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Microchip Technology SST39WF1601-70-4C-B3KE
- Part No.:
- SST39WF1601-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39WF1601-70-4C-B3KE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,871
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Product details
Overview
SST39WF1601-70-4C-B3KE from Microchip Technology (formerly Silicon Storage Technology) is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded program and configuration storage in space-constrained, low-voltage systems. It operates from 1.65–1.95 V, delivers 70 ns read access time, supports bottom 32 KWord hardware block protection, and features uniform 2 KWord sector and 32 KWord block erase architecture.
For engineers reviewing the SST39WF1601-70-4C-B3KE datasheet, SST39WF1601-70-4C-B3KE pinout, SST39WF1601-70-4C-B3KE application, or SST39WF1601-70-4C-B3KE equivalent, key selection criteria include its 1.65–1.95 V single-supply operation, JEDEC-standard x16 asynchronous interface, bottom-boot block protection scheme, SuperFlash® endurance (100,000 cycles), and 48-ball WFBGA (4 mm × 6 mm) package compatibility.
Technical Context
The SST39WF1601-70-4C-B3KE implements SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its command-set architecture conforms to JEDEC standard pin assignments and supports Software Data Protection (SDP) via three- and six-byte sequences for word-program and sector/block-erase operations.
It integrates hardware features including WP#-controlled bottom-block protection (000000H–007FFFH), RST#-enabled hardware reset, Auto Low Power mode (5 µA standby), and dual status detection (DQ7 Data# Polling and DQ6/DQ2 Toggle Bits) for write completion monitoring without polling overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M × 16 (16 Mbit total); enables 16-bit parallel data bus interfacing with microcontrollers and SoCs |
| Read Access Time | 70 ns; ensures deterministic timing for real-time firmware fetch in boot and runtime contexts |
| Supply Voltage Range | 1.65–1.95 V; compatible with modern low-power 1.8 V system rails without level-shifting |
| Endurance | 100,000 program/erase cycles (typical); supports field-updatable firmware with long service life |
| Data Retention | >100 years; guarantees nonvolatile storage integrity across product lifecycle without refresh |
| Erase Architecture | Uniform 2 KWord sectors + 32 KWord blocks; allows granular updates while minimizing wear on unrelated regions |
| Block Protection | Hardware bottom 32 KWord (000000H–007FFFH); safeguards boot code against accidental overwrite |
| Package | 48-ball WFBGA (4 mm × 6 mm); optimized for high-density PCB layouts in portable and automotive modules |
Pinout & Package
48-ball WFBGA (4 mm × 6 mm) package per Figure 3 in DS-20005014B. Ball pitch: 0.5 mm. RoHS-compliant, AEC-Q100-qualified option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 16-bit address bus (A0–A15) plus 4 MSBs (A16–A19) for full 1M-word addressing; AMS = A19 |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; device enters standby (5 µA) when high; required low for all operations |
| OE# | Output Enable | Active-low output gate; controls data bus drive; high disables outputs (high-Z) |
| WE# | Write Enable | Active-low control for write cycles; latches address/data edges; initiates internal program/erase |
| WP# | Write Protect | Active-low hardware lock for bottom 32 KWord boot block; floating = internally pulled high (unprotected) |
| RST# | Reset | Active-low hardware reset; terminates ongoing operations and forces return to read mode |
| VDD | Power Supply | 1.65–1.95 V core supply; powers logic and SuperFlash® array; no external VPP required |
| VSS | Ground | Reference ground for all signals and internal circuitry; two dedicated VSS balls for noise immunity |
| NC | No Connect | Unbonded balls (e.g., A18, A19 in TFBGA layout); must be left unconnected on PCB |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 28 µs word-program and 36 ms sector-erase times across full lifetime |
| Erase-Suspend/Resume | Allows read access to non-suspended sectors during active erase; enables real-time diagnostics and partial updates |
| Security ID Space | 256-bit factory + user programmable ID (128 + 128 bits); supports secure boot authentication and device binding |
| Auto Low Power Mode | Reduces active read current from 5 mA to 5 µA after valid access; eliminates need for software sleep management |
| JEDEC CFI Support | Full Common Flash Interface compliance (SST and general modes); enables OS-level flash abstraction and driver reuse |
| Hardware Reset Recovery | RST# aborts in-progress writes and restores read functionality within TRHR (≤100 ns); prevents corruption on brown-out |
Applications
| Industrial HMI Firmware Storage | Automotive Telematics Boot Memory |
|---|---|
Use Scenario: Storing boot loader and GUI firmware in panel-mounted HMIs operating at 1.8 V with thermal cycling from −40°C to +85°C. IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash providing fast 70 ns instruction fetch and reliable reprogramming over 10+ years. Use Value: Bottom-block protection prevents corruption of critical boot code during remote OTA updates; 100,000-cycle endurance supports frequent field revisions. |
Use Scenario: Holding bootloader and communication stack in LTE-connected telematics control units requiring AEC-Q100 qualification. IC Role / Device Role / Timing Role: JEDEC-compliant flash memory interfaced directly to ARM Cortex-A MCU for deterministic boot sequence execution. Use Value: WFBGA package enables compact layout in vibration-prone automotive environments; >100-year data retention ensures firmware integrity over vehicle lifetime. |
| Medical Device Configuration Storage | Networking Equipment FPGA Bitstream |
Use Scenario: Retaining calibration parameters and safety-critical configuration settings in portable diagnostic equipment powered by Li-ion batteries. IC Role / Device Role / Timing Role: Low-voltage (1.65–1.95 V) flash memory supporting battery-backed operation and secure parameter updates. Use Value: Security ID feature enables cryptographic binding of calibration data to specific units; hardware WP# prevents accidental erasure during service. |
Use Scenario: Storing FPGA configuration bitstreams in enterprise switches where fast reconfiguration and field upgrades are required. IC Role / Device Role / Timing Role: High-reliability parallel flash delivering 70 ns read access to support FPGA startup in <100 ms. Use Value: Sector-erase capability allows partial bitstream updates without full reprogramming; SuperFlash® energy efficiency reduces thermal load in dense chassis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1601-70-4C-B3KE | Same 1M×16 organization and WFBGA package, but 2.7–3.6 V supply range; no 1.8 V operation | Requires level-shifting in 1.8 V systems; unsuitable for direct replacement where voltage scaling is mandatory | Select only if system uses 3.3 V rails and legacy SST39VF footprint compatibility is prioritized |
| MX29LV160ETTI-70G | 16 Mbit x16, 70 ns, 2.7–3.6 V; lacks Auto Low Power mode and Erase-Suspend; different command set | Higher power consumption in active read; no suspend/resume for concurrent diagnostics; not drop-in software compatible | Consider only for cost-sensitive designs where 3.3 V supply and simplified firmware are acceptable trade-offs |
Compared with SST39VF1601-70-4C-B3KE and MX29LV160ETTI-70G, the SST39WF1601-70-4C-B3KE uniquely supports 1.65–1.95 V operation, fixed-timing SuperFlash® programming, and hardware bottom-block protection-making it the only choice for compact, battery-powered, or automotive-grade 1.8 V systems requiring guaranteed boot integrity and low-energy updates.
Availability
SST39WF1601-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive telematics boot memory, medical device configuration storage, and networking equipment FPGA bitstream applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-qualified variants.
Supply support for SST39WF1601-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and maintains the SuperFlash® portfolio for high-reliability, low-voltage embedded memory solutions.
The SST39WF1601-70-4C-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered specifically for 1.8 V systems needing robust, field-upgradable nonvolatile storage with deterministic timing and hardware-based data protection.
FAQ
What is the exact memory organization and density of the SST39WF1601-70-4C-B3KE?
The SST39WF1601-70-4C-B3KE is organized as 1M × 16, delivering 16 Mbit (2 MByte) of nonvolatile storage. Its address space spans 000000H to 0FFFFFH, with bottom 32 KWord (000000H–007FFFH) protected by hardware WP# control. This structure supports efficient 16-bit parallel interfacing with microcontrollers and SoCs without data width conversion.
Does the SST39WF1601-70-4C-B3KE support true 1.8 V operation, and what are the absolute limits?
Yes, the SST39WF1601-70-4C-B3KE is specified for true single-supply operation from 1.65 V to 1.95 V - fully covering the 1.8 V nominal rail with ±10% tolerance. Operation outside this range (e.g., below 1.65 V or above 1.95 V) is not guaranteed and may cause write failures or data corruption, as confirmed in Table 10 of DS-20005014B.
How does hardware block protection work on the SST39WF1601-70-4C-B3KE, and which region is protected?
The SST39WF1601-70-4C-B3KE implements bottom-block hardware protection: when WP# is driven low, the lowest 32 KWord (000000H–007FFFH) - the boot block - is locked against program and erase commands. This differs from SST39WF1602, which protects the top block. If WP# floats, an internal pull-up keeps it high, leaving the boot block unprotected.
What status detection methods are supported during program or erase operations on the SST39WF1601-70-4C-B3KE?
The SST39WF1601-70-4C-B3KE provides two hardware-supported status detection methods: Data# Polling (DQ7 toggles until completion, then returns true data) and Toggle Bits (DQ6 and DQ2 toggle during operation, stop when complete). These eliminate software timeouts and enable efficient polling loops - critical for real-time systems using the SST39WF1601-70-4C-B3KE.
Is the SST39WF1601-70-4C-B3KE available in an AEC-Q100-qualified version, and what grade is supported?
Yes, AEC-Q100-qualified versions of the SST39WF1601-70-4C-B3KE are available for automotive applications. The qualified variant meets Grade 3 requirements (−40°C to +85°C ambient operating temperature), as stated in the "AEC-Q100-qualified devices available" note on page 1 of DS-20005014B.
SST39WF1601-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39WF1601-70-4C-B3KE FAQ
1.How can I place an order for SST39WF1601-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF1601-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF1601-70-4C-B3KE reliable?
The price and inventory of SST39WF1601-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1601-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39WF1601-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1601-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF1601-70-4C-B3KE?
SST39WF1601-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF1601-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF1601-70-4C-B3KE?
For technical support, including SST39WF1601-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1601-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39WF1601-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39WF1601-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1601-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39WF1601-70-4C-B3KE?
All SST39WF1601-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1601-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF1601-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39WF1601-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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