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Microchip Technology SST39VF802C-70-4I-MAQE
- Part No.:
- SST39VF802C-70-4I-MAQE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39VF802C-70-4I-MAQE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,357
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Product details
Overview
SST39VF802C-70-4I-MAQE from Microchip Technology is a 8 Mbit (512K × 16) Multi-Purpose Flash Plus memory IC designed for embedded firmware, boot code, and configuration storage in industrial and communications systems. It operates from 2.7–3.6V, delivers 70 ns read access time, supports hardware block protection on the top 8 KWord boot sector, and features Erase-Suspend/Resume capability for real-time system responsiveness.
For engineers reviewing the SST39VF802C-70-4I-MAQE datasheet, SST39VF802C-70-4I-MAQE pinout, SST39VF802C-70-4I-MAQE application, or SST39VF802C-70-4I-MAQE equivalent, this page provides verified package mapping (48-ball WFBGA), JEDEC-compliant x16 interface timing, boot-block address range (7E000H–7FFFFH), and validated alternatives with functional and layout implications.
Technical Context
This device implements SST's SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count-unlike conventional flash where performance degrades over endurance life. Its command-set architecture conforms to JEDEC standard pinouts and supports Software Data Protection (SDP) via six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.
The SST39VF802C-70-4I-MAQE integrates dual status detection (DQ6 toggle bit + DQ7 data# polling) and an open-drain RY/BY# output for asynchronous operation monitoring. Hardware write protection is implemented via WP# tied to the top boot block (7E000H–7FFFFH), while RST# provides hardware reset to Read mode within TRP (≤100 ns).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization); supports x16 parallel bus interface with full 16-bit data path. |
| Read Access Time | 70 ns (max); enables direct execution from flash (XIP) in systems with ≤14 MHz bus timing budgets. |
| Supply Voltage | 2.7–3.6 V; single-supply operation eliminates need for separate VPP programming voltage. |
| Endurance | 100,000 program/erase cycles (typical); sufficient for field firmware updates over 10+ years in industrial control. |
| Data Retention | >100 years (typical); ensures long-term reliability without refresh in unpowered storage applications. |
| Boot Block Protection | Top 8 KWord (7E000H–7FFFFH); prevents accidental overwrite of critical boot code when WP# is grounded. |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (fifteen 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord); enables granular firmware partitioning. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side solder ball layout per Figure 4 in DS25041A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus; A18 is most significant bit; AMS = A18 for sector/block selection during erase commands. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during write; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write operations; controls address/data latch timing. |
| OE# | Output Enable | Active-low output gate; determines data validity on DQ bus during read; independent of CE# state. |
| WE# | Write Enable | Active-low control for write cycles; rising edge latches data; falling edge latches address in command sequences. |
| WP# | Write Protect | Active-low hardware lock for top boot block (7E000H–7FFFFH); floating = internally pulled high = unprotected. |
| RST# | Reset | Active-low hardware reset; terminates ongoing erase/program and forces return to Read mode within TRP ≤100 ns. |
| RY/BY# | Ready/Busy# | Open-drain status indicator; requires external 10–100 kΩ pull-up; low = active erase/program, high = ready. |
| VDD | Power Supply | 2.7–3.6 V core supply; powers all internal logic and SuperFlash cell operations. |
| VSS | Ground | Reference ground for all I/O and core circuitry; two dedicated VSS balls in WFBGA package. |
| NC | No Connection | Unbonded pins (e.g., A13, A9, A10, A8, A11, A13, A12, A14, A15, A16, A17, A4, A3, A5, A6, A7, A18, DQ2, DQ3, DQ13, DQ14, DQ15, DQ7); must remain unconnected. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Erase-Resume | Allows real-time read access to non-suspended sectors during active erase, enabling system responsiveness in multitasking environments. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read access-ideal for battery-backed or energy-constrained systems. |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable space, locked permanently to prevent tampering or cloning. |
| Common Flash Interface (CFI) | JEDEC-standard CFI query mode (via 98H command) enables automatic driver detection and runtime configuration in OS-aware bootloaders. |
| SuperFlash® Reliability | Split-gate cell + thick-oxide injector yields >100-year data retention and stable 7 µs word-program time across full endurance life. |
Applications
| Industrial PLC Firmware Storage | Telecom Baseband Configuration |
|---|---|
Use Scenario: Storing field-upgradable ladder logic and I/O mapping tables in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile boot and application code storage with hardware top-block protection preventing corruption of startup routines. Use Value: 70 ns read access enables direct execution from flash without external cache; 100,000-cycle endurance supports quarterly firmware patches over 10+ years. |
Use Scenario: Holding DSP coefficient tables, calibration data, and protocol stack parameters in 4G/LTE baseband processors requiring fast reconfiguration. IC Role / Device Role / Timing Role: x16 parallel interface flash providing low-latency access to configuration registers during RF channel handover. Use Value: Erase-suspend capability allows background parameter updates while maintaining real-time signal processing continuity. |
| Medical Imaging Bootloader | Automotive ADAS Camera Module |
Use Scenario: Securing certified bootloader code and cryptographic keys in FDA-regulated diagnostic imaging equipment with strict traceability requirements. IC Role / Device Role / Timing Role: Trusted boot source with factory-programmed Security ID and user-lockable ID space for device authentication. Use Value: Hardware WP# protection on top boot block ensures bootloader integrity; >100-year data retention meets medical device shelf-life mandates. |
Use Scenario: Storing camera calibration profiles and sensor fusion algorithms in automotive surround-view systems operating under AEC-Q100 Grade 2 stress. IC Role / Device Role / Timing Role: High-reliability flash with guaranteed -40°C to +85°C operation and JEDEC-standard command set for ASIL-B compatible firmware updates. Use Value: Uniform 2 KWord sectors allow atomic update of individual camera profiles without disrupting adjacent modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF801C-70-4I-MAQE | Bottom-boot architecture (00000H–01FFFH protected); identical 70 ns access, 2.7–3.6 V, and WFBGA package. | Requires PCB-level WP# routing to bottom boot block; unsuitable where top-boot protection is mandated by bootloader design. | Select only if system firmware resides in bottom boot region and top-sector updates are unrestricted. |
| MX29LV800CTTI-70G | Same density (8 Mbit x16), 70 ns access, but uses standard AMD/Fujitsu command set; no Erase-Suspend; different CFI structure. | Lacks real-time suspend/resume; incompatible SDP command flow; requires driver rewrite for status polling and erase control. | Choose only for legacy designs already using MX29LV family; not recommended for new designs requiring suspend capability. |
Compared with SST39VF802C-70-4I-MAQE, SST39VF801C-70-4I-MAQE offers identical performance but reversed boot-block orientation-requiring layout and firmware alignment changes-while MX29LV800CTTI-70G sacrifices suspend functionality and introduces command-set incompatibility, increasing integration effort.
Availability
SST39VF802C-70-4I-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom baseband configuration, medical imaging bootloaders, and automotive ADAS camera modules requiring stable component supply across extended product lifecycles.
Supply support for SST39VF802C-70-4I-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontroller, analog, FPGA, and memory solutions, formed through the acquisition of Silicon Storage Technology (SST) in 2016.
The SST39VF802C-70-4I-MAQE belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered for high-reliability embedded systems requiring robust firmware storage, fast read access, and field-upgradable security features.
FAQ
What is the boot block configuration of SST39VF802C-70-4I-MAQE?
The SST39VF802C-70-4I-MAQE implements top-boot block protection covering address range 7E000H–7FFFFH (8 KWord). This is hardwired in silicon and differs from the bottom-boot SST39VF801C variant. WP# must be grounded to activate protection; floating WP# disables it via internal pull-up.
Does SST39VF802C-70-4I-MAQE support Erase-Suspend functionality?
Yes, SST39VF802C-70-4I-MAQE supports Erase-Suspend and Erase-Resume commands (B0H and 30H respectively). This allows reading from or programming into non-suspended sectors during an active erase, enabling real-time system responsiveness without halting background operations.
What package type is used for SST39VF802C-70-4I-MAQE?
SST39VF802C-70-4I-MAQE is packaged in a 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), as confirmed by the "MAQE" suffix and Figure 4 in DS25041A. It is distinct from the TSOP and TFBGA variants offered in the same family.
How does SST39VF802C-70-4I-MAQE indicate completion of a Program or Erase operation?
SST39VF802C-70-4I-MAQE provides three concurrent status mechanisms: DQ6 toggle bit (alternating 0/1 during operation), DQ7 data# polling (complement → true data), and open-drain RY/BY# (low = busy, high = ready). All are valid after defined WE#/CE# edges per operation type.
Is SST39VF802C-70-4I-MAQE compatible with JEDEC-standard flash interfaces?
Yes, SST39VF802C-70-4I-MAQE conforms to JEDEC standard pinouts and command sets for x16 flash memories. It supports Common Flash Interface (CFI) query mode (98H command), enabling automatic driver detection and eliminating hardcoded timing assumptions in host firmware.
SST39VF802C-70-4I-MAQE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39VF802C-70-4I-MAQE FAQ
1.How can I place an order for SST39VF802C-70-4I-MAQE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF802C-70-4I-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF802C-70-4I-MAQE reliable?
The price and inventory of SST39VF802C-70-4I-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF802C-70-4I-MAQE is usually 5 days.
3.What payment methods are accepted for SST39VF802C-70-4I-MAQE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF802C-70-4I-MAQE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF802C-70-4I-MAQE?
SST39VF802C-70-4I-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF802C-70-4I-MAQE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF802C-70-4I-MAQE?
For technical support, including SST39VF802C-70-4I-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF802C-70-4I-MAQE requirements.
6.How does Aetrix verify that SST39VF802C-70-4I-MAQE is sourced from the original manufacturer or authorized distributors?
All SST39VF802C-70-4I-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF802C-70-4I-MAQE meets industry standards.
7.What is the process for return or replacement of SST39VF802C-70-4I-MAQE?
All SST39VF802C-70-4I-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF802C-70-4I-MAQE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF802C-70-4I-MAQE part is unused and in its original packaging.
Return procedure for SST39VF802C-70-4I-MAQE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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