VF801C-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4C-B3KE?
All SST39VF801C-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF801C-70-4C-B3KE Tags
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