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Microchip Technology SST39VF801C-70-4C-EKE-T
- Part No.:
- SST39VF801C-70-4C-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF801C-70-4C-EKE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,659
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Product details
Overview
SST39VF801C-70-4C-EKE-T from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded program/data storage in microcontroller-based systems. It operates at 2.7–3.6 V, delivers 70 ns read access time, supports sector/block/chip erase, and features hardware write protection via WP# pin for bottom 8 KWord boot block (00000H–01FFFH).
For engineers reviewing the SST39VF801C-70-4C-EKE-T datasheet, SST39VF801C-70-4C-EKE-T pinout, SST39VF801C-70-4C-EKE-T application, or SST39VF801C-70-4C-EKE-T equivalent, this device serves as a drop-in JEDEC-compliant x16 flash replacement requiring attention to boot-block layout, RY/BY# pull-up, and software data protection command sequencing.
Technical Context
The SST39VF801C-70-4C-EKE-T implements a split-gate SuperFlash cell architecture enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of endurance cycles. Its command interface follows JEDEC-standard x16 flash protocols, with six-byte sequences for erase operations and three-byte sequences for program initiation.
It integrates dual status detection-Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2)-plus open-drain RY/BY# output for real-time operation monitoring. Hardware block protection targets the bottom 8 KWord (00000H–01FFFH), while Security ID provides factory-locked 128-bit and user-programmable 128-word segments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), directly maps to 1 MB of 16-bit addressable space. |
| Read Access Time | 70 ns - determines minimum bus cycle timing for CPU or controller interfacing. |
| Supply Voltage | 2.7–3.6 V - enables single-supply operation in 3.3 V systems without level-shifting. |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime. |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications. |
| Active Current | 5 mA typical at 5 MHz - defines peak power draw during read bursts. |
| Standby Current | 3 µA typical - enables ultra-low-power hold state in battery-backed systems. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, JEDEC-standard x16 flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | A0–A17 select 512K words; A18 used only in sector/block address decoding per JEDEC command protocol. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; latched internally during write; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write; high forces standby mode. |
| OE# | Output Enable | Active-low output gate; controls data bus drive; high places outputs in high-impedance state. |
| WE# | Write Enable | Controls write strobe timing; falling edge latches address, rising edge latches data/command. |
| WP# | Write Protect | Hardware lock for bottom 8 KWord boot block (00000H–01FFFH); grounded = protected. |
| RST# | Reset Input | Hardware abort of ongoing erase/program; returns device to read mode within TRP delay. |
| RY/BY# | Ready/Busy Output | Open-drain status signal; requires external 10–100 kΩ pull-up; low = operation in progress. |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; decoupling capacitor required near VDD pin for noise immunity. |
| NC | No Connect | Unbonded pins (e.g., A13, A14 on TSOP); must remain floating or tied to ground per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Fixed 7 µs word-program and 18 ms erase times across full endurance life-no software de-rating needed. |
| Boot Block Protection | Hardware-protected bottom 8 KWord (00000H–01FFFH) prevents accidental overwrite of bootloader code. |
| Erase-Suspend/Resume | Allows temporary halt of sector/block erase to read or program other regions-critical for real-time systems. |
| Security ID | Factory-programmed 128-bit ID + 128-word user space, locked after programming to prevent tampering. |
| CFI Support | JEDEC Common Flash Interface enables automatic driver detection and configuration in OS/bootloader stacks. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
|
Use Scenario: Storing firmware images and calibration tables in programmable logic controllers operating in harsh EMI environments with infrequent field updates. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to microcontroller address space; accessed via standard x16 parallel bus with 70 ns timing compliance. Use Value: Bottom boot block protection ensures bootloader integrity during remote firmware upgrades; 100,000-cycle endurance supports >10 years of maintenance cycles. |
Use Scenario: Holding device-specific calibration coefficients and safety-critical configuration parameters in FDA-cleared diagnostic equipment requiring traceable data retention. IC Role / Device Role / Timing Role: Secure, long-retention configuration store; leverages Security ID for device authentication and CFI for auto-detection in certified bootloader stacks. Use Value: >100-year data retention meets IEC 62304 requirements; hardware WP# eliminates risk of corruption during power brownouts. |
| Automotive Infotainment Bootloader | Networking Equipment Image Storage |
|
Use Scenario: Hosting primary bootloader code in automotive head units where AEC-Q100 qualification and fail-safe startup are mandatory. IC Role / Device Role / Timing Role: Boot memory with bottom 8 KWord protected region; interfaces directly to MCU's external memory bus with no glue logic. Use Value: RY/BY# and Data# Polling support deterministic boot timing; SuperFlash reliability reduces field failure risk under thermal cycling. |
Use Scenario: Storing multiple firmware images (primary/backup/recovery) in enterprise switches and routers requiring hot-swappable update capability. IC Role / Device Role / Timing Role: Dual-image flash storage with sector-erase granularity enabling atomic image swaps without system downtime. Use Value: Uniform 2 KWord sectors allow precise partitioning; 40 ms chip-erase enables rapid factory reprogramming during production test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV800CTTI-70G | 8 Mbit x16, 70 ns, 2.7–3.6 V, but uses different command set and lacks Erase-Suspend. | No hardware boot-block protection; requires software-managed lock bits instead of WP#-based hardware lock. | Choose if legacy MX29LV compatibility is required and Erase-Suspend is not needed. |
| S29GL064N90TFI010 | 64 Mbit x16, 90 ns, 2.7–3.6 V, with enhanced ECC and sector protection registers. | Higher density and slower access; includes built-in error correction not present in SST39VF801C-70-4C-EKE-T. | Choose for future-proofing with larger image storage and robustness in high-radiation environments. |
Compared with MX29LV800CTTI-70G and S29GL064N90TFI010, the SST39VF801C-70-4C-EKE-T offers superior erase/program speed consistency, hardware boot-block protection, and lower active current-making it optimal for cost-sensitive, real-time embedded systems where deterministic timing and bootloader safety are critical.
Availability
SST39VF801C-70-4C-EKE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, automotive bootloader applications requiring stable component supply and long-term lifecycle support.
Supply support for SST39VF801C-70-4C-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now manufactures and supports the SST39VF family as part of its broad flash memory portfolio.
The SST39VF801C-70-4C-EKE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered for reliable, low-power, JEDEC-compliant embedded storage in resource-constrained microcontroller systems.
FAQ
What is the boot block configuration of the SST39VF801C-70-4C-EKE-T?
The SST39VF801C-70-4C-EKE-T implements bottom boot block protection covering the lowest 8 KWord (00000H–01FFFH). This region is hardware-locked when WP# is grounded, preventing accidental erase or program during system operation or power transitions. The SST39VF801C-70-4C-EKE-T does not support top-boot configuration-only SST39VF802C variants do.
Does the SST39VF801C-70-4C-EKE-T require an external VPP voltage?
No, the SST39VF801C-70-4C-EKE-T generates internal VPP for erase and program operations using its 2.7–3.6 V VDD supply-no external high-voltage source is needed. This simplifies board design and eliminates VPP-related routing and decoupling complexity. All voltage regulation and charge-pump functions are integrated within the SST39VF801C-70-4C-EKE-T die.
How is write completion detected on the SST39VF801C-70-4C-EKE-T?
The SST39VF801C-70-4C-EKE-T supports three concurrent write-status detection methods: Data# Polling (DQ7 toggles until completion), Toggle Bits (DQ6 toggles during operation), and Ready/Busy# (RY/BY# open-drain output pulled low during activity). These mechanisms allow flexible host-side polling or interrupt-driven handling without fixed timeout delays. All three are fully functional on the SST39VF801C-70-4C-EKE-T.
Can the SST39VF801C-70-4C-EKE-T be used in place of SST39VF802C devices?
No-the SST39VF801C-70-4C-EKE-T and SST39VF802C differ in boot block location (bottom vs. top), security ID lock behavior, and factory-programmed device ID (233BH vs. 233AH). Swapping them risks bootloader corruption or failed identification. The SST39VF801C-70-4C-EKE-T must be used only where bottom-boot architecture is explicitly required.
What package type is used in the SST39VF801C-70-4C-EKE-T variant?
The SST39VF801C-70-4C-EKE-T uses a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm body size and standard JEDEC MO-141AC footprint. The "EKE" suffix explicitly denotes this TSOP package; alternate variants use "T" (TFBGA) or "W" (WFBGA) suffixes. Pin compatibility is maintained across packages, but thermal and mechanical design rules differ.
SST39VF801C-70-4C-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF801C-70-4C-EKE-T FAQ
1.How can I place an order for SST39VF801C-70-4C-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4C-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4C-EKE-T reliable?
The price and inventory of SST39VF801C-70-4C-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4C-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4C-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4C-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4C-EKE-T?
SST39VF801C-70-4C-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4C-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4C-EKE-T?
For technical support, including SST39VF801C-70-4C-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4C-EKE-T requirements.
6.How does Aetrix verify that SST39VF801C-70-4C-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4C-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4C-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4C-EKE-T?
All SST39VF801C-70-4C-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4C-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4C-EKE-T part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4C-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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