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Microchip Technology SST39VF801C-70-4I-B3KE
- Part No.:
- SST39VF801C-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF801C-70-4I-B3KE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,177
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Product details
Overview
SST39VF801C-70-4I-B3KE from Microchip Technology is a 8 Mbit (512K × 16) Multi-Purpose Flash Plus memory IC with 70 ns read access time, single 2.7–3.6 V supply operation, and bottom-boot block protection. It delivers 100,000 program/erase cycles, >100 years data retention, and supports sector/block/chip erase for embedded firmware storage in industrial controllers and legacy system upgrades.
For engineers reviewing the SST39VF801C-70-4I-B3KE datasheet, SST39VF801C-70-4I-B3KE pinout, SST39VF801C-70-4I-B3KE application, or SST39VF801C-70-4I-B3KE equivalent, this page provides verified package mapping (48-ball WFBGA), JEDEC-compliant x16 interface timing, hardware write protection via WP#, and confirmed boot-block address range (00000H–01FFFH) - all critical for PCB layout, firmware update architecture, and drop-in replacement validation.
Technical Context
This device implements SST's SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count - eliminating software de-rating required by conventional flash. Its command-set architecture follows JEDEC standard pinouts and supports three-byte software data protection for Word-Program and six-byte sequences for Sector-, Block-, and Chip-Erase.
The SST39VF801C-70-4I-B3KE integrates RY/BY# (open-drain ready/busy), hardware reset (RST#), and dual status detection (DQ7 Data# Polling and DQ6 Toggle Bit) to synchronize host operations without polling overhead. Its bottom-boot configuration protects the lowest 8 KWord (00000H–01FFFH), distinguishing it from top-boot variants like SST39VF802C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization) - supports 16-bit parallel bus interface with full addressable space up to 0xFFFFF. |
| Read Access Time | 70 ns - enables direct connection to 14 MHz microcontrollers without wait states in standard mode. |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V systems and tolerant of brown-out conditions down to 2.7 V during active operation. |
| Endurance | 100,000 program/erase cycles - validated for firmware field updates over 10+ years in deployed industrial equipment. |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage for calibration tables and configuration data. |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (one 8-, two 4-, one 16-, fifteen 32-KWord) - allows granular firmware partitioning and recovery image isolation. |
| Boot Block Protection | Bottom 8 KWord (00000H–01FFFH) - safeguards bootloader code from accidental overwrite during application updates. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus (A0–A18); A16–A18 used for block/sector selection during erase commands. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write; high = standby (3 µA). |
| OE# | Output Enable | Active-low output gate; controls data bus drive; high = high-impedance state. |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing. |
| WP# | Hardware Write Protect | Active-low; grounds to lock bottom 8 KWord boot block (00000H–01FFFH) against erase/program. |
| RST# | Hardware Reset | Active-low; forces immediate return to Read mode; required TRP pulse width ≥ 100 ns. |
| RY/BY# | Ready/Busy# | Open-drain status indicator; requires external 10–100 kΩ pull-up; low = internal operation in progress. |
| VDD | Power Supply | 2.7–3.6 V supply; decoupling capacitor (0.1 µF) required within 5 mm of pin. |
| VSS | Ground | System ground reference; two dedicated pins for low-noise signal integrity. |
| NC | No Connection | Unbonded pads (A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, A12, A13, A14, A15, A17); must remain floating. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 18 ms sector/block erase time across full lifecycle - no software adaptation needed as endurance accumulates. |
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during active erase; critical for dual-bank firmware update without halting system operation. |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user-programmable segment - enables secure device authentication and OEM feature locking. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts power in intermittently polled status registers or configuration stores. |
| JEDEC Standard Compliance | Pinout and command set conform to JEDEC 44.4 for x16 flash - ensures interoperability with existing memory controllers and BIOS/UEFI firmware stacks. |
Applications
| Industrial PLC Firmware Storage | Legacy Embedded System Upgrade |
|---|---|
Use Scenario: Storing ladder logic programs and I/O configuration in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to CPU address space; accessed via 16-bit parallel bus with 70 ns timing compliance. Use Value: Bottom-boot protection prevents corruption of startup routines during remote firmware patches; 100-year retention eliminates recalibration drift in sealed enclosures. |
Use Scenario: Replacing obsolete EPROMs in avionics maintenance test sets requiring field-upgradable calibration constants. IC Role / Device Role / Timing Role: Drop-in x16 flash replacement with identical TSOP/WFBGA footprint options and JEDEC command compatibility. Use Value: 2.7–3.6 V operation matches aging 3.3 V power rails; sector-erase capability enables selective reprogramming of sensor offset tables without full chip erase. |
| Medical Device Bootloader | Telecom Base Station Configuration |
Use Scenario: Securing bootloader code in FDA-cleared diagnostic imaging hardware where firmware integrity is safety-critical. IC Role / Device Role / Timing Role: Protected boot block (00000H–01FFFH) holds signed verification keys and secure boot ROM stub. Use Value: Hardware WP# pin provides tamper-evident write disable; Security ID space stores cryptographic root-of-trust credentials. |
Use Scenario: Storing FPGA bitstreams and radio parameter profiles in outdoor 4G/LTE base station remote radio units. IC Role / Device Role / Timing Role: High-reliability configuration store interfaced to ARM-based management MCU via parallel bus. Use Value: 100,000-cycle endurance supports frequent RF calibration updates; RY/BY# pin enables deterministic interrupt-driven status polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4I-B3KE | Top-boot configuration (7E000H–7FFFFH protected), otherwise identical electrical/timing specs and pinout. | Used where bootloader resides in highest memory region; incompatible for bottom-boot designs without address remapping. | Select only if target system requires top-boot protection and address space alignment matches. |
| MX29LV800CTTI-70G | Same density, 70 ns access, 3.0–3.6 V supply; uses different command set (no CFI support); 48-TSOP only (no WFBGA). | Lacks Erase-Suspend and Security ID; requires modified driver firmware; unsuitable for space-constrained WFBGA layouts. | Consider only for cost-sensitive TSOP-based designs where advanced features are unused. |
Compared with SST39VF801C-70-4I-B3KE, the SST39VF802C variant offers identical performance but inverted boot-block location - requiring PCB-level address routing changes - while the MX29LV800CTTI demands firmware rework and sacrifices package flexibility and security features.
Availability
SST39VF801C-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloaders, telecom base station configuration, and legacy embedded system upgrades requiring stable component supply across extended product lifecycles.
Supply support for SST39VF801C-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and maintains the SuperFlash® flash memory portfolio for industrial, automotive, and aerospace applications.
The SST39VF801C product line targets cost-sensitive, high-reliability embedded systems requiring long-life nonvolatile storage with robust hardware data protection and JEDEC-standard interoperability.
FAQ
What is the boot block configuration of SST39VF801C-70-4I-B3KE?
The SST39VF801C-70-4I-B3KE implements bottom-boot block protection, securing the lowest 8 KWord (00000H–01FFFH) from accidental erase or program when WP# is grounded. This differs from SST39VF802C, which protects the top 8 KWord (7E000H–7FFFFH). The boot block address is fixed and cannot be reconfigured in SST39VF801C-70-4I-B3KE.
Does SST39VF801C-70-4I-B3KE support Erase-Suspend functionality?
Yes, SST39VF801C-70-4I-B3KE supports Erase-Suspend and Erase-Resume commands (B0H and 30H). This allows the host processor to temporarily halt an ongoing sector or block erase, read data from unprotected regions, or program other sectors - essential for real-time systems requiring concurrent firmware update and operation.
What package type is used in SST39VF801C-70-4I-B3KE?
SST39VF801C-70-4I-B3KE uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), distinct from the TSOP and TFBGA variants. This ultra-compact package supports high-density PCB layouts in space-constrained applications such as portable medical devices and small-form-factor telecom modules.
How is write protection implemented in SST39VF801C-70-4I-B3KE?
SST39VF801C-70-4I-B3KE provides dual-layer write protection: hardware block protection via the WP# pin (grounding locks the bottom 8 KWord boot block), and software data protection requiring validated three-byte (Word-Program) or six-byte (Erase) command sequences. Both mechanisms must be bypassed to alter protected memory regions.
What status indicators does SST39VF801C-70-4I-B3KE provide during write operations?
SST39VF801C-70-4I-B3KE provides three concurrent status methods: RY/BY# (open-drain ready/busy pin), DQ7 (Data# Polling), and DQ6 (Toggle Bit). These allow flexible host synchronization - interrupt-driven (RY/BY#), polling (DQ7), or edge-triggered (DQ6 toggling) - without requiring fixed timeout delays.
SST39VF801C-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF801C-70-4I-B3KE FAQ
1.How can I place an order for SST39VF801C-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4I-B3KE reliable?
The price and inventory of SST39VF801C-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4I-B3KE?
SST39VF801C-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4I-B3KE?
For technical support, including SST39VF801C-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39VF801C-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4I-B3KE?
All SST39VF801C-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF801C-70-4I-B3KE Tags
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