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Microchip Technology SST39VF801C-70-4C-B3KE-T
- Part No.:
- SST39VF801C-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF801C-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,068
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Product details
Overview
SST39VF801C-70-4C-B3KE-T from Microchip Technology is a 8 Mbit (512K × 16) Multi-Purpose Flash Plus memory IC with 70 ns read access time, single 2.7–3.6V supply operation, and bottom-boot block protection. It features uniform 2 KWord sector erase, flexible block architecture (including one 8 KWord and fifteen 32 KWord blocks), and hardware write protection via WP# pin. Used in embedded firmware storage for industrial controllers requiring field-upgradable code.
For engineers reviewing the SST39VF801C-70-4C-B3KE-T datasheet, SST39VF801C-70-4C-B3KE-T pinout, SST39VF801C-70-4C-B3KE-T application, or SST39VF801C-70-4C-B3KE-T equivalent, key selection criteria include boot-block configuration (bottom 8 KWord protected), JEDEC-compliant x16 parallel interface timing, SuperFlash® endurance (100,000 cycles), and TSOP-48 package compatibility with legacy 8-bit/16-bit microcontroller buses.
Technical Context
This device implements SST's proprietary SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count-unlike conventional flash. Its command-set architecture supports JEDEC-standard software data protection (SDP) with six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.
The SST39VF801C-70-4C-B3KE-T integrates dual status detection: Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2), plus open-drain RY/BY# output for hardware-ready signaling. It supports Erase-Suspend/Erase-Resume for real-time read/program during background erase, and includes factory-programmed 128-bit Security ID plus 128-word user-programmable ID space.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 16 (8 Mbit total); enables direct interfacing with 16-bit data buses without glue logic |
| Read Access Time | 70 ns max; meets timing requirements for 14 MHz bus operation in legacy microcontroller systems |
| Supply Voltage | 2.7–3.6V single supply; compatible with 3.3V I/O domains and eliminates need for separate VPP |
| Endurance | 100,000 program/erase cycles typical; supports frequent firmware updates in industrial HMI and PLC applications |
| Data Retention | >100 years at 25°C; ensures long-term reliability in unattended equipment without refresh |
| Block Protection | Hardware bottom-boot protection (00000H–01FFFH, 8 KWord); safeguards bootloader code against accidental overwrite |
| Package | 48-lead TSOP (12 mm × 20 mm); industry-standard footprint for drop-in replacement in existing PCB layouts |
Pinout & Package
48-lead TSOP (Thin Small Outline Package), standard JEDEC MO-142AC footprint, 12 mm × 20 mm body, 0.5 mm lead pitch. Pin 1 marked by notch or dot; top view, die up.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus; A18 is most significant bit; AMS = A18 for sector/block selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during write; tri-state when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required to initiate all operations |
| OE# | Output Enable | Active-low output gate; controls data bus drivers independently of CE# for multiplexed bus sharing |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Write Protect | Active-low hardware lock for bottom boot block (00000H–01FFFH); floating = internal pull-up = unprotected |
| RST# | Reset | Active-low hardware reset; forces return to Read mode; terminates in-progress erase/program |
| RY/BY# | Ready/Busy# | Open-drain status output; low = active erase/program; requires external 10–100 kΩ pull-up |
| VDD | Power Supply | +2.7–3.6V supply; powers core and I/O; no separate VPP required due to on-chip charge pump |
| VSS | Ground | Digital ground reference; two dedicated pins (pins 3 and 48) reduce noise coupling |
| NC | No Connection | Pins 2, 25, 32, 34, 36, 40, 42, 44, 46 - electrically isolated; must not be connected |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 7 µs word-program and 18 ms sector-erase times across full lifecycle |
| Erase-Suspend/Resume | Allows reading from non-suspended sectors or programming other blocks during active erase-critical for real-time OS firmware updates |
| Security ID Space | Factory-locked 128-bit ID + 128-word user-programmable ID; supports secure boot authentication and device binding |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access; cuts dynamic power in intermittently polled systems |
| JEDEC-Compliant Interface | Standard x16 pinout and command set (e.g., 555H/AAH/2AAH/55H sequences); ensures interoperability with legacy BIOS/UEFI and FPGA controllers |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Memory |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Nonvolatile code storage with bottom-boot protection ensuring bootloader integrity during field firmware upgrades over RS-485 or Ethernet. Use Value: 100,000-cycle endurance allows daily firmware validation in development labs; 70 ns access supports deterministic scan-cycle timing in 10 ms PLC cycles. |
Use Scenario: Holding certified bootloader and calibration data in FDA-regulated infusion pumps where data corruption must be physically prevented. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with hardware WP# lock on boot sector and factory-programmed Security ID for traceability. Use Value: Bottom-boot block protection (00000H–01FFFH) isolates bootloader from application-level erase commands; >100-year retention meets 15-year device lifecycle requirements. |
| Telecom Base Station Configuration | Automotive Infotainment Head Unit |
|
Use Scenario: Storing radio frequency calibration tables and protocol stack parameters in LTE small-cell base stations operating in outdoor enclosures. IC Role / Device Role / Timing Role: Field-upgradable configuration memory with Erase-Suspend capability to maintain RF link continuity during parameter updates. Use Value: Erase-Suspend allows real-time read of active calibration data while background-erasing new tables; RY/BY# pin enables precise timing coordination with FPGA state machines. |
Use Scenario: Hosting navigation map updates and UI assets in automotive head units requiring AEC-Q100 Grade 3 qualification (−40°C to +85°C). IC Role / Device Role / Timing Role: High-reliability parallel flash for infotainment SoC boot and overlay code execution, leveraging JEDEC command compatibility with ARM-based controllers. Use Value: TSOP-48 package provides mechanical robustness under thermal cycling; SuperFlash® energy efficiency reduces heat generation near display drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-B3KE-T | Top-boot configuration (7E000H–7FFFFH protected); identical timing, voltage, and package | Used where bootloader resides in top memory region; incompatible pin-for-pin replacement due to reversed boot-block mapping | Select only if system firmware layout requires top-boot protection and address decoding matches SST39VF802C block table |
| MX29LV800CTTI-70G | 70 ns access, 3.0–3.6V supply, 48-TSOP; lacks Erase-Suspend and Security ID; uses different SDP command sequence | Lower-cost alternative for static firmware storage without runtime update requirements | Choose when Erase-Suspend, Security ID, or bottom-boot protection are not required; verify command-set compatibility in bootloader code |
Compared with SST39VF801C-70-4C-B3KE-T, the SST39VF802C variant swaps boot-block location (top vs. bottom), while the MX29LV800CTTI offers baseline functionality at lower cost but omits advanced features like suspend/resume and secure ID-making it suitable only for fixed, non-updatable firmware deployments.
Availability
SST39VF801C-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader memory, telecom base station configuration, and automotive infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for SST39VF801C-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39VF801C-70-4C-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for embedded systems requiring field-upgradable firmware, secure boot, and high endurance in space-constrained industrial and medical applications.
FAQ
What is the boot-block configuration of SST39VF801C-70-4C-B3KE-T?
The SST39VF801C-70-4C-B3KE-T implements bottom-boot block protection, covering address range 00000H–01FFFH (8 KWord). This configuration safeguards the bootloader region from accidental erase or program when WP# is grounded. Unlike the SST39VF802C variant, which protects the top 8 KWord, the SST39VF801C-70-4C-B3KE-T is intended for systems where critical startup code resides at the lowest memory addresses.
Does SST39VF801C-70-4C-B3KE-T require an external VPP voltage?
No, the SST39VF801C-70-4C-B3KE-T does not require an external VPP voltage. It integrates an on-chip charge pump to generate internal programming voltages, enabling full read and write operations using only the 2.7–3.6V VDD supply. This eliminates the need for additional power rails and simplifies board design compared to older flash technologies.
How is write completion detected on SST39VF801C-70-4C-B3KE-T?
The SST39VF801C-70-4C-B3KE-T supports three concurrent write completion detection methods: Data# Polling (monitoring DQ7), Toggle Bit (monitoring DQ6 toggling), and Ready/Busy# (RY/BY# pin assertion). All methods are valid after the rising edge of the fourth WE# pulse for word-program and sixth WE# pulse for erase operations, enabling flexible host controller integration.
Can SST39VF801C-70-4C-B3KE-T be used in systems requiring Erase-Suspend functionality?
Yes, the SST39VF801C-70-4C-B3KE-T fully supports Erase-Suspend and Erase-Resume commands (B0H and 30H respectively). This allows a host system to temporarily halt an ongoing sector or block erase, read data from unprotected regions, or program other blocks-enabling real-time firmware updates without interrupting critical operations.
What package type is used for SST39VF801C-70-4C-B3KE-T?
The SST39VF801C-70-4C-B3KE-T is packaged in a 48-lead TSOP (Thin Small Outline Package) with JEDEC MO-142AC footprint (12 mm × 20 mm body, 0.5 mm lead pitch). This standard package ensures mechanical and thermal compatibility with legacy PCB layouts designed for parallel NOR flash memory in industrial and automotive applications.
SST39VF801C-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF801C-70-4C-B3KE-T FAQ
1.How can I place an order for SST39VF801C-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4C-B3KE-T reliable?
The price and inventory of SST39VF801C-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4C-B3KE-T?
SST39VF801C-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4C-B3KE-T?
For technical support, including SST39VF801C-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39VF801C-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4C-B3KE-T?
All SST39VF801C-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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