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Microchip Technology SST39WF1601-90-4I-B3KE

Part No.:
SST39WF1601-90-4I-B3KE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39WF1601-90-4I-B3KE.pdf
Description:
IC FLASH 16MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,212

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Product details

Overview

SST39WF1601-90-4I-B3KE from Silicon Storage Technology is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC operating at 1.65–1.95 V, featuring 90 ns read access time, bottom 32 KWord hardware block protection, and JEDEC-standard x16 asynchronous interface. It delivers 100,000 program/erase cycles and >100 years data retention for embedded firmware storage in industrial controllers.

For engineers reviewing the SST39WF1601-90-4I-B3KE datasheet, SST39WF1601-90-4I-B3KE pinout, SST39WF1601-90-4I-B3KE application, or SST39WF1601-90-4I-B3KE equivalent, this page provides verified technical context, JEDEC-compliant timing parameters, boot-block protection behavior, CFI query support, and validated alternative flash parts for firmware update systems requiring low-voltage operation and long-term reliability.

Technical Context

The SST39WF1601-90-4I-B3KE implements a SuperFlash split-gate cell architecture enabling fixed erase/program times independent of cycle count, eliminating software de-rating. It supports three command-based erase modes-sector (2 KWord), block (32 KWord), and chip-with uniform timing (36 ms sector/block, 140 ms chip).

It integrates hardware write protection via WP# pin for bottom boot block (000000H–007FFFH), RST# for hardware reset to read mode, and dual status detection (DQ7 Data# Polling, DQ6/DQ2 Toggle Bits) for non-blocking end-of-write verification. The device uses latched address/data with CE#/OE#/WE# control logic compliant with JEDEC standard pin assignments for x16 flash.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16-bit words) - supports full firmware image storage for mid-complexity microcontrollers.
Read Access Time 90 ns - enables direct execution (XIP) from flash in systems with ≤11 MHz bus timing budgets.
Supply Voltage 1.65–1.95 V - compatible with modern low-power SoC I/O domains and eliminates need for level shifters.
Endurance 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years in industrial deployments.
Data Retention >100 years - ensures configuration and calibration data integrity across product lifecycle without refresh.
Erase Granularity Sector (2 KWord), Block (32 KWord), Chip - allows selective firmware patching without full reflash.
Protection Scheme Hardware bottom boot block (32 KWord) + Software Data Protection (SDP) - prevents accidental overwrite of bootloader code.

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus; A19–A11 select blocks during block-erase, A11–A0 select sectors during sector-erase.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; tri-stated when CE# or OE# high; latched on WE#/CE# edges per JEDEC timing.
CE# Chip Enable Active-low device selection; must be low for all write operations and valid reads.
OE# Output Enable Active-low output gating; controls data bus drive during read; high = high-impedance state.
WE# Write Enable Controls latching of address/data during program/erase; falling edge latches address, rising edge latches data.
WP# Write Protect Active-low hardware lock for bottom 32 KWord boot block (000000H–007FFFH); floating = internally pulled high = unprotected.
RST# Reset Hardware abort of in-progress erase/program; forces return to read mode within TRP (min 100 ns).
VDD Power Supply 1.65–1.95 V core supply; powers all internal logic and SuperFlash array; no external VPP required.
VSS Ground Reference for all I/O and core logic; two dedicated VSS balls ensure stable low-impedance return path.

Key Features

Feature Design Value
SuperFlash Technology Fixed 36 ms sector/block erase time regardless of accumulated cycles - eliminates runtime degradation monitoring in firmware.
Erase-Suspend/Resume Allows reading from non-suspended sectors during active erase - enables real-time status display or interrupt handling without halting flash operations.
Security ID Space 256-bit factory/user programmable ID (128-bit locked SST ID + 128-bit customer-programmable) - supports secure boot key binding and device authentication.
Auto Low Power Mode Reduces active read current from 9 mA to 5 µA after valid access - cuts dynamic power by >99% during idle polling in always-on systems.
CFI Query Support Both SST-specific and general CFI modes accessible via 5555H/55H commands - enables automatic driver detection in OS/bootloader environments.

Applications

Industrial PLC Firmware Storage Medical Device Configuration Memory

Use Scenario: Storing and updating ladder logic firmware in DIN-rail mounted programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Nonvolatile program memory with hardware-protected boot sector ensuring bootloader integrity during remote OTA updates.

Use Value: Bottom block protection prevents corruption of startup code; 100,000-cycle endurance supports 5+ years of quarterly firmware patches without replacement.

Use Scenario: Holding calibrated sensor offsets, user preferences, and regulatory audit logs in portable diagnostic equipment certified to IEC 62304.

IC Role / Device Role / Timing Role: JEDEC-compliant x16 flash providing deterministic 90 ns read latency for real-time parameter recall during patient measurement cycles.

Use Value: >100-year data retention guarantees calibration persistence across device lifetime; CFI query enables auto-configuration of flash drivers in safety-critical boot sequences.

Automotive Body Control Module (BCM) Network Router Boot Image Storage

Use Scenario: Hosting boot firmware and feature-enabling configuration bits in automotive BCMs subjected to -40°C to +85°C ambient and frequent power cycling.

IC Role / Device Role / Timing Role: Low-voltage (1.65–1.95 V) flash memory interfaced directly to 1.8 V MCU I/O, eliminating level-shifting components.

Use Value: Single-supply operation reduces BOM cost; Auto Low Power mode cuts standby current to 5 µA, extending battery backup runtime during ignition-off periods.

Use Scenario: Storing primary and fallback bootloader images in enterprise-grade routers requiring zero-downtime firmware upgrades via TFTP.

IC Role / Device Role / Timing Role: Dual-sector erase capability enables atomic A/B partition switching - one sector active while other is rewritten.

Use Value: Uniform 36 ms sector erase enables sub-100 ms failover; hardware WP# ensures bootloader partition remains immutable during network-initiated updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX29LV160DTTC-90G 3.0 V supply (2.7–3.6 V), 90 ns access, top-boot configuration, no Auto Low Power mode Requires level shifting for 1.8 V systems; lacks low-power read optimization for battery-backed designs Select when legacy 3 V infrastructure exists and power budget permits higher active current.
S29GL032N90TFIR20 3.0 V supply, 90 ns access, 32 Mbit density, no hardware boot-block protection pin (relies on software lock) Higher capacity but incompatible voltage domain; requires firmware-level protection instead of WP#-based hardware lock Choose for larger firmware footprints where voltage compatibility and hardware protection are secondary to density.

Compared with MX29LV160DTTC-90G and S29GL032N90TFIR20, the SST39WF1601-90-4I-B3KE uniquely combines 1.65–1.95 V operation, hardware bottom-boot protection, and Auto Low Power mode - making it optimal for space-constrained, battery-sensitive, and safety-critical firmware storage where voltage compatibility and deterministic protection are mandatory.

Availability

SST39WF1601-90-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostics, automotive body control modules, and network infrastructure requiring stable component supply, long-lifecycle support, and guaranteed RoHS compliance.

Supply support for SST39WF1601-90-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Silicon Storage Technology (SST), acquired by Microchip Technology in 2010, specialized in high-reliability NOR flash using proprietary SuperFlash technology for embedded systems.

The SST39WF1601-90-4I-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for low-voltage, high-endurance firmware and configuration storage in industrial, medical, and automotive applications demanding long-term data integrity.

FAQ

What is the exact boot block protection behavior of SST39WF1601-90-4I-B3KE?

The SST39WF1601-90-4I-B3KE implements bottom hardware block protection: when WP# is driven low, the bottom 32 KWord (addresses 000000H–007FFFH) is locked against program and erase operations. This region is typically used for bootloader code. If WP# is left floating, an internal pull-up holds it high, disabling protection and allowing full array access. The SST39WF1601-90-4I-B3KE does not support top-boot protection - that function is exclusive to the SST39WF1602 variant.

Does SST39WF1601-90-4I-B3KE require an external VPP voltage for programming?

No, the SST39WF1601-90-4I-B3KE does not require an external VPP voltage. It generates all necessary high-voltage programming pulses internally using its 1.65–1.95 V VDD supply. This eliminates the need for additional power rails or charge pumps in the system design, simplifying layout and reducing BOM count. All program and erase operations are fully supported within the single VDD range specified for the SST39WF1601-90-4I-B3KE.

How is end-of-write detection implemented in SST39WF1601-90-4I-B3KE?

The SST39WF1601-90-4I-B3KE provides two complementary methods: Data# Polling (DQ7 toggles until completion, then returns true data) and Toggle Bit (DQ6 toggles during operation, stops when complete). For Security ID writes, only Toggle Bit (DQ6/DQ2) is valid - Data# Polling must not be used. Both methods allow host software to poll asynchronously without blocking CPU execution, and are enabled after the fourth (program) or sixth (erase) WE# pulse per the SST39WF1601-90-4I-B3KE command sequence.

What package type is used for SST39WF1601-90-4I-B3KE?

The SST39WF1601-90-4I-B3KE uses a 48-ball WFBGA package measuring 4 mm × 6 mm, with ball pitch of 0.5 mm. This ultra-compact, RoHS-compliant, lead-free package is optimized for high-density PCB layouts in space-constrained applications such as portable medical devices and automotive ECUs. Pin assignments match the 48-ball WFBGA footprint shown in Figure 3 of the official SST39WF1601-90-4I-B3KE datasheet.

Can SST39WF1601-90-4I-B3KE be used in systems requiring Common Flash Interface (CFI) support?

Yes, the SST39WF1601-90-4I-B3KE fully supports CFI query functionality via two entry methods: SST-specific mode (write 98H to address 5555H) and general CFI mode (write 98H to address 55H). Once entered, CFI data - including geometry, timing, and command set information - is readable from standardized addresses (e.g., 10H–12H for "QRY" string, 27H for device size). The SST39WF1601-90-4I-B3KE exits CFI mode using the F0H exit command, enabling seamless integration with CFI-aware bootloaders and flash utilities.

SST39WF1601-90-4I-B3KE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
40µs
Access Time:
90 ns
Voltage - Supply:
1.65V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA

SST39WF1601-90-4I-B3KE FAQ

1.How can I place an order for SST39WF1601-90-4I-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39WF1601-90-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39WF1601-90-4I-B3KE reliable?

The price and inventory of SST39WF1601-90-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1601-90-4I-B3KE is usually 5 days.

3.What payment methods are accepted for SST39WF1601-90-4I-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1601-90-4I-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39WF1601-90-4I-B3KE?

SST39WF1601-90-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39WF1601-90-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39WF1601-90-4I-B3KE?

For technical support, including SST39WF1601-90-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1601-90-4I-B3KE requirements.

6.How does Aetrix verify that SST39WF1601-90-4I-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39WF1601-90-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1601-90-4I-B3KE meets industry standards.

7.What is the process for return or replacement of SST39WF1601-90-4I-B3KE?

All SST39WF1601-90-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1601-90-4I-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39WF1601-90-4I-B3KE part is unused and in its original packaging.

Return procedure for SST39WF1601-90-4I-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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