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Microchip Technology SST39VF802C-70-4C-EKE-T

Part No.:
SST39VF802C-70-4C-EKE-T
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixSST39VF802C-70-4C-EKE-T.pdf
Description:
IC FLASH 8MBIT PARALLEL 48TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,095

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Product details

Overview

SST39VF802C-70-4C-EKE-T from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware top-block protection (7E000H–7FFFFH), and JEDEC-standard x16 parallel interface for embedded firmware storage in industrial controllers.

For engineers reviewing the SST39VF802C-70-4C-EKE-T datasheet, SST39VF802C-70-4C-EKE-T pinout, SST39VF802C-70-4C-EKE-T application, or SST39VF802C-70-4C-EKE-T equivalent, key selection considerations include boot-block architecture, sector/block-erase timing (18 ms typical), RY/BY# status signaling, and TSOP-48 package compatibility with legacy 16-bit memory buses.

Technical Context

This device implements a split-gate SuperFlash® cell architecture enabling fixed erase/program times independent of cycle count, eliminating software de-rating. It supports three write-status detection methods: Data# Polling (DQ7), Toggle Bits (DQ6/DQ2), and open-drain RY/BY# output requiring external 10–100 kΩ pull-up.

Command execution follows JEDEC-standard six-byte sequences for sector/block/chip-erase and three-byte sequences for word-program and security ID operations. Hardware block protection is activated via WP# low on the top 8 KWord (7E000H–7FFFFH), and reset is managed through active-low RST# with TRP ≥ 100 ns.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density8 Mbit (512K × 16) - supports 16-bit data bus systems without byte-lane multiplexing
Read Access Time70 ns - enables direct connection to microcontrollers with ≤14 MHz bus timing
Supply Voltage2.7–3.6 V - compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V
Endurance100,000 program/erase cycles - sufficient for field firmware updates over 10+ years in industrial deployments
Data Retention>100 years - ensures long-term reliability in unpowered storage applications
Erase Time18 ms (sector/block), 40 ms (chip) - enables rapid reconfiguration during manufacturing or service provisioning
Active Current5 mA typical at 5 MHz - low enough for battery-backed operation in standby-aware systems
Standby Current3 µA typical - supports ultra-low-power sleep modes in portable or energy-harvested devices

Pinout & Package

Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC x16 flash footprint.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address Inputs19-bit address bus supporting full 512K-word addressing; AMS = A18 for block/sector selection
DQ0–DQ15Data I/O16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high
CE#Chip EnableActive-low chip select; device enters standby (3 µA) when high
OE#Output EnableActive-low output gate; controls data bus drive without affecting internal state
WE#Write EnableActive-low control for all write operations; latches command/data on rising/falling edges per JEDEC sequence
WP#Write ProtectActive-low hardware lock for top 8 KWord boot block (7E000H–7FFFFH); floating = internally pulled high
RST#ResetActive-low hardware reset; terminates ongoing erase/program and forces return to read mode
RY/BY#Ready/Busy#Open-drain status output; low = active erase/program, requires external pull-up resistor
VDDPower Supply2.7–3.6 V supply; powers core logic and SuperFlash® array
VSSGroundReference ground for all I/O and core circuitry
NCNo ConnectionUnbonded pins (A13, A9, A12, A8, A17, A4, A14, A10, A15, A11, A5, A1); must remain unconnected

Key Features

FeatureDesign Value
SuperFlash® TechnologyFixed 7 µs word-program and 18 ms erase times across full lifecycle - eliminates runtime degradation compensation in firmware
Top Boot Block ProtectionHardware-enforced lock on 7E000H–7FFFFH region - prevents accidental overwrite of bootloader code during field updates
Erase-Suspend/ResumeAllows read access to non-suspended sectors during erase - enables real-time diagnostics or UI responsiveness during firmware update
Security ID SpaceFactory-programmed 128-bit ID + user-programmable 128-word space - supports device authentication and secure provisioning
CFI ComplianceJEDEC Common Flash Interface support - enables auto-detection and standardized driver integration in BIOS/bootloader stacks
Auto Low Power ModeReduces active read current from 5 mA to 3 µA after valid access - cuts dynamic power by >99% during idle polling loops

Applications

Industrial PLC Firmware StorageMedical Device Configuration Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments with wide temperature ranges.

IC Role / Device Role / Timing Role: Nonvolatile parallel-boot memory providing immediate code execution on power-up via x16 bus interface.

Use Value: 100,000-cycle endurance and >100-year retention ensure reliable operation across 15+ year equipment lifecycles without recalibration or replacement.

Use Scenario: Holding calibrated sensor coefficients, regulatory compliance flags, and device-specific configuration parameters in FDA-cleared diagnostic instruments.

IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with hardware write protection on critical boot region.

Use Value: Top-block hardware protection (WP#-enabled) prevents corruption of bootloader during over-the-air calibration updates.

Telecom Base Station Boot ROMAutomotive ECU Calibration Storage

Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in outdoor telecom infrastructure exposed to thermal cycling and voltage transients.

IC Role / Device Role / Timing Role: JEDEC-standard x16 flash with RY/BY# status signaling for deterministic boot sequencing in multi-chip systems.

Use Value: 70 ns read access meets tight timing budgets for ARM9/ARM11-based baseband processors without wait-state insertion.

Use Scenario: Storing engine calibration maps and emission control parameters in Tier-1 automotive ECUs requiring AEC-Q100 qualification (note: this part is not AEC-Q100 rated; used in non-safety-critical subsystems).

IC Role / Device Role / Timing Role: Field-upgradable parameter memory accessed via microcontroller's external memory interface.

Use Value: Sector-erase capability (2 KWord uniform blocks) allows granular map updates without full reflash, reducing service downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel-interface flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SST39VF801C-70-4C-EKE-TBottom boot block (00000H–01FFFH), identical timing, voltage, and pinoutUsed where bootloader resides in lowest memory region instead of top regionSelect when system architecture requires protected boot code at address zero rather than top-of-memory
MX29LV800CTTI-70GSame density, 70 ns access, but uses different command set (no CFI), no Erase-Suspend, no Security IDLacks suspend/resume and secure ID features; suitable for cost-sensitive, static firmware applicationsChoose for legacy designs already using Macronix command protocol and where advanced features are unused

Compared with SST39VF802C-70-4C-EKE-T, SST39VF801C-70-4C-EKE-T offers mirrored boot-block placement for bottom-address firmware, while MX29LV800CTTI-70G provides basic functionality at lower cost but omits SuperFlash® advantages like fixed timing and security extensions.

Availability

SST39VF802C-70-4C-EKE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and telecom base station boot ROM requiring stable component supply across extended product lifecycles.

Supply support for SST39VF802C-70-4C-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and now manufactures and supports the SST39VF family as part of its broad flash memory portfolio.

The SST39VF802C-70-4C-EKE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for embedded systems requiring robust, field-upgradable nonvolatile storage with hardware-level data protection and deterministic timing.

FAQ

What is the boot block configuration of SST39VF802C-70-4C-EKE-T?

The SST39VF802C-70-4C-EKE-T implements top boot block protection covering address range 7E000H–7FFFFH (8 KWord). This region is hardware-protected when WP# is driven low, preventing accidental erase or program during system operation. The device does not support bottom boot configuration - that function is assigned to SST39VF801C variants.

Does SST39VF802C-70-4C-EKE-T require an external VPP voltage for programming?

No, SST39VF802C-70-4C-EKE-T does not require external VPP. It generates internal high-voltage programming pulses using its on-chip charge pump, operating solely from the 2.7–3.6 V VDD supply. This simplifies board design by eliminating dedicated VPP regulators or routing.

How is write completion detected on SST39VF802C-70-4C-EKE-T?

SST39VF802C-70-4C-EKE-T supports three concurrent write-status detection methods: Data# Polling (DQ7 toggles until completion), Toggle Bits (DQ6 toggles during operation), and Ready/Busy# (RY/BY# open-drain output pulled low during erase/program). All methods are valid after the final WE# pulse in the command sequence.

Can SST39VF802C-70-4C-EKE-T be used in place of SST39VF801C-70-4C-EKE-T?

No, SST39VF802C-70-4C-EKE-T is not a drop-in replacement for SST39VF801C-70-4C-EKE-T due to differing boot block locations: SST39VF802C protects the top 8 KWord (7E000H–7FFFFH), while SST39VF801C protects the bottom 8 KWord (00000H–01FFFH). Software and hardware address mapping must be verified before substitution.

What package type is used in SST39VF802C-70-4C-EKE-T?

SST39VF802C-70-4C-EKE-T uses a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm body size and standard JEDEC x16 flash pinout. The "-EKE-T" suffix explicitly denotes this TSOP-48 variant, distinguishing it from TFBGA or WFBGA versions of the same device.

SST39VF802C-70-4C-EKE-T Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP

SST39VF802C-70-4C-EKE-T FAQ

1.How can I place an order for SST39VF802C-70-4C-EKE-T through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF802C-70-4C-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF802C-70-4C-EKE-T reliable?

The price and inventory of SST39VF802C-70-4C-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF802C-70-4C-EKE-T is usually 5 days.

3.What payment methods are accepted for SST39VF802C-70-4C-EKE-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF802C-70-4C-EKE-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF802C-70-4C-EKE-T?

SST39VF802C-70-4C-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF802C-70-4C-EKE-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF802C-70-4C-EKE-T?

For technical support, including SST39VF802C-70-4C-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF802C-70-4C-EKE-T requirements.

6.How does Aetrix verify that SST39VF802C-70-4C-EKE-T is sourced from the original manufacturer or authorized distributors?

All SST39VF802C-70-4C-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF802C-70-4C-EKE-T meets industry standards.

7.What is the process for return or replacement of SST39VF802C-70-4C-EKE-T?

All SST39VF802C-70-4C-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF802C-70-4C-EKE-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF802C-70-4C-EKE-T part is unused and in its original packaging.

Return procedure for SST39VF802C-70-4C-EKE-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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