Microchip Technology SST39VF802C-70-4C-B3KE

Overview

SST39VF802C-70-4C-B3KE from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware top-block protection (7E000H–7FFFFH), and JEDEC-standard x16 parallel interface for embedded firmware storage in industrial controllers.

For engineers reviewing the SST39VF802C-70-4C-B3KE datasheet, SST39VF802C-70-4C-B3KE pinout, SST39VF802C-70-4C-B3KE application, or SST39VF802C-70-4C-B3KE equivalent, this page delivers verified package mapping (48-ball WFBGA), confirmed sector/block erase architecture, validated RY/BY# status signaling, and real-world boot code storage use cases - all extracted from DS25041A Rev A.

Technical Context

This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It supports JEDEC-standard command sets including Software Data Protection (SDP) with six-byte erase sequences and three-byte program sequences.

It integrates dual status detection: DQ6/DQ2 toggle bits and DQ7 data# polling, plus open-drain RY/BY# output requiring external 10 kΩ–100 kΩ pull-up. The SST39VF802C variant features top-boot block protection (8 KWord at 7E000H–7FFFFH), distinct from SST39VF801C's bottom-boot configuration.

Key Specifications

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side thermal pad optional per DS25041A Figure 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Compared with SST39VF802C-70-4C-B3KE, the SST39VF801C offers identical performance but inverted boot-block location - requiring PCB-level address routing changes - while the MX29LV800CTTI-70G sacrifices RST# abort and Security ID for lower unit cost and TSOP packaging.

Availability

SST39VF802C-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloaders, automotive telematics gateways, and network router configuration memory requiring stable component supply and long-term lifecycle support.

Supply support for SST39VF802C-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company delivering microcontrollers, analog, FPGA, and memory solutions with focus on reliability and longevity for industrial and automotive markets.

The SST39VF802C belongs to Microchip's SuperFlash® parallel NOR flash product line, designed specifically for embedded systems requiring deterministic boot code execution, field firmware updates, and hardware-enforced data protection in harsh environments.

FAQ

What is the exact memory organization of the SST39VF802C-70-4C-B3KE?

The SST39VF802C-70-4C-B3KE is organized as 512K × 16, totaling 8 Mbit (1,048,576 bytes) of addressable memory space. Its top-boot block spans addresses 7E000H–7FFFFH (8 KWord = 32 KB), and it uses A0–A18 address lines with AMS = A18. This structure is confirmed in DS25041A Table 2 and Figure 1, and applies specifically to the SST39VF802C-70-4C-B3KE variant.

Does the SST39VF802C-70-4C-B3KE support hardware reset abort of erase/program operations?

Yes, the SST39VF802C-70-4C-B3KE includes an active-low RST# pin that terminates any in-progress erase or program operation and returns the device to read mode within TRP (reset pulse width). This is documented in DS25041A Section "Hardware Reset (RST#)" and Table 1, and is a distinguishing feature versus many competing parallel flash devices.

How does the SST39VF802C-70-4C-B3KE indicate completion of a word-program operation?

The SST39VF802C-70-4C-B3KE provides three concurrent methods: DQ7 data# polling (complement → true data), DQ6 toggle bit (alternating 1/0 → static), and RY/BY# pin (open-drain low → high). All are valid after the rising edge of the fourth WE# pulse, per DS25041A Section "Data# Polling (DQ7)" and Table 3 - no software delay or timeout is required.

Is the SST39VF802C-70-4C-B3KE pin-compatible with the SST39VF801C-70-4C-B3KE?

Yes, the SST39VF802C-70-4C-B3KE and SST39VF801C-70-4C-B3KE share identical pinout, timing, voltage, and command set - differing only in boot-block location (top vs. bottom) and device ID (233AH vs. 233BH per DS25041A Table 5). No PCB change is needed; only firmware address mapping differs.

What package type is used in the SST39VF802C-70-4C-B3KE suffix "B3KE"?

The "B3KE" suffix denotes the 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch) with exposed thermal pad option, as specified in DS25041A Figure 4 and Package Ordering Information. This matches the pin assignment diagram on page 5 and is distinct from the TSOP and TFBGA variants listed in the same datasheet.