My Inquiry
My Account
Microchip Technology SST39WF1601-70-4C-B3KE-T
- Part No.:
- SST39WF1601-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39WF1601-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,135
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39WF1601-70-4C-B3KE-T from Microchip Technology (formerly Silicon Storage Technology) is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded firmware, configuration, and boot code storage in low-voltage systems. It operates from 1.65–1.95 V, delivers 70 ns read access time, supports bottom-block hardware write protection (000000H–007FFFH), and features sector/block/chip erase with erase-suspend/resume capability.
For engineers reviewing the SST39WF1601-70-4C-B3KE-T datasheet, SST39WF1601-70-4C-B3KE-T pinout, SST39WF1601-70-4C-B3KE-T application, or SST39WF1601-70-4C-B3KE-T equivalent, key selection considerations include its 48-ball WFBGA (4 mm × 6 mm) package, JEDEC-compliant x16 asynchronous interface, SuperFlash® technology reliability (100,000 program/erase cycles, >100-year data retention), and dual status detection (DQ6 toggle bit + DQ7 data# polling).
Technical Context
This device implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-eliminating software de-rating over lifetime. Its command set conforms to JEDEC standard pin assignments and includes full CFI (Common Flash Interface) support for system-level compatibility.
Hardware block protection is implemented via the WP# pin, which-when grounded-prevents program/erase on the bottom 32 KWord boot block. The RST# pin provides hardware reset to Read mode, while Auto Low Power mode reduces active read current from 9 mA to 5 µA after valid access, with zero access-time penalty on wake-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) |
| Read Access Time | 70 ns - enables direct execution (XIP) from flash in timing-critical boot sequences |
| Supply Voltage | 1.65–1.95 V - compatible with modern low-power SoC I/O rails and eliminates external voltage translation |
| Endurance | 100,000 program/erase cycles - supports field firmware updates without premature wear-out |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications |
| Erase Granularity | Uniform 2 KWord sectors (8 KB) and 32 KWord blocks (64 KB) - enables fine-grained update management |
| Write Protection | Hardware bottom-block protection (000000H–007FFFH) via WP# pin - prevents accidental corruption of boot code |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, AEC-Q100 qualified option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 16-bit address bus (A0–A15) + 4 MSB (A16–A19) for sector/block selection; AMS = A19 |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with latched inputs and tri-state outputs controlled by CE#/OE# |
| CE# | Chip Enable | Active-low chip select; device enters standby (5 µA) when high |
| OE# | Output Enable | Active-low output gate; controls data bus tristate during read |
| WE# | Write Enable | Active-low control for program/erase command latching and internal timing initiation |
| WP# | Write Protect | Active-low hardware lock for bottom 32 KWord boot block (SST39WF1601-specific) |
| RST# | Reset | Active-low hardware reset; terminates ongoing operations and forces return to Read mode |
| VDD | Power Supply | 1.65–1.95 V core supply; internally generates VPP for erase/program |
| VSS | Ground | Two dedicated ground balls for noise reduction and signal integrity |
| NC | No Connection | Unbonded balls (e.g., A18, A19 in WFBGA layout); must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access or programming in non-suspended sectors during active erase-critical for multitasking bootloaders |
| Security ID | 256-bit space (128-bit factory + 128-bit user-programmable) with lock-out capability-enables secure device authentication and firmware binding |
| Auto Low Power Mode | Reduces active read current from 9 mA to 5 µA automatically after valid access-lowers average power in polling-based systems |
| SuperFlash® Technology | Fixed 36 ms sector/block erase and 28 µs word-program times regardless of accumulated cycles-simplifies system timing margins |
| JEDEC CFI Support | Full Common Flash Interface compliance-including SST and general CFI query modes-ensures plug-and-play compatibility with standard flash drivers |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
Use Scenario: Storing bootloader and safety-critical firmware in programmable logic controllers operating across -40°C to +85°C ambient. IC Role / Device Role / Timing Role: Nonvolatile boot code storage with hardware bottom-block protection and 70 ns read access for deterministic startup. Use Value: Prevents unauthorized modification of boot code via WP# pin, while SuperFlash endurance supports field firmware updates over 10+ year product lifecycle. |
Use Scenario: Holding primary boot image and configuration data in head-unit ECUs requiring AEC-Q100 qualification and fast cold-boot response. IC Role / Device Role / Timing Role: x16 parallel flash memory interfaced directly to ARM Cortex-A application processor for XIP execution. Use Value: 70 ns access time and JEDEC CFI compatibility enable immediate instruction fetch post-reset; bottom-block protection secures OEM boot partition. |
| Medical Device Configuration Storage | Networking Equipment FPGA Bitstream Storage |
Use Scenario: Retaining calibrated sensor parameters and regulatory-compliant operational profiles in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, long-retention configuration memory with 128-bit user Security ID for traceability and anti-counterfeiting. Use Value: >100-year data retention meets IEC 62304 requirements; Security ID lock-out prevents tampering with calibration records. |
Use Scenario: Storing reconfigurable FPGA bitstreams in enterprise switches where field upgrades must avoid PCB redesign. IC Role / Device Role / Timing Role: High-reliability parallel flash with sector-erase capability to update partial bitstreams without full reprogramming. Use Value: Uniform 2 KWord sectors allow incremental updates; erase-suspend enables concurrent status monitoring during bitstream reload. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1601C-70-4C-EKE | 3.0–3.6 V operation; no 1.8 V support; identical 1M×16 organization, 70 ns access, and bottom-block protection | Requires level-shifting for 1.8 V host interfaces; unsuitable for battery-powered or ultra-low-voltage designs | Select only if system VDD ≥ 3.0 V and legacy 3.3 V compatibility is required |
| MX29LV160DBTI-70G | 3.0–3.6 V supply; 16 Mbit density; top-boot configuration (not bottom-boot); lacks Security ID and erase-suspend | Boot block resides at top address (0xF8000–0xFFFFF); incompatible with SST39WF1601's protected bottom region | Use only when top-boot architecture matches system bootloader layout and advanced features are not needed |
Compared with SST39WF1601-70-4C-B3KE-T, the SST39VF1601C variant trades low-voltage operation for legacy 3.3 V compatibility, while the MX29LV160DBTI omits critical features like Security ID and erase-suspend-making SST39WF1601-70-4C-B3KE-T the sole choice for secure, low-power, bottom-boot applications requiring field update resilience.
Availability
SST39WF1601-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical device configuration storage requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SST39WF1601-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and maintains its SuperFlash® portfolio for high-reliability embedded memory solutions.
The SST39WF1601 belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered specifically for low-voltage, high-endurance firmware and configuration storage in automotive, industrial, and medical systems demanding >100-year data retention and AEC-Q100 qualification readiness.
FAQ
What is the exact memory organization of the SST39WF1601-70-4C-B3KE-T?
The SST39WF1601-70-4C-B3KE-T is organized as 1,048,576 words × 16 bits (1M × 16), totaling 16 Mbit. This x16 parallel interface allows 2-byte data transfers per cycle and is JEDEC-compliant for standard NOR flash controllers. The device uses A0–A15 for byte addressing and A16–A19 as most-significant address bits for sector/block selection, matching the SST39WF1601-70-4C-B3KE-T datasheet specification.
Does the SST39WF1601-70-4C-B3KE-T support hardware write protection, and how is it configured?
Yes, the SST39WF1601-70-4C-B3KE-T implements bottom-block hardware write protection. When the WP# pin is driven low, program and erase operations are disabled on the bottom 32 KWord (000000H–007FFFH) boot block. This protection is specific to the SST39WF1601 variant; the SST39WF1602 uses top-block protection instead. The SST39WF1601-70-4C-B3KE-T datasheet confirms this behavior in Table 3 and Section 9.
What package type and dimensions does the SST39WF1601-70-4C-B3KE-T use?
The SST39WF1601-70-4C-B3KE-T uses a 48-ball WFBGA package measuring 4 mm × 6 mm, as confirmed in Figure 3 and Section 1 of the official datasheet (DS-20005014B). This ultra-compact footprint supports high-density PCB layouts and is distinct from the larger 48-ball TFBGA (6 mm × 8 mm) option offered for the same device family.
How does the SST39WF1601-70-4C-B3KE-T indicate completion of program or erase operations?
The SST39WF1601-70-4C-B3KE-T provides two hardware-supported status detection methods: Data# Polling (DQ7) and Toggle Bit (DQ6). During internal operations, DQ7 returns complemented data until completion, then true data; DQ6 toggles between 0 and 1 until completion, then holds steady. Both are valid after defined WE# edges per operation type, as detailed in Tables 2 and 6 of the SST39WF1601-70-4C-B3KE-T datasheet.
Is the SST39WF1601-70-4C-B3KE-T qualified for automotive applications?
The SST39WF1601-70-4C-B3KE-T itself is not AEC-Q100 qualified, but AEC-Q100-qualified variants (e.g., SST39WF1601-70-4I-B3KE) are available from Microchip. The base part meets commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature grades per Table 10, and its SuperFlash® reliability (100,000 cycles, >100-year retention) forms the foundation for automotive qualification-verified in the SST39WF1601-70-4C-B3KE-T datasheet footnote on page 1.
SST39WF1601-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39WF1601-70-4C-B3KE-T FAQ
1.How can I place an order for SST39WF1601-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF1601-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF1601-70-4C-B3KE-T reliable?
The price and inventory of SST39WF1601-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1601-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39WF1601-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1601-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF1601-70-4C-B3KE-T?
SST39WF1601-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF1601-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF1601-70-4C-B3KE-T?
For technical support, including SST39WF1601-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1601-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39WF1601-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39WF1601-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1601-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39WF1601-70-4C-B3KE-T?
All SST39WF1601-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1601-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF1601-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39WF1601-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39WF1601-70-4C-B3KE-T Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
