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Microchip Technology SST39VF802C-70-4C-B3KE-T
- Part No.:
- SST39VF802C-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF802C-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,332
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Product details
Overview
SST39VF802C-70-4C-B3KE-T from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware top-block protection, and JEDEC-standard x16 parallel interface - used for firmware storage and boot code in industrial microcontroller systems.
For engineers reviewing the SST39VF802C-70-4C-B3KE-T datasheet, SST39VF802C-70-4C-B3KE-T pinout, SST39VF802C-70-4C-B3KE-T application, or SST39VF802C-70-4C-B3KE-T equivalent, this page delivers verified specifications, TSOP-48 pin mapping, boot-block architecture details, endurance/reliability metrics, and real-world use context for embedded system design and BOM validation.
Technical Context
The SST39VF802C-70-4C-B3KE-T implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. It supports JEDEC-standard command sets including sector/block/chip-erase, erase-suspend/resume, and CFI query mode.
It features dual status detection (DQ6 toggle bit and DQ7 data# polling), open-drain RY/BY# output with external pull-up, hardware write protection via WP# for top 8 KWord boot block (7E000H–7FFFFH), and latched address/data bus timing compatible with standard microprocessor buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 16 (8 Mbit total capacity) |
| Read Access Time | 70 ns - determines minimum bus cycle time for reliable firmware fetch in 8/16-bit microcontrollers |
| Supply Voltage Range | 2.7–3.6 V - enables direct integration with 3.3 V logic systems without level-shifting |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
| Data Retention | Greater than 100 years - ensures long-term reliability in unpowered storage applications |
| Active Current (5 MHz) | 5 mA typical - defines power budget impact during active code execution |
| Standby Current | 3 µA typical - enables low-power sleep modes in battery-backed or energy-sensitive systems |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC x16 parallel flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; AMS = A18 for block/sector selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-state when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select - enables device for read/write when low; high disables outputs |
| OE# | Output Enable | Active-low output gate - controls data bus drive during read; does not affect write operations |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Write Protect | Hardware top-boot block lock - grounded to protect 7E000H–7FFFFH (8 KWord) from accidental erase/program |
| RST# | Reset Input | Hardware reset to Read mode - terminates in-progress operations and restores array access |
| RY/BY# | Ready/Busy Output | Open-drain status indicator - low during erase/program; requires 10–100 kΩ pull-up |
| VDD | Power Supply | 2.7–3.6 V supply - powers core and I/O; internally regulates for SuperFlash programming |
| VSS | Ground | Reference ground for all signals and internal circuitry |
| NC | No Connection | Unbonded pins - must be left floating or tied to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector - delivers stable 70 ns read and 7 µs word-program regardless of accumulated cycles |
| Top Boot Block Protection | Hardware-locked 8 KWord region (7E000H–7FFFFH) - prevents corruption of boot code during field updates |
| Erase-Suspend/Resume | Allows read access to non-suspended sectors during erase - enables real-time diagnostics and interrupt handling |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user space - supports secure device authentication and traceability |
| CFI Compliance | JEDEC Common Flash Interface support - enables auto-detection and standardized driver integration in BIOS/bootloader |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code |
|---|---|
Use Scenario: Storing and updating firmware for programmable logic controllers in factory automation environments with temperature cycling and EMI exposure. IC Role / Device Role / Timing Role: Nonvolatile parallel flash memory providing boot code and application firmware with deterministic 70 ns read latency. Use Value: Top-boot hardware protection prevents accidental overwrite of critical startup routines during remote firmware upgrades. |
Use Scenario: Holding certified bootloader and safety-critical initialization code in Class II medical equipment requiring long-term data integrity. IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash memory serving as primary boot source for ARM Cortex-M based diagnostic subsystems. Use Value: 100-year data retention and 100,000-cycle endurance meet IEC 62304 software lifecycle requirements for deployed devices. |
| Telecom Baseband Processor Config | Automotive Infotainment Head Unit |
Use Scenario: Storing configuration tables and calibration parameters for LTE/5G baseband processors in outdoor small-cell radios. IC Role / Device Role / Timing Role: Parallel flash memory interfaced directly to DSP memory bus for low-latency parameter access during signal processing. Use Value: Sector-erase capability (2 KWord uniform blocks) allows granular updates of RF calibration data without disturbing adjacent functional modules. |
Use Scenario: Hosting infotainment OS kernel and UI assets in automotive head units where vibration, thermal stress, and ESD are operational concerns. IC Role / Device Role / Timing Role: High-reliability flash memory with RY/BY# status signaling for synchronized firmware loading during cold start. Use Value: Auto Low Power mode reduces active read current to 3 µA after access - lowers system-level power draw during display idle states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV800CTTI-70G | 8 Mbit (512K × 16), 70 ns, 2.7–3.6 V, but uses different command set and lacks erase-suspend/resume | No hardware top-boot protection; relies on software lock bits only - higher risk of inadvertent boot sector corruption | Acceptable for cost-sensitive designs where erase-suspend and hardware WP# are not required |
| EN29LV800AB-70TP | 8 Mbit (512K × 16), 70 ns, 2.7–3.6 V, supports CFI but has no Security ID feature | Bottom-boot architecture (00000H–01FFFH) - incompatible pin-compatible replacement without PCB redesign | Only suitable if boot block location matches system address map and security ID is unnecessary |
Compared with MX29LV800CTTI-70G and EN29LV800AB-70TP, the SST39VF802C-70-4C-B3KE-T uniquely combines top-boot hardware protection, erase-suspend capability, and factory/user Security ID - making it optimal for safety-critical and field-upgradable embedded systems where boot integrity and traceability are mandatory.
Availability
SST39VF802C-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code, telecom baseband configuration, and automotive infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for SST39VF802C-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company formed through the acquisition of Silicon Storage Technology (SST), specializing in flash memory, MCUs, analog, and interface solutions for industrial, automotive, and communications markets.
The SST39VF802C-70-4C-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for reliable, low-voltage parallel flash applications demanding high endurance, fast erase/program, and robust hardware data protection in mission-critical embedded systems.
FAQ
What is the boot block configuration of the SST39VF802C-70-4C-B3KE-T?
The SST39VF802C-70-4C-B3KE-T implements top-boot block protection covering the 8 KWord address range 7E000H–7FFFFH. This is hardwired behavior confirmed in Table 4 and Table 2 of DS25041A. The WP# pin must be grounded to activate hardware lock on this region. Unlike bottom-boot variants (e.g., SST39VF801C), the SST39VF802C-70-4C-B3KE-T does not protect the lower memory segment.
Does the SST39VF802C-70-4C-B3KE-T support erase-suspend functionality?
Yes, the SST39VF802C-70-4C-B3KE-T supports both Erase-Suspend and Erase-Resume commands (B0H and 30H respectively) as defined in Section 7 of DS25041A. This allows reading from non-suspended sectors or programming other blocks while an erase operation is paused - a key capability for real-time systems requiring concurrent memory access.
What package type is used in the SST39VF802C-70-4C-B3KE-T part number suffix?
The "B3KE-T" suffix in SST39VF802C-70-4C-B3KE-T indicates a 48-lead TSOP package (12 mm × 20 mm) with lead-free (RoHS-compliant) finish and tape-and-reel packaging. This matches Figure 2 and Table 1 in DS25041A, and is distinct from TFBGA or WFBGA variants denoted by other suffixes.
How is end-of-write detection implemented in the SST39VF802C-70-4C-B3KE-T?
The SST39VF802C-70-4C-B3KE-T provides three complementary end-of-write detection methods: DQ6 toggle bit, DQ7 data# polling, and RY/BY# open-drain status output. DQ6 toggles during internal program/erase and stops when complete; DQ7 complements true data until completion; RY/BY# pulls low during operation and releases high when ready - all documented in Tables 3 and 9 of DS25041A.
Is the SST39VF802C-70-4C-B3KE-T compatible with JEDEC-standard x16 flash interfaces?
Yes, the SST39VF802C-70-4C-B3KE-T conforms fully to JEDEC standard pinouts and command sets for x16 parallel flash memories, as explicitly stated on page 2 and page 4 of DS25041A. It supports standard read, word-program, sector/block/chip-erase, and CFI query operations using JEDEC-defined timing and voltage thresholds.
SST39VF802C-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF802C-70-4C-B3KE-T FAQ
1.How can I place an order for SST39VF802C-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF802C-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF802C-70-4C-B3KE-T reliable?
The price and inventory of SST39VF802C-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF802C-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF802C-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF802C-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF802C-70-4C-B3KE-T?
SST39VF802C-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF802C-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF802C-70-4C-B3KE-T?
For technical support, including SST39VF802C-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF802C-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39VF802C-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF802C-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF802C-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF802C-70-4C-B3KE-T?
All SST39VF802C-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF802C-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF802C-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF802C-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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