Microchip Technology SST39VF801C-70-4C-EKE
- Part No.:
- SST39VF801C-70-4C-EKE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF801C-70-4C-EKE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SST39VF801C-70-4C-EKE from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded program/data storage in microcontroller-based systems. It operates from 2.7–3.6V, delivers 70 ns read access time, supports sector/block/chip erase, and features hardware write protection via WP# pin for bottom 8 KWord boot block (00000H–01FFFH).
For engineers reviewing the SST39VF801C-70-4C-EKE datasheet, SST39VF801C-70-4C-EKE pinout, SST39VF801C-70-4C-EKE application, or SST39VF801C-70-4C-EKE equivalent, this device serves as a JEDEC-standard x16 flash solution requiring fast Word-Program (7 µs typ.), high endurance (100,000 cycles), and reliable data retention (>100 years) in industrial control, firmware update, and BIOS storage designs.
Technical Context
The SST39VF801C-70-4C-EKE implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional flash technologies. Its command interface follows JEDEC-standard x16 pinouts and uses six-byte sequences for sector/block/chip erase, with software data protection permanently enabled at shipment.
It integrates dual status detection (DQ6 toggle bit and DQ7 Data# polling), an open-drain RY/BY# pin for hardware busy indication, and hardware reset (RST#) for forced return to read mode. The device supports Auto Low Power mode (3 µA standby current) and latched address/data I/O compatible with standard microprocessor buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), directly maps to 16-bit data bus without byte-lane masking |
| Read Access Time | 70 ns max - enables direct connection to 14 MHz microcontrollers without wait states |
| Supply Voltage | 2.7–3.6V - supports single-supply operation in battery-backed or low-voltage industrial systems |
| Endurance | 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years of service life |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications like configuration EEPROM replacement |
| Word-Program Time | 7 µs typical - reduces firmware update latency versus legacy parallel flash devices |
| Standby Current | 3 µA typical - critical for low-power modes in portable or energy-harvesting embedded systems |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, JEDEC-standard x16 memory footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus; A18 is most significant; AMS = A18 for sector/block selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with tri-state output controlled by CE# and OE# |
| CE# | Chip Enable | Active-low chip select; device enters standby when high, enabling multi-chip memory expansion |
| OE# | Output Enable | Active-low output gate; controls data bus drive without affecting internal state |
| WE# | Write Enable | Active-low control for all write operations; latches command/address/data on falling/rising edges per JEDEC timing |
| WP# | Write Protect | Hardware lock for bottom 8 KWord boot block (00000H–01FFFH); grounded = protection enabled |
| RST# | Reset | Active-low hardware reset; terminates ongoing erase/program and forces return to read mode |
| RY/BY# | Ready/Busy# | Open-drain status indicator; pulled low during erase/program, requires external 10–100 kΩ pull-up |
| VDD | Power Supply | 2.7–3.6V core supply; powers all logic and memory array functions |
| VSS | Ground | Reference ground for all I/O and internal circuitry; two dedicated pins for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 7 µs program and 18 ms erase times across full lifecycle |
| Erase-Suspend/Resume | Allows temporary halt of sector/block erase to read other locations or program unprotected blocks |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space, locked after programming |
| Boot Block Protection | Hardware-enforced bottom 8 KWord (00000H–01FFFH) protection via WP# pin - matches BIOS/UEFI storage requirements |
| CFI Support | Common Flash Interface compliant; enables automatic driver detection and configuration in host OS/bootloader |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh EMI environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to microcontroller's external bus, accessed via standard x16 read/write cycles. Use Value: 70 ns access time eliminates wait states; 100,000-cycle endurance supports remote firmware patches over 15+ years; bottom boot block protects startup code from corruption. |
Use Scenario: Holding calibrated sensor parameters and regulatory-compliant device settings in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure configuration storage with hardware write protection and Security ID for traceability and anti-counterfeiting. Use Value: WP#-protected boot block prevents accidental overwrite of safety-critical initialization routines; >100-year data retention ensures calibration integrity across product lifetime. |
| Automotive Infotainment Boot ROM | Networking Equipment BIOS Storage |
Use Scenario: Hosting boot code and recovery image for head-unit microprocessors in automotive infotainment systems. IC Role / Device Role / Timing Role: Primary boot memory accessed at power-on reset; supports fast read and in-system firmware upgrades. Use Value: 2.7–3.6V operation tolerates automotive battery fluctuations; RY/BY# pin enables deterministic timing for bootloader handoff; Erase-Suspend allows concurrent UI operation during update. |
Use Scenario: Storing UEFI/BIOS firmware in enterprise switches and routers requiring field-upgradable boot images. IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash used as primary system ROM, interfaced via standard memory controller. Use Value: CFI support enables automatic driver loading in Linux-based management stacks; sector-erase capability permits granular patch deployment without full reflash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-EKE | Top-boot architecture (7E000H–7FFFFH protected block); identical timing, voltage, and command set | Used where boot code resides in top memory region; not interchangeable without PCB address mapping change | Select only if system design requires top-boot protection and address map aligns |
| MX29LV800CTTI-70G | 70 ns access, 3.0–3.6V operation, but lacks Erase-Suspend and Security ID; different command sequence and CFI layout | Lower-cost alternative for basic firmware storage without advanced protection or suspend features | Choose when Erase-Suspend, Security ID, or bottom-boot protection are not required |
Compared with SST39VF801C-70-4C-EKE, the SST39VF802C-70-4C-EKE offers identical performance but reversed boot-block location, while MX29LV800CTTI-70G sacrifices advanced features for cost-making SST39VF801C-70-4C-EKE optimal for secure, field-upgradable embedded systems demanding bottom-boot integrity.
Availability
SST39VF801C-70-4C-EKE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, automotive infotainment boot ROM, networking equipment BIOS storage, and embedded system recovery image storage requiring stable component supply and long-term lifecycle support.
Supply support for SST39VF801C-70-4C-EKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog, FPGA, and memory solutions, with acquisition of Silicon Storage Technology (SST) in 2010.
The SST39VF801C-70-4C-EKE belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered for high-reliability, low-voltage parallel NOR flash applications in industrial, automotive, and medical embedded systems requiring robust firmware and configuration storage.
FAQ
What is the boot block configuration of SST39VF801C-70-4C-EKE?
The SST39VF801C-70-4C-EKE implements bottom-boot block protection: the lowest 8 KWord (00000H–01FFFH) is hardware-protected when WP# is grounded. This matches BIOS/UEFI and safety-critical startup code placement requirements. Unlike the SST39VF802C variant, it does not protect the top memory region.
Does SST39VF801C-70-4C-EKE require an external VPP voltage for programming?
No, SST39VF801C-70-4C-EKE does not require external VPP. It generates internal high-voltage programming pulses using its on-chip charge pump, enabling full erase and program functionality from a single 2.7–3.6V supply-simplifying power design and eliminating VPP routing on PCB.
How is write completion detected on SST39VF801C-70-4C-EKE?
SST39VF801C-70-4C-EKE supports three concurrent write completion detection methods: DQ6 toggle bit (alternating 1/0 during operation), DQ7 Data# polling (complement-to-data during program, 0 during erase), and RY/BY# pin (open-drain active-low signal). All are valid after defined WE# edge timings per operation type.
Can SST39VF801C-70-4C-EKE be used in place of SST39VF802C-70-4C-EKE?
No-SST39VF801C-70-4C-EKE and SST39VF802C-70-4C-EKE are not interchangeable due to opposite boot block architectures: SST39VF801C protects the bottom 8 KWord, while SST39VF802C protects the top 8 KWord. Swapping them risks corrupting protected firmware unless address mapping and protection logic are redesigned.
What package options are available for SST39VF801C-70-4C-EKE?
The SST39VF801C-70-4C-EKE is offered exclusively in 48-lead TSOP (12 mm × 20 mm) per the DS25041A datasheet. While the broader SST39VF801C family includes TFBGA and WFBGA variants, the -EKE suffix specifically denotes the TSOP package with commercial temperature range (0°C to +70°C) and 70 ns speed grade.
SST39VF801C-70-4C-EKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF801C-70-4C-EKE FAQ
1.How can I place an order for SST39VF801C-70-4C-EKE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4C-EKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4C-EKE reliable?
The price and inventory of SST39VF801C-70-4C-EKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4C-EKE is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4C-EKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4C-EKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4C-EKE?
SST39VF801C-70-4C-EKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4C-EKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4C-EKE?
For technical support, including SST39VF801C-70-4C-EKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4C-EKE requirements.
6.How does Aetrix verify that SST39VF801C-70-4C-EKE is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4C-EKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4C-EKE meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4C-EKE?
All SST39VF801C-70-4C-EKE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4C-EKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4C-EKE part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4C-EKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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