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Microchip Technology SST39WF1602-70-4C-B3KE
- Part No.:
- SST39WF1602-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39WF1602-70-4C-B3KE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,928
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Product details
Overview
SST39WF1602-70-4C-B3KE from Microchip Technology (formerly Silicon Storage Technology) is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded program and configuration storage in low-voltage systems. It operates from 1.65–1.95 V, delivers 70 ns read access time, supports hardware top-block protection (32 KWord), and features sector/block/chip erase with erase-suspend/resume capability.
For engineers reviewing the SST39WF1602-70-4C-B3KE datasheet, SST39WF1602-70-4C-B3KE pinout, SST39WF1602-70-4C-B3KE application, or SST39WF1602-70-4C-B3KE equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, SuperFlash reliability metrics (100K cycles, >100-year retention), and real-world use cases in automotive infotainment boot code storage, industrial PLC firmware updates, and medical device configuration memory.
Technical Context
The SST39WF1602-70-4C-B3KE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count. It uses standard JEDEC x16 asynchronous command sets-including 6-byte sector/block/chip erase sequences-and supports both SST-specific and general CFI Query modes for system identification and compatibility.
Its dual status detection-Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2)-enables precise end-of-write monitoring during Word-Program (28 µs typical), Sector-Erase (36 ms), Block-Erase (36 ms), and Chip-Erase (140 ms). Hardware block protection is activated via WP# grounding to lock the top 32 KWord (0F8000H–0FFFFFH), while RST# provides hardware reset to Read mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words); supports full 16-bit data bus interface without byte-lane splitting. |
| Read Access Time | 70 ns max; enables direct execution (XIP) from flash in microcontroller-based systems with ≤14 MHz bus timing. |
| Supply Voltage | 1.65–1.95 V; compatible with modern low-power SoCs and battery-backed systems requiring single-supply operation. |
| Endurance & Retention | 100,000 program/erase cycles typical; >100 years data retention at 85°C - validated for long-life industrial deployments. |
| Erase Granularity | Uniform 2 KWord sectors (4 KB) and 32 KWord blocks (64 KB); allows fine-grained firmware patching and robust recovery partitioning. |
| Protection Mechanism | Hardware top-block protection (WP#-enabled); prevents accidental overwrite of boot code stored in 0F8000H–0FFFFFH. |
| Security ID | 256-bit factory + user-programmable ID space (128 + 128 bits); supports secure device authentication and firmware binding. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm, 0.8 mm pitch), RoHS-compliant, AEC-Q100 qualified option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; AMS = A19 selects top/bottom boot block; A11 used for sector selection, A15 for block selection. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during write; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low chip select; device enters standby (5 µA) when high; required low for all operations except Auto Low Power exit. |
| OE# | Output Enable | Active-low output gate; controls data bus drive; must be low with CE# for valid read access. |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing; initiates internal program/erase. |
| WP# | Write Protect | Active-low hardware block lock; grounds to protect top 32 KWord (0F8000H–0FFFFFH); floating = internally pulled high = unprotected. |
| RST# | Reset | Active-low hardware reset; terminates ongoing program/erase and forces return to Read mode within TRP (min 100 ns). |
| VDD | Power Supply | 1.65–1.95 V core supply; powers internal charge pump for erase/program; no external VPP required. |
| VSS | Ground | Reference ground for all signals; two dedicated VSS balls ensure stable low-impedance return path. |
| NC | No Connect | Unbonded pins (e.g., ball E2, G1, H1); must remain unconnected per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide tunneling injector ensures fixed 28 µs Word-Program and 36 ms erase times across full lifecycle. |
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during active erase; critical for fail-safe firmware update in safety-critical systems. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 5 µA after valid access; eliminates need for external power gating logic. |
| JEDEC x16 Compliance | Fully conforms to JEDEC Standard Pin Assignments and Command Sets - guarantees interoperability with legacy and new controllers. |
| Security-ID Programmability | User segment (128 bits) can be programmed once and locked; enables unique device identity for secure boot and anti-cloning. |
Applications
| Automotive Infotainment Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and OS kernel for head-unit MCU, accessed at power-on before DRAM initialization. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with hardware top-block protection ensuring bootloader integrity. Use Value: 70 ns access enables fast cold boot; top-block protection prevents corruption during OTA firmware updates. |
Use Scenario: Holds field-upgradable ladder logic and I/O configuration tables in programmable logic controllers. IC Role / Device Role / Timing Role: Field-serviceable firmware repository supporting sector-erase for partial updates without full reflash. Use Value: 36 ms sector-erase enables <100 ms firmware patching; 100K endurance supports 10+ years of maintenance cycles. |
| Medical Device Configuration Memory | Networking Equipment Parameter Storage |
Use Scenario: Retains calibration coefficients, user preferences, and regulatory compliance settings in portable diagnostic tools. IC Role / Device Role / Timing Role: Secure, long-retention parameter store with user-programmable Security ID for audit traceability. Use Value: >100-year data retention meets FDA Class II device lifetime requirements; 256-bit ID supports HIPAA-compliant device registration. |
Use Scenario: Stores MAC address tables, VLAN configurations, and QoS policies in managed Ethernet switches. IC Role / Device Role / Timing Role: High-reliability configuration archive supporting concurrent read/write via erase-suspend during traffic bursts. Use Value: Erase-suspend allows live packet forwarding while updating routing tables; 5 µA standby current extends PoE-powered uptime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1602-70-4C-B3KE | Same 16 Mbit x16 organization but 2.7–3.6 V supply range; lacks 1.65–1.95 V ultra-low-voltage support. | Used where higher VDD simplifies power design but precludes battery-operated or energy-harvesting systems. | Select only if system VDD ≥2.7 V and backward compatibility with legacy SST39VF footprint is required. |
| MX29LV160ETTI-70G | 16 Mbit x16, 2.7–3.6 V, 70 ns access; no erase-suspend, no Security ID, bottom-block protection only. | Suitable for cost-sensitive consumer electronics where advanced protection and suspend features are unnecessary. | Choose for price-driven designs accepting reduced reliability features and no top-block or security capabilities. |
Compared with SST39WF1602-70-4C-B3KE, SST39VF1602-70-4C-B3KE trades ultra-low-voltage operation for wider supply tolerance, while MX29LV160ETTI-70G omits erase-suspend and Security ID - making SST39WF1602-70-4C-B3KE uniquely suited for safety-critical, low-power, and secure firmware storage.
Availability
SST39WF1602-70-4C-B3KE is available at Aetrix Electronics and suitable for automotive infotainment boot memory, industrial PLC firmware storage, and medical device configuration memory requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification readiness.
Supply support for SST39WF1602-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and continues to manufacture and support the SST39WF family as part of its broad serial and parallel flash portfolio.
The SST39WF1602-70-4C-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered specifically for low-voltage embedded systems needing high endurance, fast erase flexibility, and hardware-assisted security in automotive, industrial, and medical applications.
FAQ
What is the guaranteed minimum endurance rating for SST39WF1602-70-4C-B3KE?
The SST39WF1602-70-4C-B3KE is rated for 100,000 program/erase cycles typical, validated across temperature and voltage corners per JEDEC JESD22-A117. This endurance applies to all supported erase granularities - sector, block, and chip - and is maintained without performance degradation due to SuperFlash's fixed-timing architecture. The SST39WF1602-70-4C-B3KE specification sheet confirms this value under "Superior Reliability" and Table 10 operating conditions.
Does SST39WF1602-70-4C-B3KE support both top and bottom hardware block protection?
No - the SST39WF1602-70-4C-B3KE supports top hardware block protection only (32 KWord, address range 0F8000H–0FFFFFH), as explicitly defined in the datasheet Table 3 and "Hardware Block Protection" section. The SST39WF1601 variant supports bottom-block protection instead. This distinction is hardwired and cannot be configured via software or pin strapping. The SST39WF1602-70-4C-B3KE datasheet states WP# activation locks only the top block.
How does the Auto Low Power mode function in SST39WF1602-70-4C-B3KE?
The SST39WF1602-70-4C-B3KE enters Auto Low Power mode automatically after a valid Read operation completes, reducing active current from ~9 mA to 5 µA. It exits instantly on any address or control signal transition (e.g., CE# toggle or A0 change) with zero access time penalty. This mode requires no software enable and is disabled only during power-up with CE# held low. The SST39WF1602-70-4C-B3KE datasheet specifies this behavior in Section "Device Operation" and Figure 4 timing diagrams.
Can SST39WF1602-70-4C-B3KE be used in AEC-Q100 qualified automotive designs?
Yes - an AEC-Q100-qualified version of SST39WF1602-70-4C-B3KE is available per the datasheet's "All devices are RoHS compliant" and "AEC-Q100-qualified devices available" statements. This qualification covers temperature grade 2 (-40°C to +105°C) and includes stress testing for reliability in automotive environments. Customers must specify the qualified variant (e.g., part marking suffix or ordering code) and verify compliance documentation with Microchip prior to design-in. The SST39WF1602-70-4C-B3KE base part itself is not automatically qualified.
What is the purpose of the Security ID feature in SST39WF1602-70-4C-B3KE?
The SST39WF1602-70-4C-B3KE includes a 256-bit Security ID space: 128 bits factory-programmed by Microchip (locked permanently) and 128 bits user-programmable (lockable post-write). It enables device authentication, firmware binding, and audit trail generation. Programming requires the Security ID Word-Program command (88H), and locking uses the User Sec ID Program Lock-Out command. Neither segment is erasable. This feature is documented in Section "Security ID" and Table 6 of the SST39WF1602-70-4C-B3KE datasheet.
SST39WF1602-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39WF1602-70-4C-B3KE FAQ
1.How can I place an order for SST39WF1602-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF1602-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF1602-70-4C-B3KE reliable?
The price and inventory of SST39WF1602-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1602-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39WF1602-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1602-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF1602-70-4C-B3KE?
SST39WF1602-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF1602-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF1602-70-4C-B3KE?
For technical support, including SST39WF1602-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1602-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39WF1602-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39WF1602-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1602-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39WF1602-70-4C-B3KE?
All SST39WF1602-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1602-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF1602-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39WF1602-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39WF1602-70-4C-B3KE Tags
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