My Inquiry
My Account
Microchip Technology SST39VF801C-70-4I-MAQE
- Part No.:
- SST39VF801C-70-4I-MAQE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39VF801C-70-4I-MAQE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,736
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF801C-70-4I-MAQE from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware block protection for bottom 8 KWord boot sector, and JEDEC-standard x16 pinout. It serves as nonvolatile program/data storage in embedded controllers, BIOS firmware modules, and industrial HMI systems.
For engineers reviewing the SST39VF801C-70-4I-MAQE datasheet, SST39VF801C-70-4I-MAQE pinout, SST39VF801C-70-4I-MAQE application, or SST39VF801C-70-4I-MAQE equivalent, key selection considerations include bottom-boot block architecture, TSOP-48 package compatibility, 100,000-cycle endurance, RY/BY# status signaling, and software/hardware data protection schemes.
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. It supports uniform 2 KWord sector erase, flexible block erase (fifteen 32 KWord + one 16 KWord + two 4 KWord + one 8 KWord), and full-chip erase - all initiated via JEDEC-compliant command sequences.
Operation relies on latched address/data inputs, CMOS I/O compatibility, and three status detection methods: Ready/Busy# (open-drain), Data# Polling (DQ7), and Toggle Bits (DQ6/DQ2). Hardware protection includes WP#-controlled bottom boot block lock, RST# reset, and noise/glitch immunity on WE#/CE#.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 8 Mbit (512K × 16 organization), providing 1 MB of x16 data storage space |
| Read Access Time | 70 ns - determines minimum bus cycle timing for CPU or controller interface |
| Supply Voltage | 2.7–3.6 V - enables direct integration with 3.3 V logic systems without level shifting |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
| Data Retention | Greater than 100 years - ensures long-term reliability in unpowered storage applications |
| Active Current | 5 mA typical at 5 MHz - defines power budget during active read operations |
| Standby Current | 3 µA typical - enables ultra-low-power operation in sleep or idle states |
| Erase Time | 18 ms typical for sector/block, 40 ms for chip - impacts firmware update latency |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS compliant, standard JEDEC x16 flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Latched address lines; AMS = A18 selects top/bottom boot blocks during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; tri-stated when CE# or OE# high; latched during write |
| CE# | Chip Enable | Active-low chip select; device enters standby when high |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read |
| WE# | Write Enable | Active-low control for program/erase command latching and execution |
| WP# | Write Protect | Active-low hardware lock for bottom 8 KWord boot block (00000H–01FFFH) |
| RST# | Reset | Active-low hardware reset to Read mode; terminates in-progress operations |
| RY/BY# | Ready/Busy# | Open-drain status output requiring external 10–100 kΩ pull-up; low = busy |
| VDD | Power Supply | 2.7–3.6 V supply; powers core and I/O circuits |
| VSS | Ground | Reference ground for all signals and internal logic |
| NC | No Connection | Unbonded pins (e.g., A13, A9, A12 in TSOP); must be left floating or grounded per layout |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 18 ms erase time regardless of accumulated cycles |
| Bottom Boot Block Protection | Hardware lock on 8 KWord (00000H–01FFFH) prevents accidental BIOS/firmware overwrite |
| Erase-Suspend/Resume | Allows temporary halt of erase to read/program other sectors - critical for real-time system responsiveness |
| Security ID Space | Factory-programmed 128-bit ID + user-programmable 128-word space for device authentication or traceability |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts dynamic power by >99% |
| CFI Support | Common Flash Interface enables standardized driver support across OS and bootloader environments |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing firmware images and calibration tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile x16 program memory mapped into microcontroller address space; accessed via parallel bus with 70 ns timing compliance. Use Value: Bottom boot block protection ensures bootloader integrity during field firmware updates; 100-year retention guarantees data persistence across equipment lifecycle. | Use Scenario: Holding device-specific configuration parameters and safety-critical operational limits in diagnostic imaging equipment. IC Role / Device Role / Timing Role: Standalone configuration EEPROM replacement with faster 70 ns reads and higher endurance than legacy serial EEPROMs. Use Value: Erase-suspend capability allows concurrent parameter read/write during runtime diagnostics without halting system operation. |
| Automotive Infotainment Bootloader | Network Router Firmware Image |
Use Scenario: Hosting secure bootloader code in automotive head units requiring ASIL-B compatible nonvolatile storage. IC Role / Device Role / Timing Role: Boot memory accessed at power-on reset; bottom 8 KWord contains verified startup code protected by WP#. Use Value: Hardware block protection + software data protection (SDP) provides dual-layer security against unauthorized modification. | Use Scenario: Storing primary and fallback firmware images in enterprise-grade network routers requiring fast recovery after failed updates. IC Role / Device Role / Timing Role: Dual-image flash memory supporting A/B partitioning; sector-erase enables atomic image switching. Use Value: Uniform 2 KWord sectors allow precise firmware patching; 40 ms chip-erase enables rapid factory reprogramming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4I-MAQE | Top-boot architecture (7E000H–7FFFFH protected), identical timing, voltage, and command set | Used where bootloader resides in top memory region instead of bottom | Select when system design requires top-boot block protection rather than bottom-boot |
| MX29LV800CTTI-70G | Same 8 Mbit x16, 70 ns, 3.0–3.6 V; different command set and CFI implementation; no Erase-Suspend | Lacks suspend/resume; requires full erase before partial update | Choose only if existing driver stack is optimized for Macronix command protocol and suspend capability is not required |
Compared with SST39VF801C-70-4I-MAQE, SST39VF802C-70-4I-MAQE offers identical performance but inverted boot-block location, while MX29LV800CTTI-70G sacrifices erase-suspend functionality for broader ecosystem compatibility - making SST39VF801C-70-4I-MAQE optimal for systems needing real-time firmware patching with guaranteed bootloader protection.
Availability
SST39VF801C-70-4I-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and automotive infotainment bootloader applications requiring stable component supply and long-term obsolescence management.
Supply support for SST39VF801C-70-4I-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company delivering smart, connected, and secure embedded control solutions with broad portfolio coverage and long-lifecycle support.
The SST39VF801C-70-4I-MAQE belongs to Microchip's SuperFlash® Multi-Purpose Flash Plus family, designed specifically for cost-sensitive, high-reliability embedded systems requiring fast, secure, and energy-efficient nonvolatile code and data storage.
FAQ
What is the boot block configuration of SST39VF801C-70-4I-MAQE?
The SST39VF801C-70-4I-MAQE features bottom-boot block protection covering the lowest 8 KWord (00000H–01FFFH), which is hardware-locked when WP# is grounded. This architecture safeguards bootloader code from accidental overwrite during firmware updates. The protected region is fixed and cannot be reconfigured. SST39VF801C-70-4I-MAQE does not support top-boot configuration - that function is implemented in the SST39VF802C variant.
Does SST39VF801C-70-4I-MAQE require an external VPP voltage for programming?
No, SST39VF801C-70-4I-MAQE does not require external VPP. It uses internal charge pump circuitry to generate necessary high-voltage programming pulses from the single 2.7–3.6 V VDD supply. This eliminates need for dedicated VPP regulators or external high-voltage sources, simplifying board design and reducing BOM cost. All program and erase operations execute autonomously using internally generated voltages.
How is write completion detected on SST39VF801C-70-4I-MAQE?
SST39VF801C-70-4I-MAQE supports three concurrent write completion detection methods: Ready/Busy# (RY/BY#) open-drain signal, Data# Polling on DQ7, and Toggle Bit monitoring on DQ6 (and DQ2 for sector status). RY/BY# requires external pull-up; DQ7 toggles complement during operation then returns true data; DQ6 toggles between 1/0 until completion. These mechanisms enable efficient polling or interrupt-driven firmware handling without fixed timeout delays.
Can SST39VF801C-70-4I-MAQE be used in place of SST39VF802C-70-4I-MAQE?
SST39VF801C-70-4I-MAQE and SST39VF802C-70-4I-MAQE share identical electrical specifications, timing, and command sets, but differ in boot block location: SST39VF801C-70-4I-MAQE protects the bottom 8 KWord (00000H–01FFFH), while SST39VF802C-70-4I-MAQE protects the top 8 KWord (7E000H–7FFFFH). Direct substitution is possible only if the target system's bootloader resides in the bottom region and WP# is correctly routed. PCB layout and firmware address mapping must be verified prior to replacement.
What package type is used in SST39VF801C-70-4I-MAQE?
SST39VF801C-70-4I-MAQE uses a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm body size and standard JEDEC MO-142AC footprint. The "-MAQE" suffix explicitly denotes this TSOP-48 variant. It is RoHS compliant and pin-compatible with other x16 flash devices in the same package, enabling drop-in replacement in existing designs meeting JEDEC x16 flash mechanical and thermal constraints.
SST39VF801C-70-4I-MAQE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39VF801C-70-4I-MAQE FAQ
1.How can I place an order for SST39VF801C-70-4I-MAQE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF801C-70-4I-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF801C-70-4I-MAQE reliable?
The price and inventory of SST39VF801C-70-4I-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF801C-70-4I-MAQE is usually 5 days.
3.What payment methods are accepted for SST39VF801C-70-4I-MAQE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF801C-70-4I-MAQE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF801C-70-4I-MAQE?
SST39VF801C-70-4I-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF801C-70-4I-MAQE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF801C-70-4I-MAQE?
For technical support, including SST39VF801C-70-4I-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF801C-70-4I-MAQE requirements.
6.How does Aetrix verify that SST39VF801C-70-4I-MAQE is sourced from the original manufacturer or authorized distributors?
All SST39VF801C-70-4I-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF801C-70-4I-MAQE meets industry standards.
7.What is the process for return or replacement of SST39VF801C-70-4I-MAQE?
All SST39VF801C-70-4I-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF801C-70-4I-MAQE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF801C-70-4I-MAQE part is unused and in its original packaging.
Return procedure for SST39VF801C-70-4I-MAQE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF801C-70-4I-MAQE Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
