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Microchip Technology SST39VF801C-70-4I-EKE-T
- Part No.:
- SST39VF801C-70-4I-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF801C-70-4I-EKE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,414
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Product details
Overview
SST39VF801C-70-4I-EKE-T from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware block protection for bottom 8 KWord boot sector, and JEDEC-standard x16 parallel interface. It serves as nonvolatile program/data storage in embedded controllers, BIOS firmware, and industrial HMI systems.
For engineers reviewing the SST39VF801C-70-4I-EKE-T datasheet, SST39VF801C-70-4I-EKE-T pinout, SST39VF801C-70-4I-EKE-T application, or SST39VF801C-70-4I-EKE-T equivalent, key selection considerations include boot-block architecture (bottom-protect), TSOP-48 packaging, 100,000-cycle endurance, RY/BY# status signaling, and compatibility with standard microprocessor bus timing.
Technical Context
The SST39VF801C-70-4I-EKE-T implements a split-gate SuperFlash cell with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. Its command-set architecture supports JEDEC-standard software data protection (SDP) via six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.
It features dual status detection-Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2)-and an open-drain RY/BY# output requiring external pull-up. The device includes hardware write protection via WP#, reset control via RST#, and a 136-word Security ID space with factory-locked 128-bit segment and user-programmable 128-word segment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization); supports 16-bit parallel data bus interfacing with microcontrollers and ASICs. |
| Read Access Time | 70 ns (max); enables direct execution from flash (XIP) in real-time embedded systems without wait states at moderate clock speeds. |
| Supply Voltage | 2.7–3.6 V; compatible with 3.3 V system rails and tolerant of brown-out conditions down to 2.7 V during active operation. |
| Endurance | 100,000 program/erase cycles (typical); sufficient for field firmware updates over 10+ years in industrial control applications. |
| Data Retention | >100 years (typical); ensures long-term reliability in unpowered storage for medical, aerospace, and infrastructure equipment. |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (one 8-, two 4-, one 16-, fifteen 32-KWord); allows granular firmware patching without full chip erase. |
| Write Protection | Hardware bottom boot-block protection (00000H–01FFFH); prevents accidental overwrite of bootloader code during field updates. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mount. Pinout conforms to JEDEC standard for x16 parallel flash memories.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus; A18 is most significant bit; AMS = A18 for sector/block selection per JEDEC command protocol. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during write; tri-stated when CE# or OE# is high. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write operations; controls address/data latch timing with WE#. |
| OE# | Output Enable | Active-low output gate; determines data validity on DQ bus during read; high disables outputs. |
| WE# | Write Enable | Active-low write strobe; latches address/data and initiates command sequences; timing-critical for SDP execution. |
| WP# | Write Protect | Active-low hardware lock for bottom 8 KWord boot sector (00000H–01FFFH); grounded to prevent erase/program of bootloader region. |
| RST# | Reset Input | Active-low hardware reset; forces device into read mode and aborts in-progress erase/program; requires TRP pulse width ≥100 ns. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; pulled low during erase/program; requires 10–100 kΩ external pull-up to VDD for valid logic-high signaling. |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; VSS pins at positions 3, 22, and 48 provide low-inductance ground return paths for noise immunity. |
| NC | No Connect | Pins labeled NC (e.g., A13, A9, A12 on TSOP) are unconnected die pads; must remain floating per datasheet. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector delivers fixed 18 ms sector/block erase and 7 µs word-program times across full lifecycle. |
| Erase-Suspend/Resume | Allows temporary halt of erase to read/program other sectors; critical for real-time systems requiring concurrent firmware update and runtime data access. |
| Security ID Space | 136-word dedicated area: 128-bit factory-locked ID + 128-word user-programmable segment, supporting secure device authentication and traceability. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read access; eliminates need for external power management in battery-backed systems. |
| CFI Compliance | Supports Common Flash Interface query mode (98H command) for automatic driver configuration in OS-bootloader environments. |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to microcontroller address space; provides XIP-capable 70 ns read access for deterministic scan-cycle execution. Use Value: Bottom boot-block protection prevents corruption of startup code during remote firmware upgrades over Modbus TCP, ensuring fail-safe restart capability. | Use Scenario: Holding certified bootloader and diagnostic firmware in FDA-regulated patient monitors requiring audit-trail firmware versioning. IC Role / Device Role / Timing Role: Secure boot memory with factory-programmed Security ID; used during power-on self-test to validate firmware signature before execution. Use Value: 100-year data retention and 100,000-cycle endurance meet IEC 62304 Class C software lifecycle requirements without field replacement. |
| Automotive Infotainment Configuration | Networking Equipment Image Storage |
Use Scenario: Storing UI configuration profiles, language packs, and calibration tables in automotive head units operating across -40°C to +85°C ambient. IC Role / Device Role / Timing Role: Parallel x16 flash memory interfaced to ARM-based SoC; leverages RY/BY# pin for interrupt-driven status polling during OTA update verification. Use Value: TSOP-48 package meets AEC-Q100 Grade 3 thermal cycling requirements; 2.7–3.6 V operation supports wide-input DC-DC converters in vehicle electrical systems. | Use Scenario: Holding primary/backup firmware images and FPGA configuration bitstreams in enterprise switches and routers with hot-swap capability. IC Role / Device Role / Timing Role: Dual-image storage device supporting atomic firmware swap; uses sector-erase granularity to update feature modules without service interruption. Use Value: Uniform 2 KWord sectors enable precise patch deployment; erase-suspend allows background image validation while maintaining packet forwarding latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4I-EKE-T | Top boot-block protection (7E000H–7FFFFH) instead of bottom; identical timing, voltage, and command set. | Suitable for systems where bootloader resides in top memory region; not interchangeable without PCB address decoding changes. | Select only if board design routes A18/A17 to decode top-boot address range and WP# connects to top-block enable logic. |
| MX29LV800CTTC-70G | 70 ns access, 8 Mbit x16, but uses different command set (no CFI support), no Security ID, and 50,000-cycle endurance. | Lacks erase-suspend and auto low-power mode; requires modified driver software and offers lower long-term reliability. | Consider only for cost-sensitive legacy designs where firmware update frequency is low and security features are unnecessary. |
Compared with SST39VF801C-70-4I-EKE-T, the SST39VF802C variant shifts protected boot region to top address space-requiring hardware redesign-while the MX29LV800CTTC lacks critical reliability and security features needed for modern embedded firmware storage.
Availability
SST39VF801C-70-4I-EKE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader memory, and automotive infotainment configuration requiring stable component supply across extended product lifecycles.
Supply support for SST39VF801C-70-4I-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company delivering smart, connected, and secure embedded control solutions, with leadership in microcontrollers, analog, FPGA, and memory products.
The SST39VF801C-70-4I-EKE-T belongs to Microchip's SuperFlash® parallel NOR flash product line, engineered for high-reliability embedded firmware storage in industrial, medical, and automotive applications demanding long data retention and robust in-field update capability.
FAQ
What is the boot-block protection scheme implemented in the SST39VF801C-70-4I-EKE-T?
The SST39VF801C-70-4I-EKE-T implements bottom hardware block protection covering address range 00000H–01FFFH (8 KWord). When WP# is grounded, this region is locked against erase and program operations. This matches the bootloader placement convention in many ARM and MIPS-based embedded systems. The SST39VF801C-70-4I-EKE-T does not support top-boot protection-only the SST39VF802C variant does.
Does the SST39VF801C-70-4I-EKE-T support Common Flash Interface (CFI) queries?
Yes, the SST39VF801C-70-4I-EKE-T supports CFI Query mode via the 98H command sequence at address 555H or the alternate 55H/98H entry method. Once entered, CFI data-including vendor ID, device geometry, and timing parameters-is readable at standardized offsets (e.g., 10H–12H for "QRY" string). This enables automatic driver initialization in Linux MTD and U-Boot environments. The SST39VF801C-70-4I-EKE-T exits CFI mode using the F0H exit command.
How does the SST39VF801C-70-4I-EKE-T indicate completion of a word-program operation?
The SST39VF801C-70-4I-EKE-T provides three concurrent status detection methods: Data# Polling (DQ7 toggles until completion, then returns true data), Toggle Bit (DQ6 toggles during operation, stops when complete), and RY/BY# (open-drain pin pulled low during programming). All are valid after the rising edge of the fourth WE# pulse. The SST39VF801C-70-4I-EKE-T requires no internal VPP generation-the device uses internal charge pumps for programming voltage.
What package type is used for the SST39VF801C-70-4I-EKE-T?
The SST39VF801C-70-4I-EKE-T is supplied in a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm footprint and standard pitch (0.5 mm). This package is RoHS-compliant, JEDEC MO-142 compliant, and optimized for reflow soldering in high-volume PCB assembly. The "EKE" suffix in the part number explicitly denotes the TSOP-48 variant-distinct from TFBGA or WFBGA versions of the same family.
Can the SST39VF801C-70-4I-EKE-T be used in systems requiring >100,000 firmware update cycles?
The SST39VF801C-70-4I-EKE-T is rated for 100,000 program/erase cycles (typical), with wear leveling left to system-level software. For applications exceeding this-such as frequent OTA updates in IoT gateways-designers must implement logical-to-physical address mapping and block rotation in firmware. The SST39VF801C-70-4I-EKE-T itself does not include built-in wear leveling; endurance beyond spec requires careful host-side management of erase distribution across sectors.
SST39VF801C-70-4I-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF801C-70-4I-EKE-T FAQ
1.How can I place an order for SST39VF801C-70-4I-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4I-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4I-EKE-T reliable?
The price and inventory of SST39VF801C-70-4I-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4I-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4I-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4I-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4I-EKE-T?
SST39VF801C-70-4I-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4I-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4I-EKE-T?
For technical support, including SST39VF801C-70-4I-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4I-EKE-T requirements.
6.How does Aetrix verify that SST39VF801C-70-4I-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4I-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4I-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4I-EKE-T?
All SST39VF801C-70-4I-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4I-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4I-EKE-T part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4I-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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