Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology SST39VF802C-70-4C-MAQE-T

Part No.:
SST39VF802C-70-4C-MAQE-T
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-WFBGA
Datasheet:
AetrixSST39VF802C-70-4C-MAQE-T.pdf
Description:
IC FLASH 8MBIT PARALLEL 48WFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,343

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SST39VF802C-70-4C-MAQE-T from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates from 2.7–3.6V, delivers 70 ns read access time, supports sector/block/chip erase, and features hardware write protection via WP# pin.

For engineers reviewing the SST39VF802C-70-4C-MAQE-T datasheet, SST39VF802C-70-4C-MAQE-T pinout, SST39VF802C-70-4C-MAQE-T application, or SST39VF802C-70-4C-MAQE-T equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block architecture, RY/BY# status signaling, and real-world flash endurance and power behavior.

Technical Context

The SST39VF802C-70-4C-MAQE-T implements a split-gate SuperFlash® cell architecture enabling fixed 7 µs word-program and 18 ms sector-erase times independent of cycle count. Its JEDEC-standard x16 parallel interface uses CE#, OE#, and WE# control signals with latched address/data buses and supports toggle-bit (DQ6/DQ2) and data-polling (DQ7) write completion detection.

This device integrates top-boot block protection (8 KWord at 7E000H–7FFFFH), hardware reset (RST#), ready/busy open-drain output (RY/BY#), and 128-bit factory Security ID plus 128-word user-programmable Security ID space - all compliant with Common Flash Interface (CFI) query mode.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density8 Mbit (512K × 16 organization), enabling compact firmware storage without external data-width conversion
Read Access Time70 ns - meets timing requirements for 14 MHz bus interfaces in legacy microcontroller systems
Supply Voltage2.7–3.6 V - compatible with single-supply 3.3 V systems and tolerant of brown-out conditions down to 2.7 V
Endurance100,000 program/erase cycles - sufficient for field-upgradable firmware with infrequent updates
Data RetentionGreater than 100 years - ensures long-term reliability in unattended industrial deployments
Active Current5 mA typical at 5 MHz - enables low-power operation in battery-backed or energy-constrained host systems
Erase ArchitectureUniform 2 KWord sectors + flexible blocks (1×8K, 2×4K, 1×16K, 15×32K) - supports granular firmware partitioning

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, MAQE suffix), RoHS-compliant, suitable for high-density PCB layouts requiring minimal footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A18Address InputsAMS = A18; A18–A0 provide full 19-bit addressing for 512K × 16 array; AMS–A11 select sector during erase
DQ0–DQ15Data I/O16-bit bidirectional data bus; outputs tri-stated when CE# or OE# high; latched internally during write
CE#Chip EnableActive-low chip select; device enters standby (3 µA) when high; required low for all operations
OE#Output EnableActive-low output gate; controls DQ bus drive; must be low with CE# for valid read data
WE#Write EnableActive-low control for program/erase command latching; rising edge initiates internal operation
WP#Write ProtectActive-low hardware lock for top 8 KWord boot block (7E000H–7FFFFH); prevents accidental firmware overwrite
RST#ResetActive-low hardware reset; forces return to read mode and aborts in-progress erase/program
RY/BY#Ready/Busy#Open-drain status indicator; pulled low during erase/program; requires external 10–100 kΩ pull-up
VDDPower Supply2.7–3.6 V supply; powers core logic and SuperFlash® array; internal VPP generation eliminates external pump
VSSGroundReference ground for all I/O and core circuitry; two dedicated pins ensure stable return path

Key Features

Feature Design Value
SuperFlash® TechnologyFixed 7 µs word-program and 18 ms erase times across full lifecycle - eliminates software de-rating and timing margin expansion
Top Boot Block ProtectionHardware-enforced 8 KWord protection (7E000H–7FFFFH) - safeguards bootloader code from corruption during field updates
Erase-Suspend/ResumeAllows read access to non-suspended sectors during active erase - enables real-time status monitoring without halting firmware update
Security ID SpaceFactory-programmed 128-bit ID + 128-word user space - supports secure device authentication and firmware binding
Auto Low Power ModeReduces active read current from 5 mA to 3 µA after valid access - cuts dynamic power by >99% in polling-based status checks

Applications

Industrial PLC Firmware Storage Telecom Baseband Configuration

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to microcontroller address space; accessed via parallel x16 bus with CE#/OE#/WE# handshaking.

Use Value: 100,000-cycle endurance and 100-year retention ensure reliable operation over 15+ year equipment lifecycles without recalibration or replacement.

Use Scenario: Holding RF calibration tables and protocol stack configuration parameters in 4G/LTE base station radio units.

IC Role / Device Role / Timing Role: Configuration memory supporting hot-swap updates; leverages RY/BY# and toggle-bit polling for deterministic update sequencing.

Use Value: Sector-erase granularity (2 KWord) allows selective reprogramming of calibration data without disturbing baseband processing firmware.

Medical Imaging System Bootloader Automotive Infotainment HMI Storage

Use Scenario: Securely storing certified bootloader code in FDA-regulated diagnostic imaging equipment requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: Top-boot protected memory region (7E000H–7FFFFH) hosting signed bootloader; WP# pin hardwired to ground for permanent lock.

Use Value: Factory Security ID + user-programmable ID space enables cryptographic binding between hardware serial and bootloader signature.

Use Scenario: Storing human-machine interface assets (fonts, icons, UI strings) in automotive head units where vibration and thermal cycling demand high reliability.

IC Role / Device Role / Timing Role: Parallel flash memory interfaced to ARM Cortex-A MCU; utilizes CFI query mode for runtime compatibility detection.

Use Value: 70 ns access time meets tight display refresh timing budgets; WFBGA package withstands automotive-grade thermal shock (-40°C to +105°C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF801C-70-4C-MAQE-TBottom-boot architecture (00000H–01FFFH protected); identical timing, voltage, and packageRequires firmware image layout with protected bottom block instead of top blockSelect when bootloader resides in lowest memory region and top-block protection is unnecessary
MX29LV800CTTI-70G70 ns access, 3.0–3.6 V only, no RST# pin, different CFI descriptor layoutLacks hardware reset and top-boot block mapping; requires modified driver initialization sequenceChoose for cost-sensitive designs where RST# and boot-block flexibility are not required

Compared with SST39VF802C-70-4C-MAQE-T, the SST39VF801C variant shifts protection to the bottom block - simplifying layout for legacy bootloaders - while the MX29LV800CTTI offers lower unit cost but removes RST# and alters CFI compliance, increasing porting effort.

Availability

SST39VF802C-70-4C-MAQE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom baseband configuration, medical imaging system bootloaders, and automotive infotainment HMI storage requiring stable component supply across multi-year production cycles.

Supply support for SST39VF802C-70-4C-MAQE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company delivering smart, connected, and secure embedded control solutions, with leadership in flash memory, microcontrollers, and analog products.

The SST39VF802C-70-4C-MAQE-T belongs to Microchip's SST SuperFlash® parallel NOR flash product line, engineered for high-reliability embedded systems requiring deterministic erase/program timing, hardware-based data protection, and long-term data retention.

FAQ

What is the boot block configuration of the SST39VF802C-70-4C-MAQE-T?

The SST39VF802C-70-4C-MAQE-T implements top-boot block protection covering the 8 KWord address range 7E000H–7FFFFH. This region is hardware-protected when WP# is grounded, making it ideal for safeguarding bootloader code. The SST39VF802C-70-4C-MAQE-T differs from the SST39VF801C series, which protects the bottom 8 KWord (00000H–01FFFH). This top-boot architecture is confirmed in Table 4 and Figure 2 of the DS25041A datasheet.

Does the SST39VF802C-70-4C-MAQE-T require an external VPP voltage?

No, the SST39VF802C-70-4C-MAQE-T does not require an external VPP voltage. It uses internal VPP generation powered solely by the 2.7–3.6 V VDD supply, eliminating the need for auxiliary high-voltage circuitry. This is explicitly stated in the "Automatic Write Timing" feature list and confirmed in Table 9 (VPP min/max = 0000H), meaning the device is fully single-supply compatible.

How is write completion detected on the SST39VF802C-70-4C-MAQE-T?

The SST39VF802C-70-4C-MAQE-T supports three hardware-assisted write completion detection methods: Ready/Busy# (RY/BY#) open-drain output, Data# Polling (DQ7), and Toggle Bits (DQ6 and DQ2). RY/BY# requires an external pull-up resistor and transitions high when ready; DQ7 toggles during operation and stabilizes to true data upon completion; DQ6 toggles continuously until operation ends. All methods are documented in Section "Write Operation Status Detection" of DS25041A.

What package type does the SST39VF802C-70-4C-MAQE-T use?

The SST39VF802C-70-4C-MAQE-T uses a 48-ball WFBGA (Wafer-Level Fine-Pitch Ball Grid Array) package measuring 4 mm × 6 mm, identified by the "MAQE" suffix per Microchip's packaging nomenclature. This ultra-compact RoHS-compliant package is optimized for high-density PCB layouts and is distinct from the TSOP and TFBGA variants offered in the same family.

Is the SST39VF802C-70-4C-MAQE-T compatible with JEDEC-standard x16 flash interfaces?

Yes, the SST39VF802C-70-4C-MAQE-T conforms fully to JEDEC standard pinouts and command sets for x16 parallel flash memory devices. Its address/data/control signal mapping (A0–A18, DQ0–DQ15, CE#/OE#/WE#/WP#/RST#/RY/BY#) matches JEDEC MO-141 and JESD21-C specifications, enabling drop-in compatibility with existing x16 NOR flash designs that observe timing requirements (e.g., 70 ns access, setup/hold margins).

SST39VF802C-70-4C-MAQE-T Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-WFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-WFBGA (6x4)

SST39VF802C-70-4C-MAQE-T FAQ

1.How can I place an order for SST39VF802C-70-4C-MAQE-T through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF802C-70-4C-MAQE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF802C-70-4C-MAQE-T reliable?

The price and inventory of SST39VF802C-70-4C-MAQE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF802C-70-4C-MAQE-T is usually 5 days.

3.What payment methods are accepted for SST39VF802C-70-4C-MAQE-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF802C-70-4C-MAQE-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF802C-70-4C-MAQE-T?

SST39VF802C-70-4C-MAQE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF802C-70-4C-MAQE-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF802C-70-4C-MAQE-T?

For technical support, including SST39VF802C-70-4C-MAQE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF802C-70-4C-MAQE-T requirements.

6.How does Aetrix verify that SST39VF802C-70-4C-MAQE-T is sourced from the original manufacturer or authorized distributors?

All SST39VF802C-70-4C-MAQE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF802C-70-4C-MAQE-T meets industry standards.

7.What is the process for return or replacement of SST39VF802C-70-4C-MAQE-T?

All SST39VF802C-70-4C-MAQE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF802C-70-4C-MAQE-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF802C-70-4C-MAQE-T part is unused and in its original packaging.

Return procedure for SST39VF802C-70-4C-MAQE-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39VF802C-70-4C-MAQE-T Tags

  • SST39VF802C-70-4C-MAQE-T
  • SST39VF802C-70-4C-MAQE-T PDF
  • SST39VF802C-70-4C-MAQE-T Datasheet
  • SST39VF802C-70-4C-MAQE-T Specifications
  • SST39VF802C-70-4C-MAQE-T Images
  • Microchip Technology
  • Microchip Technology SST39VF802C-70-4C-MAQE-T
  • Buy SST39VF802C-70-4C-MAQE-T
  • SST39VF802C-70-4C-MAQE-T Price
  • SST39VF802C-70-4C-MAQE-T Distributor
  • SST39VF802C-70-4C-MAQE-T Supplier
  • SST39VF802C-70-4C-MAQE-T Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER