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Microchip Technology SST39VF802C-70-4I-B3KE-T
- Part No.:
- SST39VF802C-70-4I-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF802C-70-4I-B3KE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,738
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Product details
Overview
SST39VF802C-70-4I-B3KE-T from Microchip Technology is a 8 Mbit (512K × 16) Multi-Purpose Flash Plus memory IC with 70 ns read access time, single 2.7–3.6V supply operation, and top-boot block protection. It features uniform 2 KWord sector erase, flexible block architecture (including one 8 KWord top boot block), and hardware write protection via WP# pin. Used in embedded firmware storage for industrial controllers requiring field-upgradable code.
For engineers reviewing the SST39VF802C-70-4I-B3KE-T datasheet, SST39VF802C-70-4I-B3KE-T pinout, SST39VF802C-70-4I-B3KE-T application, or SST39VF802C-70-4I-B3KE-T equivalent, key selection criteria include boot-block configuration (top vs bottom), 48-ball WFBGA package compatibility, JEDEC x16 flash command set support, and SuperFlash® endurance (100,000 cycles).
Technical Context
This device implements SST's proprietary SuperFlash® technology with split-gate cell design and thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. It supports standard JEDEC x16 flash pinouts and command sets, including Software Data Protection (SDP) with three-byte program and six-byte erase sequences.
Operation modes include Read, Word-Program, Sector-Erase, Block-Erase, Chip-Erase, Erase-Suspend/Resume, and CFI Query. Status detection uses DQ6/DQ2 toggle bits and DQ7 data polling, with RY/BY# open-drain ready/busy output requiring external 10 kΩ–100 kΩ pull-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), providing 1 MB of nonvolatile storage space |
| Read Access Time | 70 ns typical - enables direct execution from flash in 5 MHz bus systems without wait states |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V |
| Endurance | 100,000 program/erase cycles - supports frequent firmware updates in field-deployed devices |
| Data Retention | Greater than 100 years - ensures long-term reliability in unpowered storage applications |
| Block Protection | Top 8 KWord (0x7E000–0x7FFFF) protected when WP# = low - safeguards boot code against accidental overwrite |
| Package | 48-ball WFBGA (4 mm × 6 mm) - compact footprint for space-constrained PCB layouts |
Pinout & Package
48-ball WFBGA (4 mm × 6 mm) package with JEDEC-standard x16 flash pinout. Ball pitch: 0.5 mm. RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; AMS = A18 for sector/block selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select - device enters standby (3 µA) when high |
| OE# | Output Enable | Active-low output gate - controls data bus visibility during read operations |
| WE# | Write Enable | Active-low control for program/erase command latching and timing initiation |
| WP# | Write Protect | Active-low hardware lock for top 8 KWord boot block - prevents erase/program when grounded |
| RST# | Reset | Active-low hardware reset - forces return to read mode and aborts in-progress operations |
| RY/BY# | Ready/Busy# | Open-drain status output - low during program/erase; requires external pull-up resistor |
| VDD | Power Supply | 2.7–3.6 V supply input - powers all internal logic and SuperFlash® programming circuitry |
| VSS | Ground | Reference ground for all I/O and core functions |
| NC | No Connection | Unbonded balls - no electrical function; must be left floating or tied to ground per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Erase-Resume | Allows temporary interruption of erase to read/program other sectors - critical for real-time firmware update without system freeze |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts power in burst-read scenarios |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space - enables secure device authentication and traceability |
| Uniform Sector Architecture | 2 KWord sectors across entire array - simplifies file system partitioning and wear leveling implementation |
| Internal VPP Generation | No external high-voltage supply required - eliminates need for charge pump circuitry on host board |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic programs and I/O mapping tables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with top-boot protection ensuring bootloader integrity during field firmware upgrades. Use Value: 100,000-cycle endurance and >100-year data retention guarantee operational continuity over 15+ year product lifecycles. | Use Scenario: Holding calibration coefficients, safety-critical configuration parameters, and regulatory audit logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant parameter storage with hardware WP# lock preventing unauthorized reconfiguration. Use Value: Top-boot block protection (0x7E000–0x7FFFF) isolates boot firmware from runtime parameter writes, meeting IEC 62304 software safety requirements. |
| Telecom Base Station Boot ROM | Automotive Infotainment System Flash |
Use Scenario: Hosting boot code and FPGA configuration bitstreams in outdoor telecom nodes exposed to wide temperature swings (-40°C to +85°C). IC Role / Device Role / Timing Role: High-reliability x16 flash with 70 ns access time enabling fast cold boot from power-on reset. Use Value: SuperFlash® technology delivers consistent 70 ns read timing across temperature and lifetime - no derating needed for thermal aging. | Use Scenario: Storing navigation map data, UI assets, and OTA update staging partitions in automotive head units. IC Role / Device Role / Timing Role: JEDEC-compliant flash supporting standard memory controllers and CFI query for automatic driver initialization. Use Value: CFI interface allows host SoC to auto-detect density, timing, and command set - eliminating hardcoded flash drivers in AUTOSAR BSW. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF801C-70-4I-B3KE-T | Bottom-boot configuration (0x00000–0x01FFF protected); identical timing, voltage, and endurance specs | Used where bootloader resides in lowest memory region instead of top region | Select when legacy system design requires bottom-boot architecture and pin-compatible replacement |
| MX29LV800CTTI-70G | Same 8 Mbit x16 density, 70 ns access, but uses different command set (non-JEDEC standard); no Erase-Suspend capability | Lacks suspend/resume - unsuitable for real-time update scenarios requiring concurrent read/write | Choose only if existing firmware already implements Macronix-specific command protocol and suspend functionality is unused |
Compared with SST39VF801C-70-4I-B3KE-T, the top-boot variant offers superior bootloader protection in new designs where firmware grows downward; versus MX29LV800CTTI-70G, SST39VF802C-70-4I-B3KE-T provides JEDEC compliance and erase-suspend-critical for safe over-the-air updates.
Availability
SST39VF802C-70-4I-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and telecom base station boot ROM requiring stable component supply across extended product lifecycles.
Supply support for SST39VF802C-70-4I-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010.
The SST39VF802C belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for embedded systems needing reliable, low-power, field-upgradable nonvolatile memory with hardware-based boot protection.
FAQ
What is the boot block configuration of SST39VF802C-70-4I-B3KE-T?
The SST39VF802C-70-4I-B3KE-T implements top-boot block protection, securing the upper 8 KWord (0x7E000–0x7FFFF) from accidental erase or program when WP# is low. This differs from the SST39VF801C variant, which protects the bottom 8 KWord. The top-boot architecture is ideal for systems where the bootloader resides at the highest memory address and must remain immutable during firmware updates.
Does SST39VF802C-70-4I-B3KE-T require an external VPP voltage for programming?
No, SST39VF802C-70-4I-B3KE-T does not require an external VPP voltage. It integrates internal VPP generation for all program and erase operations, operating solely from the 2.7–3.6 V VDD supply. This eliminates the need for external high-voltage circuitry, simplifying board design and reducing BOM cost compared to older flash technologies.
How is write completion detected on SST39VF802C-70-4I-B3KE-T?
Write completion on SST39VF802C-70-4I-B3KE-T is detected using three complementary methods: DQ7 data polling (complement-to-data behavior), DQ6/DQ2 toggle bits (alternating 1/0 during operation), and the open-drain RY/BY# pin (low during active program/erase). All methods are valid after defined WE# edge timings per operation type, with RY/BY# requiring an external pull-up resistor.
What package type is used by SST39VF802C-70-4I-B3KE-T?
SST39VF802C-70-4I-B3KE-T uses a 48-ball WFBGA (Wafer-Level Fine-Pitch Ball Grid Array) package measuring 4 mm × 6 mm with 0.5 mm ball pitch. This compact, RoHS-compliant package supports high-density PCB layouts and is distinct from the TSOP and TFBGA variants offered in the same product family.
Can SST39VF802C-70-4I-B3KE-T be used in place of SST39VF801C-70-4I-B3KE-T?
SST39VF802C-70-4I-B3KE-T is not a direct drop-in replacement for SST39VF801C-70-4I-B3KE-T due to differing boot block locations: SST39VF802C protects the top 8 KWord (0x7E000–0x7FFFF), while SST39VF801C protects the bottom 8 KWord (0x00000–0x01FFF). Software must be reconfigured to align with the top-boot address map, and WP# assertion behavior must be verified for the target boot region.
SST39VF802C-70-4I-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF802C-70-4I-B3KE-T FAQ
1.How can I place an order for SST39VF802C-70-4I-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF802C-70-4I-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF802C-70-4I-B3KE-T reliable?
The price and inventory of SST39VF802C-70-4I-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF802C-70-4I-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF802C-70-4I-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF802C-70-4I-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF802C-70-4I-B3KE-T?
SST39VF802C-70-4I-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF802C-70-4I-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF802C-70-4I-B3KE-T?
For technical support, including SST39VF802C-70-4I-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF802C-70-4I-B3KE-T requirements.
6.How does Aetrix verify that SST39VF802C-70-4I-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF802C-70-4I-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF802C-70-4I-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF802C-70-4I-B3KE-T?
All SST39VF802C-70-4I-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF802C-70-4I-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF802C-70-4I-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF802C-70-4I-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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