Microchip Technology SST39VF802C-70-4I-B3KE

Overview

SST39VF802C-70-4I-B3KE from Microchip Technology is a 8 Mbit (512K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, operating at 2.7–3.6 V, featuring 70 ns read access time, hardware top-block protection (7E000H–7FFFFH), and JEDEC-standard x16 parallel interface for embedded firmware storage in industrial controllers.

For engineers reviewing the SST39VF802C-70-4I-B3KE datasheet, SST39VF802C-70-4I-B3KE pinout, SST39VF802C-70-4I-B3KE application, or SST39VF802C-70-4I-B3KE equivalent, this page delivers verified package mapping (48-ball TFBGA, B3K), validated sector/block erase architecture, confirmed RY/BY# status signaling, and real-world boot code storage use cases - all extracted from DS25041A Rev A.

Technical Context

The SST39VF802C-70-4I-B3KE implements a split-gate SuperFlash cell with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It supports JEDEC-standard command sets including Software Data Protection (SDP) with six-byte erase sequences and three-byte program initiation.

Its dual-status detection uses DQ6 toggle bit and DQ7 data# polling during write operations, while RY/BY# provides open-drain ready/busy signaling requiring external 10–100 kΩ pull-up. The device integrates hardware block protection via WP# pin and supports Erase-Suspend/Resume for concurrent read/program during active erase.

Key Specifications

Pinout & Package

Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), 6 mm × 8 mm, ball pitch 0.5 mm, RoHS-compliant (B3K suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Compared with SST39VF802C-70-4I-B3KE, the SST39VF801C variant shifts protection to the bottom block - requiring firmware partitioning changes - while the MX29LV800CTTI omits RST# and Erase-Suspend, reducing robustness in power-unstable environments.

Availability

SST39VF802C-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging systems, automotive infotainment units, and network infrastructure equipment requiring stable component supply and long-term obsolescence management.

Supply support for SST39VF802C-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2016, integrating SuperFlash® NOR flash into its broad MCU and memory portfolio with focus on reliability and embedded systems.

The SST39VF802C-70-4I-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for cost-sensitive, high-reliability firmware storage in industrial, medical, and automotive applications demanding guaranteed endurance and data retention.

FAQ

What is the exact memory organization of the SST39VF802C-70-4I-B3KE?

The SST39VF802C-70-4I-B3KE is organized as 512K words × 16 bits, totaling 8 Mbit (1,048,576 bytes). Its address space spans 00000H to 7FFFFH, with top-boot protection covering the highest 8 KWord block (7E000H–7FFFFH). This structure is explicitly defined in Table 2 and Figure 2 of DS25041A, confirming compatibility with 16-bit microprocessor buses.

Does the SST39VF802C-70-4I-B3KE support hardware reset, and how is it implemented?

Yes, the SST39VF802C-70-4I-B3KE includes a dedicated RST# pin (pin 23 in TFBGA B3K package) that provides hardware reset functionality. When held low for ≥ TRP (minimum 100 ns), it forcibly terminates any ongoing Program or Erase operation and returns the device to Read mode. This behavior is documented in Section "Hardware Reset (RST#)" on page 10 of DS25041A.

How does the SST39VF802C-70-4I-B3KE indicate completion of a Program or Erase operation?

The SST39VF802C-70-4I-B3KE offers three concurrent status mechanisms: RY/BY# pin (open-drain, requires pull-up), DQ6 toggle bit, and DQ7 data# polling. All are valid after the rising edge of the final WE# pulse in the command sequence. DQ6 toggles during operation and stops when complete; DQ7 complements data during Program and reads '0' during Erase, then stabilizes to true value upon completion - per Table 3 and Section "Write Operation Status Detection".

What package type does the SST39VF802C-70-4I-B3KE use, and is pinout compatible with other variants?

The SST39VF802C-70-4I-B3KE uses a 48-ball Thin Fine-Pitch BGA (TFBGA) package with B3K footprint (6 mm × 8 mm, 0.5 mm pitch), as shown in Figure 3 of DS25041A. It shares identical pinout and signal definitions with SST39VF801C-70-4I-B3KE and SST39LF802C-55-4I-B3KE - confirmed by matching pin assignments and Table 1's function descriptions across all variants in the datasheet.

Can the SST39VF802C-70-4I-B3KE be used in systems requiring secure device identification?

Yes, the SST39VF802C-70-4I-B3KE includes a 136-word Security ID space: 128 bits factory-programmed and locked by SST, plus 128 user-programmable words. The Security ID is accessed via 88H command and supports lock-out via 85H command - detailed in Section "Security ID" (page 12) and Table 7 of DS25041A, enabling cryptographic binding and anti-cloning features.