Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology SST39WF1601-70-4C-MAQE

Part No.:
SST39WF1601-70-4C-MAQE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-WFBGA
Datasheet:
AetrixSST39WF1601-70-4C-MAQE.pdf
Description:
IC FLASH 16MBIT PARALLEL 48WFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,810

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SST39WF1601-70-4C-MAQE from Microchip Technology (formerly Silicon Storage Technology) is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded program, configuration, and data storage in low-voltage systems. It operates from 1.65–1.95 V, delivers 70 ns read access time, supports hardware bottom-block protection (000000H–007FFFH), and features uniform 2 KWord sector and 32 KWord block erase capabilities.

For engineers reviewing the SST39WF1601-70-4C-MAQE datasheet, SST39WF1601-70-4C-MAQE pinout, SST39WF1601-70-4C-MAQE application, or SST39WF1601-70-4C-MAQE equivalent, this page provides verified functional identity, JEDEC-compliant x16 interface timing, SuperFlash reliability metrics (100K cycles, >100-year retention), and package-specific pin mapping for 48-ball WFBGA (4 mm × 6 mm).

Technical Context

The SST39WF1601-70-4C-MAQE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. It uses standard JEDEC x16 asynchronous command sets-including three-byte software data protection for word-program and six-byte sequences for sector/block/chip-erase-and supports both Data# Polling (DQ7) and Toggle Bit (DQ6/DQ2) status detection.

Hardware block protection is implemented via the WP# pin to lock the bottom 32 KWord boot block (000000H–007FFFH). The device includes RST# for hardware reset to read mode, supports CFI Query (SST and general modes), and integrates a 256-bit Security ID (128-bit factory + 128-bit user programmable) with lock-out capability.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16-bit words); enables compact firmware storage without external bus widening.
Read Access Time 70 ns at 1.65–1.95 V; meets real-time boot and code-execution timing in resource-constrained microcontrollers.
Write Voltage Range 1.65–1.95 V single supply; eliminates need for charge pumps or auxiliary voltage rails during program/erase.
Endurance & Retention 100,000 program/erase cycles typical; >100 years data retention-suitable for field-upgradable industrial firmware.
Erase Granularity Uniform 2 KWord sectors (8 KB) and 32 KWord blocks (64 KB); allows fine-grained updates without full chip erase.
Power Consumption 5 µA standby / 5 mA active (5 MHz typical); supports battery-backed or ultra-low-power always-on applications.
Protection Mechanism Hardware bottom-block protection (WP#-enabled) + JEDEC-compliant Software Data Protection (SDP); prevents accidental corruption of boot code.

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, AEC-Q100 qualified option available. Pin assignments conform to JEDEC-standard x16 flash layout.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus; A19–A0 select 1M-word locations; AMS = A19 per JEDEC spec.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; latched internally during write; tri-state when CE# or OE# high.
CE# Chip Enable Active-low chip select; device enters standby (5 µA) when high; required low for all operations.
OE# Output Enable Active-low output gate; controls data bus drive; high = high-impedance state.
WE# Write Enable Active-low control for write cycles; latches address/data edges per JEDEC timing protocol.
WP# Write Protect Active-low hardware lock for bottom 32 KWord boot block (000000H–007FFFH); floating = unprotected.
RST# Reset Active-low hardware reset; forces immediate return to read mode; TRP min. pulse width required.
VDD Power Supply 1.65–1.95 V core supply; internal VPP generation eliminates external high-voltage circuitry.
VSS Ground Reference ground for all I/O and core logic; two dedicated VSS balls in WFBGA package.
NC No Connect Unbonded balls (e.g., A18, A19 in some layouts); no electrical function; must be left unconnected.

Key Features

Feature Design Value
Erase-Suspend/Resume Allows read/program from non-suspended sectors during active erase-enables real-time system responsiveness.
Auto Low Power Mode Reduces active read current from 9 mA to 5 µA after valid access; no wake-up latency on address/control transition.
Security ID Space 256-bit segmented ID (128-bit factory locked + 128-bit user programmable); supports secure device authentication.
CFI Query Support Compatible with both SST-specific and JEDEC general CFI modes; enables standardized flash driver interoperability.
Toggle Bit Status Detection DQ6/DQ2 toggling during erase/program provides deterministic, clockless operation status-no polling overhead.

Applications

Industrial PLC Firmware Storage Automotive Infotainment Boot Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in extended temperature environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Nonvolatile program memory providing fast 70 ns read access for deterministic scan-cycle execution.

Use Value: Bottom-block protection ensures bootloader integrity; 100K endurance supports decades of field updates without replacement.

Use Scenario: Holding boot code and configuration data for head-unit microcontrollers in vehicles requiring AEC-Q100 compliance.

IC Role / Device Role / Timing Role: Primary x16 flash memory interfacing directly with ARM Cortex-M or RISC-V host processors.

Use Value: Single 1.65–1.95 V supply simplifies power design; WFBGA package enables high-density automotive PCB layouts.

Medical Device Configuration Storage IoT Edge Node Firmware Repository

Use Scenario: Retaining calibration parameters and safety-critical configuration profiles in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Secure, long-retention data storage with hardware write protection against EMI-induced corruption.

Use Value: >100-year data retention meets regulatory requirements for medical device lifetime traceability.

Use Scenario: Hosting over-the-air (OTA) update images and runtime firmware partitions in battery-powered sensor nodes.

IC Role / Device Role / Timing Role: Low-power flash memory supporting frequent partial rewrites using sector-erase granularity.

Use Value: 5 µA standby current extends battery life; erase-suspend enables concurrent sensor sampling during OTA apply.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Winbond W25Q16JVSIQ Quad SPI interface, 3V supply (2.7–3.6 V), 16 Mbit density, no hardware WP# block protection. Requires SPI controller and level-shifting for 1.8 V systems; lacks bottom-boot hardware lock. Select only if SPI interface and higher voltage tolerance are acceptable; not drop-in for x16 parallel bus designs.
Macronix MX29GL160EHTI-70G Parallel x16 interface, 2.7–3.6 V supply, 70 ns access, top-boot block protection (not bottom). Same pinout but inverted boot-block location; incompatible WP# protection range for SST39WF1601 use cases. Use only if top-boot protection suffices; verify address map alignment before PCB integration.

Compared with Winbond W25Q16JVSIQ and Macronix MX29GL160EHTI-70G, the SST39WF1601-70-4C-MAQE uniquely combines 1.65–1.95 V operation, bottom-boot hardware protection, and JEDEC x16 compatibility-making it irreplaceable in legacy low-voltage parallel-memory designs requiring guaranteed boot-sector security.

Availability

SST39WF1601-70-4C-MAQE is available at Aetrix Electronics and suitable for industrial PLCs, automotive infotainment systems, and medical diagnostics equipment requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for SST39WF1601-70-4C-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and maintains full ownership of the MPF+ flash product line, including process IP, qualification data, and long-term support commitments.

The SST39WF1601-70-4C-MAQE belongs to the Multi-Purpose Flash Plus family, engineered specifically for low-voltage embedded systems needing reliable, high-endurance firmware storage with hardware-level boot protection and JEDEC-standard interoperability.

FAQ

What is the exact memory organization of the SST39WF1601-70-4C-MAQE?

The SST39WF1601-70-4C-MAQE is organized as 1,048,576 words × 16 bits (1M × 16), totaling 16 Mbit. Its physical address space spans 000000H to 0FFFFFH, with the bottom 32 KWord (000000H–007FFFH) designated as the hardware-protected boot block. This structure is fixed and confirmed in the official datasheet DS-20005014B.

Does the SST39WF1601-70-4C-MAQE support both sector and block erase, and what are their sizes?

Yes, the SST39WF1601-70-4C-MAQE supports uniform sector erase (2 KWord = 8 KB per sector) and uniform block erase (32 KWord = 64 KB per block), as verified in Table 1 and Section 6 of DS-20005014B. Sector-erase time is 36 ms typical; block-erase time is also 36 ms typical-both independent of accumulated cycle count due to SuperFlash technology.

How does hardware write protection work on the SST39WF1601-70-4C-MAQE?

Hardware write protection on the SST39WF1601-70-4C-MAQE is enabled by pulling the WP# pin low, which locks the bottom 32 KWord boot block (000000H–007FFFH) against program and erase operations. If WP# is left floating, an internal pull-up holds it high, disabling protection. This behavior is explicitly defined in Table 3 and Section 9 of DS-20005014B.

Is the SST39WF1601-70-4C-MAQE compatible with standard JEDEC x16 flash command sets?

Yes, the SST39WF1601-70-4C-MAQE conforms fully to JEDEC-standard pin assignments and command sets for x16 asynchronous flash memories, including software data protection sequences, CFI Query modes, and Product Identification protocols. This compatibility is stated on page 2 and validated in Tables 5–6 of DS-20005014B.

What package type is used for the SST39WF1601-70-4C-MAQE suffix "MAQE"?

The "MAQE" suffix denotes the 48-ball WFBGA package (4 mm × 6 mm), as confirmed in Figure 3 and Section 1 of DS-20005014B. This differs from the TFBGA variant (suffix "MAQ") and is explicitly listed under "Packages Available" on page 1 of the datasheet.

SST39WF1601-70-4C-MAQE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-WFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
40µs
Access Time:
70 ns
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-WFBGA (6x4)

SST39WF1601-70-4C-MAQE FAQ

1.How can I place an order for SST39WF1601-70-4C-MAQE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39WF1601-70-4C-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39WF1601-70-4C-MAQE reliable?

The price and inventory of SST39WF1601-70-4C-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1601-70-4C-MAQE is usually 5 days.

3.What payment methods are accepted for SST39WF1601-70-4C-MAQE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1601-70-4C-MAQE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39WF1601-70-4C-MAQE?

SST39WF1601-70-4C-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39WF1601-70-4C-MAQE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39WF1601-70-4C-MAQE?

For technical support, including SST39WF1601-70-4C-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1601-70-4C-MAQE requirements.

6.How does Aetrix verify that SST39WF1601-70-4C-MAQE is sourced from the original manufacturer or authorized distributors?

All SST39WF1601-70-4C-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1601-70-4C-MAQE meets industry standards.

7.What is the process for return or replacement of SST39WF1601-70-4C-MAQE?

All SST39WF1601-70-4C-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1601-70-4C-MAQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39WF1601-70-4C-MAQE part is unused and in its original packaging.

Return procedure for SST39WF1601-70-4C-MAQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39WF1601-70-4C-MAQE Tags

  • SST39WF1601-70-4C-MAQE
  • SST39WF1601-70-4C-MAQE PDF
  • SST39WF1601-70-4C-MAQE Datasheet
  • SST39WF1601-70-4C-MAQE Specifications
  • SST39WF1601-70-4C-MAQE Images
  • Microchip Technology
  • Microchip Technology SST39WF1601-70-4C-MAQE
  • Buy SST39WF1601-70-4C-MAQE
  • SST39WF1601-70-4C-MAQE Price
  • SST39WF1601-70-4C-MAQE Distributor
  • SST39WF1601-70-4C-MAQE Supplier
  • SST39WF1601-70-4C-MAQE Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER