My Inquiry
My Account
Microchip Technology SST39VF801C-70-4C-MAQE-T
- Part No.:
- SST39VF801C-70-4C-MAQE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39VF801C-70-4C-MAQE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,820
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF801C-70-4C-MAQE-T from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware block protection for bottom 8 KWord boot sector, and JEDEC-standard x16 parallel interface. It serves as nonvolatile program/data storage in embedded controllers, BIOS firmware modules, and industrial HMI systems.
For engineers reviewing the SST39VF801C-70-4C-MAQE-T datasheet, SST39VF801C-70-4C-MAQE-T pinout, SST39VF801C-70-4C-MAQE-T application, or SST39VF801C-70-4C-MAQE-T equivalent, key selection criteria include bottom-boot block architecture, TSOP-48 package compatibility, 100,000-cycle endurance, RY/BY# status signaling, and software/hardware write protection schemes.
Technical Context
The SST39VF801C-70-4C-MAQE-T implements a split-gate SuperFlash cell with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. Its command-set architecture supports JEDEC-standard parallel flash operations including Word-Program, Sector-Erase (2 KWord uniform), Block-Erase (flexible 4–32 KWord blocks), Chip-Erase, and Erase-Suspend/Resume.
It integrates dual status detection-Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2)-plus open-drain RY/BY# output for real-time operation monitoring. Hardware protection is implemented via WP# pin controlling bottom 8 KWord boot block (00000H–01FFFH), while RST# provides hardware reset to Read mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), directly maps to 16-bit data bus for microcontroller boot code execution |
| Read Access Time | 70 ns typical - enables direct execution from flash (XIP) in 10–15 MHz system buses without wait states |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic domains and tolerant of brown-out conditions down to 2.7 V |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in industrial control applications |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage for medical device configuration or automotive calibration data |
| Active Current | 5 mA typical at 5 MHz - low active power enables battery-backed operation in portable diagnostic equipment |
| Standby Current | 3 µA typical - allows deep-sleep retention in always-on IoT gateways with minimal quiescent drain |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC x16 parallel flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K × 16 addressing; AMS = A18 for sector/block selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-state when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select - enables device for read/write; high = standby mode (3 µA) |
| OE# | Output Enable | Active-low output gate - controls data bus drive; used with CE# for read timing |
| WE# | Write Enable | Active-low write strobe - latches address/data on falling/rising edges per JEDEC command sequence |
| WP# | Write Protect | Active-low hardware lock for bottom 8 KWord boot block (00000H–01FFFH); floating = unprotected |
| RST# | Reset | Active-low hardware reset - forces return to Read mode; terminates in-progress erase/program |
| RY/BY# | Ready/Busy# | Open-drain status output - low = active erase/program; requires external 10–100 kΩ pull-up |
| VDD | Power Supply | 2.7–3.6 V supply - powers core logic and SuperFlash array; no separate VPP required |
| VSS | Ground | Reference ground for all signals and internal charge pumps |
| NC | No Connection | Unbonded pins (e.g., A13, A14 in TSOP layout) - must remain unconnected |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 7 µs word-program and 18 ms sector-erase times across full 100k-cycle lifetime |
| Bottom Boot Block Protection | Hardware WP#-controlled lock for 8 KWord (00000H–01FFFH) - preserves bootloader integrity during field firmware updates |
| Erase-Suspend/Resume | Allows temporary halt of sector/block erase to read or program other regions - critical for real-time OS firmware patching |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space - enables secure device authentication and traceability |
| CFI Compliance | Integrated Common Flash Interface - enables automatic detection and configuration by BIOS/bootloader without hard-coded parameters |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic programs and I/O mapping tables in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Nonvolatile parallel flash memory providing XIP-capable boot code and runtime parameter storage with hardware write protection. Use Value: Bottom-boot architecture ensures bootloader remains intact during remote firmware upgrades; 100-year data retention guarantees calibration data persistence across equipment lifecycle. | Use Scenario: Holding FDA-mandated device configuration profiles, calibration coefficients, and audit logs in portable ultrasound and infusion pump systems. IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash acting as secure, tamper-resistant storage for regulatory-critical parameters. Use Value: Security ID feature enables unique device binding; RY/BY# pin integration simplifies real-time status monitoring in safety-critical firmware update sequences. |
| Automotive Body Control Module (BCM) | Networking Equipment Boot Image |
Use Scenario: Storing lighting control algorithms, door module diagnostics, and CAN message routing tables in 12 V automotive BCMs. IC Role / Device Role / Timing Role: 2.7–3.6 V tolerant flash memory interfacing directly with 3.3 V microcontrollers in harsh electrical environments. Use Value: Wide voltage range accommodates automotive battery transients; hardware WP# prevents accidental corruption of safety-critical boot code during ECU reprogramming. | Use Scenario: Hosting primary and fallback boot images for managed Ethernet switches and wireless access points requiring zero-downtime firmware rollbacks. IC Role / Device Role / Timing Role: Parallel flash memory delivering 70 ns read access to support fast cold boot and failover recovery. Use Value: Sector-erase capability enables atomic image swaps; CFI compliance allows generic bootloader support across multiple hardware revisions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-MAQE-T | Top-boot architecture (7E000H–7FFFFH protected block); identical timing, voltage, and command set | Used where bootloader resides in top sector instead of bottom; not interchangeable without PCB address decoding changes | Select only if design requires top-boot protection; pinout and interface are identical but boot block location differs |
| MX29LV800CTTI-70G | 70 ns access, 8 Mbit x16, 3.0–3.6 V supply; lacks Erase-Suspend and Security ID; uses different command set | Requires firmware adaptation for erase/program commands; no hardware boot block protection - relies on software locking | Choose for cost-sensitive designs where suspend/resume and secure ID are unnecessary; verify bootloader compatibility before substitution |
Compared with SST39VF802C-70-4C-MAQE-T, the SST39VF801C-70-4C-MAQE-T provides bottom-boot protection essential for legacy bootloader layouts, while MX29LV800CTTI-70G offers lower cost at the expense of advanced features like suspend/resume and hardware security - making it suitable only for static firmware deployments.
Availability
SST39VF801C-70-4C-MAQE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and automotive body control module applications requiring stable component supply and long-term obsolescence management.
Supply support for SST39VF801C-70-4C-MAQE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with leadership in flash technology through its acquisition of Silicon Storage Technology (SST).
The SST39VF801C-70-4C-MAQE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for embedded systems requiring reliable, low-voltage, high-endurance parallel NOR flash with integrated hardware protection and real-time status feedback.
FAQ
What is the boot block configuration of the SST39VF801C-70-4C-MAQE-T?
The SST39VF801C-70-4C-MAQE-T implements bottom-boot block protection, securing the lowest 8 KWord (00000H–01FFFH) from inadvertent erase/program when WP# is asserted low. This architecture ensures bootloader integrity in systems where startup code resides at the base of the memory map. The SST39VF801C-70-4C-MAQE-T does not support top-boot configuration - that functionality is exclusive to the SST39VF802C variant.
Does the SST39VF801C-70-4C-MAQE-T require an external VPP voltage for programming?
No, the SST39VF801C-70-4C-MAQE-T does not require an external VPP voltage. It generates all necessary high-voltage programming pulses internally using its on-chip charge pump, operating solely from the 2.7–3.6 V VDD supply. This eliminates the need for additional power rails or voltage translators, simplifying board design and reducing BOM cost. The SST39VF801C-70-4C-MAQE-T datasheet confirms VPP min/max values as 0000H, indicating no VPP pin or external voltage requirement.
How does the RY/BY# pin function on the SST39VF801C-70-4C-MAQE-T?
The RY/BY# pin on the SST39VF801C-70-4C-MAQE-T is an open-drain output that drives low during active Program or Erase operations and floats high (requiring external 10–100 kΩ pull-up) when ready. It provides hardware-level status indication synchronized with internal timing, enabling interrupt-driven firmware flow without polling overhead. Unlike DQ6/DQ7 status bits, RY/BY# reflects true device readiness and is valid immediately after the final WE# pulse in any command sequence. The SST39VF801C-70-4C-MAQE-T specification mandates this external pull-up for proper logic-level interpretation.
Can the SST39VF801C-70-4C-MAQE-T be used in place of the SST39VF802C-70-4C-MAQE-T?
No, the SST39VF801C-70-4C-MAQE-T cannot be used as a direct replacement for the SST39VF802C-70-4C-MAQE-T due to fundamental boot block architecture differences: SST39VF801C protects the bottom 8 KWord (00000H–01FFFH), while SST39VF802C protects the top 8 KWord (7E000H–7FFFFH). Substituting them without modifying address decoding logic or bootloader placement will result in unprotected firmware execution or failed updates. The SST39VF801C-70-4C-MAQE-T and SST39VF802C-70-4C-MAQE-T share identical pinouts and timing but differ critically in protected region location.
What is the purpose of the Security ID feature in the SST39VF801C-70-4C-MAQE-T?
The Security ID feature in the SST39VF801C-70-4C-MAQE-T provides a 128-bit factory-programmed identifier plus 128 words of user-programmable space, enabling device authentication, anti-cloning, and supply chain traceability. The factory segment is permanently locked at manufacture; the user segment can be programmed once and then locked via the User Sec ID Program Lock-Out command. Neither segment is erasable. This feature supports secure boot verification and regulatory compliance in medical and industrial applications where device identity assurance is mandatory. The SST39VF801C-70-4C-MAQE-T implements this via dedicated 3-byte command entry (88H) and separate lock-out protocol.
SST39VF801C-70-4C-MAQE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39VF801C-70-4C-MAQE-T FAQ
1.How can I place an order for SST39VF801C-70-4C-MAQE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4C-MAQE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4C-MAQE-T reliable?
The price and inventory of SST39VF801C-70-4C-MAQE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4C-MAQE-T is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4C-MAQE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4C-MAQE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4C-MAQE-T?
SST39VF801C-70-4C-MAQE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4C-MAQE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4C-MAQE-T?
For technical support, including SST39VF801C-70-4C-MAQE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4C-MAQE-T requirements.
6.How does Aetrix verify that SST39VF801C-70-4C-MAQE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4C-MAQE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4C-MAQE-T meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4C-MAQE-T?
All SST39VF801C-70-4C-MAQE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4C-MAQE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4C-MAQE-T part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4C-MAQE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF801C-70-4C-MAQE-T Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
