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Microchip Technology SST39VF801C-70-4C-MAQE
- Part No.:
- SST39VF801C-70-4C-MAQE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39VF801C-70-4C-MAQE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,840
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Product details
Overview
SST39VF801C-70-4C-MAQE from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware block protection for the bottom 8 KWord boot sector, and JEDEC-standard x16 parallel interface. It serves as nonvolatile program/data storage in embedded controllers, BIOS firmware modules, and industrial HMI systems.
For engineers reviewing the SST39VF801C-70-4C-MAQE datasheet, SST39VF801C-70-4C-MAQE pinout, SST39VF801C-70-4C-MAQE application, or SST39VF801C-70-4C-MAQE equivalent, key selection criteria include boot-block architecture (bottom 8 KWord), TSOP-48 packaging, 100,000-cycle endurance, RY/BY# status signaling, and software data protection command sequence compliance.
Technical Context
The SST39VF801C-70-4C-MAQE implements a split-gate SuperFlash® cell with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. Its command-set architecture supports JEDEC-standard x16 flash operations including Word-Program (7 µs typical), Sector-Erase (18 ms), Block-Erase (18 ms), and Chip-Erase (40 ms).
It integrates hardware write protection via WP# for bottom boot block (00000H–01FFFH), RST# for hardware reset to Read mode, and RY/BY# open-drain status output requiring external 10 kΩ–100 kΩ pull-up. Data integrity is verified using DQ7 Data# Polling and DQ6/DQ2 Toggle Bits during write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), supporting 16-bit parallel data bus interface |
| Read Access Time | 70 ns - determines maximum sustained read throughput in legacy 16-bit bus systems |
| Supply Voltage | 2.7–3.6 V - enables direct compatibility with 3.3 V logic rails without level shifting |
| Endurance | 100,000 program/erase cycles - guarantees field reliability for firmware update applications |
| Data Retention | >100 years - ensures long-term validity of stored configuration or calibration data |
| Active Current | 5 mA typical at 5 MHz - defines power budget impact during active read operations |
| Standby Current | 3 µA typical - enables ultra-low-power operation in sleep or idle states |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC x16 flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus (A0–A18); AMS = A18 selects top/bottom boot block during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; device enters standby when high |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read cycles |
| WE# | Write Enable | Active-low control for program/erase command latching and timing initiation |
| WP# | Write Protect | Active-low hardware lock for bottom 8 KWord boot block (00000H–01FFFH) |
| RST# | Reset | Active-low hardware reset to Read mode; terminates in-progress operations |
| RY/BY# | Ready/Busy# | Open-drain status output indicating active Program/Erase; requires external pull-up |
| VDD | Power Supply | 2.7–3.6 V supply input; powers all internal logic and memory array |
| VSS | Ground | Reference ground for all signals and internal circuitry |
| NC | No Connection | Unbonded pins (e.g., A13, A9, A12 on TSOP); must remain unconnected |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 7 µs Word-Program and 18 ms erase times across full lifecycle |
| Bottom Boot Block Protection | Hardware WP#-enabled lock for 8 KWord (00000H–01FFFH) prevents accidental BIOS/firmware corruption |
| Erase-Suspend/Resume | Allows temporary halt of erase to read/program other sectors-critical for real-time system responsiveness |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user-programmable space with lock-out capability for anti-cloning |
| CFI Compliance | Integrated Common Flash Interface enables automatic detection and configuration by host bootloader firmware |
Applications
| Industrial PLC Firmware Storage | Embedded Network Router Boot Code |
|---|---|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile parallel flash memory providing boot code and runtime parameter storage with deterministic 70 ns read latency. Use Value: Bottom boot block protection ensures bootloader integrity against unintended overwrites during field firmware updates. | Use Scenario: Holding boot loader, kernel image, and network stack binaries in enterprise-grade Ethernet routers. IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash acting as primary boot device interfaced directly to ARM/MIPS microprocessor buses. Use Value: 100,000-cycle endurance supports frequent remote firmware upgrades without hardware replacement. |
| Medical Diagnostic Equipment Configuration | Automotive Infotainment System Calibration Data |
Use Scenario: Retaining calibration coefficients, sensor offset tables, and regulatory compliance logs in ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability flash memory storing mission-critical calibration data with >100-year retention guarantee. Use Value: SuperFlash® energy efficiency reduces thermal load in sealed medical enclosures during periodic reprogramming. | Use Scenario: Storing display gamma tables, audio equalization profiles, and regional language assets in automotive head units. IC Role / Device Role / Timing Role: Parallel flash memory mapped into MCU address space for fast access to UI assets during cold boot. Use Value: RY/BY# status pin enables precise timing coordination between MCU and flash during multi-sector firmware patching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-MAQE | Top boot block (7E000H–7FFFFH) instead of bottom; identical timing, voltage, and package | Used where bootloader resides in topmost memory region rather than bottom | Select when system architecture requires protected top-sector boot code execution |
| MX29LV800CTTC-70G | Same density and 70 ns speed but uses different command set; no Erase-Suspend; no Security ID | Lacks suspend/resume and secure ID features; lower cost for basic firmware storage | Choose for cost-sensitive designs where advanced protection and real-time interruptibility are not required |
Compared with SST39VF802C-70-4C-MAQE, the SST39VF801C-70-4C-MAQE provides bottom-boot protection essential for legacy x86 BIOS layouts; versus MX29LV800CTTC-70G, it delivers superior field-upgrade flexibility via Erase-Suspend and stronger security via factory/user Security ID segments.
Availability
SST39VF801C-70-4C-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, embedded network router boot code, and medical diagnostic equipment configuration requiring stable component supply across extended product lifecycles.
Supply support for SST39VF801C-70-4C-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, acquired Silicon Storage Technology (SST) in 2010.
The SST39VF801C-70-4C-MAQE belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for reliable, low-voltage, high-endurance firmware and configuration storage in resource-constrained embedded systems.
FAQ
What is the boot block configuration of the SST39VF801C-70-4C-MAQE?
The SST39VF801C-70-4C-MAQE implements bottom boot block protection, covering the lowest 8 KWord address range (00000H–01FFFH). This configuration is fixed and distinct from the top-boot SST39VF802C variant. WP# pin activation locks this region against inadvertent erase or program operations, making SST39VF801C-70-4C-MAQE ideal for BIOS or bootloader storage where lower-address code must remain immutable.
Does the SST39VF801C-70-4C-MAQE require an external VPP voltage for programming?
No, the SST39VF801C-70-4C-MAQE does not require an external VPP voltage. It generates internal high-voltage programming pulses using its on-chip charge pump, enabled solely by the 2.7–3.6 V VDD supply. This eliminates need for auxiliary power rails and simplifies board design-confirmed by Table 9 in DS25041A showing VPP min/max as 0000H (no VPP pin).
How is write completion detected on the SST39VF801C-70-4C-MAQE?
Write completion on the SST39VF801C-70-4C-MAQE is detected via three synchronized methods: RY/BY# pin (active-low open-drain signal), DQ7 Data# Polling (complement-to-data toggle), and DQ6 Toggle Bit (alternating 1/0 during operation). All are valid after defined WE# edge timings per operation type-e.g., DQ7 polling becomes valid after the fourth WE# rising edge in Word-Program mode.
What package type is used for the SST39VF801C-70-4C-MAQE?
The SST39VF801C-70-4C-MAQE is supplied in a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm body dimensions and standard JEDEC x16 flash pinout. The "MAQE" suffix explicitly denotes this TSOP-48 variant, distinguishing it from TFBGA or WFBGA versions of the same family.
Is the SST39VF801C-70-4C-MAQE compatible with JEDEC-standard flash command sets?
Yes, the SST39VF801C-70-4C-MAQE fully complies with JEDEC Standard JESD21-C for x16 flash memories, supporting industry-standard command sequences for Word-Program, Sector-Erase, Block-Erase, and Chip-Erase. It also implements CFI (Common Flash Interface) query mode (entry via 555H/AAH/2AAH/55H/555H/98H) for automated host identification and parameter retrieval.
SST39VF801C-70-4C-MAQE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39VF801C-70-4C-MAQE FAQ
1.How can I place an order for SST39VF801C-70-4C-MAQE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4C-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4C-MAQE reliable?
The price and inventory of SST39VF801C-70-4C-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4C-MAQE is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4C-MAQE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4C-MAQE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4C-MAQE?
SST39VF801C-70-4C-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4C-MAQE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4C-MAQE?
For technical support, including SST39VF801C-70-4C-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4C-MAQE requirements.
6.How does Aetrix verify that SST39VF801C-70-4C-MAQE is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4C-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4C-MAQE meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4C-MAQE?
All SST39VF801C-70-4C-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4C-MAQE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4C-MAQE part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4C-MAQE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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