Microchip Technology SST39VF802C-70-4C-EKE
- Part No.:
- SST39VF802C-70-4C-EKE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39VF802C-70-4C-EKE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,657
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF802C-70-4C-EKE from Microchip Technology is a 8 Mbit (512K × 16) Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded program/data storage in microcontroller-based systems. It operates from 2.7–3.6V, delivers 70 ns read access time, supports hardware block protection on the top 8 KWord boot sector, and features sector/block/chip erase with erase-suspend/resume capability.
For engineers reviewing the SST39VF802C-70-4C-EKE datasheet, SST39VF802C-70-4C-EKE pinout, SST39VF802C-70-4C-EKE application, or SST39VF802C-70-4C-EKE equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block protection mapping, SuperFlash endurance/reliability data, and real-world use cases in firmware-updatable industrial controllers and legacy BIOS modules.
Technical Context
This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It uses standard JEDEC x16 flash command sets and supports CFI Query mode for automatic configuration detection.
Hardware protection is implemented via dedicated WP# pin controlling top-boot block (7E000H–7FFFFH), while RY/BY# provides open-drain ready/busy status signaling. The device integrates latched address/data paths, auto low-power mode (3 µA standby), and dual status detection (DQ6 toggle + DQ7 polling) for robust write-cycle management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), directly maps to 16-bit data bus systems without glue logic |
| Read Access Time | 70 ns - enables direct connection to 14 MHz microcontrollers without wait states |
| Supply Voltage | 2.7–3.6V - compatible with 3.3V I/O domains and brown-out tolerant power rails |
| Endurance | 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (1×8K, 2×4K, 1×16K, 15×32K) - supports granular firmware partitioning |
| Security ID | 128-bit factory ID + 128-word user-programmable space - enables device authentication and version tracking |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, JEDEC-standard x16 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K × 16 addressing; AMS = A18 for sector/block selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with tri-state output control via OE# and CE# |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read operations |
| WE# | Write Enable | Active-low control for all write operations (program/erase); latches command sequences |
| WP# | Write Protect | Active-low hardware lock for top boot block (7E000H–7FFFFH); floating = unprotected |
| RST# | Reset | Active-low hardware reset to read mode; terminates in-progress operations |
| RY/BY# | Ready/Busy# | Open-drain status output requiring external 10–100 kΩ pull-up; low = busy, high = ready |
| VDD | Power Supply | 2.7–3.6V core and I/O supply; internal VPP generation eliminates external high-voltage source |
| VSS | Ground | Two dedicated ground pins for noise reduction in high-speed read/write transitions |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time reads or programming in non-suspended sectors during active erase - critical for interrupt-driven firmware update routines |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts dynamic power by >99% in burst-read scenarios |
| SuperFlash® Reliability | Fixed 7 µs program / 18 ms erase times across full lifecycle - eliminates software de-rating and timing margin expansion |
| JEDEC x16 Pinout Compliance | Direct drop-in replacement for industry-standard 8 Mbit x16 flash devices - no PCB redesign required |
| Hardware Block Protection | Top 8 KWord boot sector (7E000H–7FFFFH) protected independently via WP# - prevents accidental bootloader corruption |
Applications
| Industrial PLC Firmware Storage | Legacy BIOS/UEFI Module |
|---|---|
|
Use Scenario: Storing upgradable ladder logic and I/O configuration in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into MCU address space; accessed via 16-bit parallel bus at ≤14 MHz. Use Value: Top-boot protection prevents accidental overwrite of bootloader during field firmware updates; 100,000-cycle endurance supports 5+ years of scheduled revisions. |
Use Scenario: Holding BIOS initialization code and hardware abstraction layer in x86-based industrial motherboards. IC Role / Device Role / Timing Role: Boot ROM accessed during CPU reset vector fetch; requires sub-70 ns access to meet chipset timing budgets. Use Value: 70 ns read speed meets Intel 440BX/Pentium II timing requirements; CFI Query support enables automatic firmware recovery tool detection. |
| Medical Device Configuration Memory | Telecom Line Card Boot Image |
|
Use Scenario: Storing calibration tables, safety-critical parameter sets, and regulatory compliance flags in FDA-cleared diagnostic equipment. IC Role / Device Role / Timing Role: Secure configuration store accessed only during power-on self-test; write-protected except during certified service mode. Use Value: Dual security ID (factory + user) enables traceable calibration chain-of-custody; >100-year data retention satisfies ISO 13485 archival requirements. |
Use Scenario: Hosting boot firmware and FPGA configuration bitstreams on carrier-grade DSLAM line cards. IC Role / Device Role / Timing Role: Primary boot image memory interfaced to ARM9 host processor; erased/reprogrammed remotely via OAM channel. Use Value: Erase-suspend allows live diagnostics during background firmware upgrade; uniform 2 KWord sectors enable atomic patch deployment without service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV800CTTC-70G | 70 ns access, same 8 Mbit x16 density, but uses conventional floating-gate architecture; no erase-suspend; 100K cycles rated at 3.0–3.6V only | Lacks top-boot hardware protection and CFI Query mode; requires software-managed block locking | Choose when cost sensitivity outweighs need for suspend/resume or factory ID security |
| EN29LV800AB-70TP | 70 ns access, 8 Mbit x16, supports top-boot protection and CFI, but endurance limited to 10K cycles; no Security ID feature | Compatible pinout and command set, but lower reliability limits field update frequency | Prefer for short-lifecycle consumer products where firmware rarely changes post-deployment |
Compared with MX29LV800CTTC-70G and EN29LV800AB-70TP, SST39VF802C-70-4C-EKE delivers superior long-term reliability (100K vs. 10K–100K cycles), integrated hardware boot protection, and factory/user Security ID - making it optimal for medical, industrial, and telecom applications requiring secure, field-upgradable firmware with multi-decade data integrity.
Availability
SST39VF802C-70-4C-EKE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy BIOS modules, medical device configuration memory, and telecom line card boot image applications requiring stable component supply and long-term obsolescence management.
Supply support for SST39VF802C-70-4C-EKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now manufactures and supports the SST39VF family as part of its broad portfolio of serial and parallel flash memory solutions.
The SST39VF802C-70-4C-EKE belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered specifically for reliable, low-power, field-upgradable firmware and configuration storage in resource-constrained embedded systems.
FAQ
What is the boot block configuration of SST39VF802C-70-4C-EKE?
The SST39VF802C-70-4C-EKE implements top-boot block protection covering address range 7E000H–7FFFFH (8 KWord). This is hardwired behavior confirmed in Table 4 and Section 10 of DS25041A. When WP# is grounded, program/erase operations are blocked in this region - protecting bootloader code from accidental overwrite. The SST39VF802C-70-4C-EKE does not support bottom-boot configuration; that variant is SST39VF801C.
Does SST39VF802C-70-4C-EKE require an external VPP voltage?
No, SST39VF802C-70-4C-EKE integrates internal VPP generation and operates solely from a single 2.7–3.6V VDD supply. This eliminates the need for external high-voltage circuitry, simplifying board design and reducing BOM cost. All program and erase functions - including Word-Program, Sector-Erase, Block-Erase, and Chip-Erase - execute using only the main VDD rail. The SST39VF802C-70-4C-EKE datasheet explicitly states "Internal VPP Generation" under Features.
How is write completion detected on SST39VF802C-70-4C-EKE?
The SST39VF802C-70-4C-EKE supports three concurrent write completion detection methods: Ready/Busy# (RY/BY#) open-drain output, Data# Polling (DQ7), and Toggle Bit (DQ6). RY/BY# goes high when ready; DQ7 toggles during operation and stabilizes to true data upon completion; DQ6 toggles continuously until operation ends. These mechanisms allow flexible host-side timing control without fixed delays. All three are fully documented for SST39VF802C-70-4C-EKE in Sections 8–9 of DS25041A.
Is SST39VF802C-70-4C-EKE pin-compatible with SST39VF801C?
No, SST39VF802C-70-4C-EKE and SST39VF801C are not pin-compatible replacements due to differing boot block architectures - SST39VF802C-70-4C-EKE protects the top 8 KWord (7E000H–7FFFFH), while SST39VF801C protects the bottom 8 KWord (00000H–01FFFH). Although both share identical pinouts and command sets, substituting one for the other without firmware and address map validation risks corrupting protected regions. The SST39VF802C-70-4C-EKE datasheet confirms this distinction in Table 4 and Section 10.
What package type is used in SST39VF802C-70-4C-EKE?
SST39VF802C-70-4C-EKE uses a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm body dimensions and standard JEDEC MO-141AC footprint. This is explicitly stated in the "Packages Available" section of DS25041A and confirmed in Figure 2 (Pin Assignments for 48-Lead TSOP). The "-EKE" suffix denotes this TSOP variant; alternative packages (TFBGA/WFBGA) use different suffixes (e.g., "-B3K", "-MAQ").
SST39VF802C-70-4C-EKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39VF802C-70-4C-EKE FAQ
1.How can I place an order for SST39VF802C-70-4C-EKE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF802C-70-4C-EKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF802C-70-4C-EKE reliable?
The price and inventory of SST39VF802C-70-4C-EKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF802C-70-4C-EKE is usually 5 days.
3.What payment methods are accepted for SST39VF802C-70-4C-EKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF802C-70-4C-EKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF802C-70-4C-EKE?
SST39VF802C-70-4C-EKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF802C-70-4C-EKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF802C-70-4C-EKE?
For technical support, including SST39VF802C-70-4C-EKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF802C-70-4C-EKE requirements.
6.How does Aetrix verify that SST39VF802C-70-4C-EKE is sourced from the original manufacturer or authorized distributors?
All SST39VF802C-70-4C-EKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF802C-70-4C-EKE meets industry standards.
7.What is the process for return or replacement of SST39VF802C-70-4C-EKE?
All SST39VF802C-70-4C-EKE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF802C-70-4C-EKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF802C-70-4C-EKE part is unused and in its original packaging.
Return procedure for SST39VF802C-70-4C-EKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF802C-70-4C-EKE Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

