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Microchip Technology SST39WF1602-70-4C-B3KE-T
- Part No.:
- SST39WF1602-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39WF1602-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,242
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Product details
Overview
SST39WF1602-70-4C-B3KE-T from Microchip Technology (formerly Silicon Storage Technology) is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded program and configuration storage in low-voltage systems. It operates from 1.65–1.95 V, delivers 70 ns read access time, supports hardware top-block protection (32 KWord), and features sector/block/chip erase with erase-suspend/resume capability.
For engineers reviewing the SST39WF1602-70-4C-B3KE-T datasheet, SST39WF1602-70-4C-B3KE-T pinout, SST39WF1602-70-4C-B3KE-T application, or SST39WF1602-70-4C-B3KE-T equivalent, key selection considerations include its 1.65–1.95 V single-supply operation, JEDEC-compliant x16 interface, SuperFlash reliability (100,000 write/erase cycles, >100-year data retention), and 48-ball TFBGA (6 mm × 8 mm) packaging.
Technical Context
The SST39WF1602-70-4C-B3KE-T implements SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its command set conforms to JEDEC standard pin assignments and includes software data protection (SDP) with three-byte (program) and six-byte (erase) sequences.
It integrates hardware block protection via WP# for the top 32 KWord boot block (0F8000H–0FFFFFH), a dedicated RST# pin for hardware reset, and dual status detection (DQ7 Data# Polling and DQ6/DQ2 Toggle Bits) for asynchronous write completion monitoring. The device supports CFI Query mode for system-level identification and compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M × 16 (16 Mbit total capacity); enables byte-aligned firmware storage without external data-width conversion. |
| Read Access Time | 70 ns; ensures deterministic timing for high-speed microcontroller instruction fetch or configuration read operations. |
| Supply Voltage | 1.65–1.95 V; compatible with modern ultra-low-power SoCs and battery-backed systems without level-shifting. |
| Endurance | 100,000 program/erase cycles (typical); supports field firmware updates over product lifetime in industrial controllers. |
| Data Retention | >100 years; guarantees nonvolatile storage integrity across extended shelf life and deployment periods. |
| Erase Times | Sector/Block: 36 ms (typ), Chip: 140 ms (typ); enables rapid reconfiguration without system downtime. |
| Power Consumption | Active: 5 mA (5 MHz), Standby/Auto-Low-Power: 5 µA; reduces quiescent current in always-on edge devices. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm, ball pitch 0.8 mm), RoHS-compliant, AEC-Q100 qualified option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 100% addressable space (1M words); A19–A16 used for block selection during Block-Erase, A11–A0 for Sector-Erase. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; latched internally during writes; tri-stated when CE# or OE# is high. |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write; controls device power state (standby when high). |
| OE# | Output Enable | Active-low output gate; allows data read without deselecting chip; enables interleaved access in multi-device systems. |
| WE# | Write Enable | Active-low control for write cycles; timing-critical for command sequence latching (falling/rising edge synchronization). |
| WP# | Write Protect | Hardware top-block lock (0F8000H–0FFFFFH); grounded to prevent accidental erase/program of boot code region. |
| RST# | Reset | Hardware abort of in-progress erase/program; forces return to Read mode within TRP (min 100 ns pulse width required). |
| VDD | Power Supply | Single 1.65–1.95 V supply; internal charge pump generates VPP for programming-no external high-voltage source needed. |
| VSS | Ground | Reference for all I/O and core logic; two dedicated VSS balls ensure stable return path for low-noise operation. |
| NC | No Connect | Unbonded balls (A13, A18, A19, NC positions); must remain unconnected per design-no pull-up/down or routing. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read access or programming in non-suspended sectors during active erase-critical for fail-safe firmware updates. |
| Security ID | 256-bit factory + user-programmable ID space (128 + 128 bits); enables secure device authentication and anti-cloning in certified systems. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 5 µA after valid access-eliminates need for external power gating in battery-powered nodes. |
| JEDEC CFI Support | Full Common Flash Interface compliance (SST and general modes); enables plug-and-play driver integration and cross-vendor firmware tools. |
| Hardware Block Protection | Top 32 KWord (256 KB) boot block protected by WP# pin-prevents corruption of bootloader or safety-critical startup code. |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
Use Scenario: Storing and updating ladder logic programs and I/O configuration tables in programmable logic controllers operating at -40°C to +85°C. IC Role / Device Role / Timing Role: Nonvolatile program memory with guaranteed 70 ns read access and hardware write protection for safety-critical boot code. Use Value: Enables field firmware upgrades without hardware redesign; top-block protection prevents accidental overwrite of certified safety routines. |
Use Scenario: Holding boot firmware and OS kernel images in automotive head units requiring AEC-Q100 qualification and fast cold-start performance. IC Role / Device Role / Timing Role: Primary boot flash with 1.65–1.95 V operation matching SoC core voltage, supporting rapid boot via 70 ns access. Use Value: Eliminates level shifters and reduces BOM cost; >100-year data retention ensures integrity over vehicle lifetime (15+ years). |
| Medical Device Configuration Storage | Smart Meter Firmware Update Memory |
Use Scenario: Retaining calibration parameters, user preferences, and regulatory-compliant audit logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, long-term configuration memory leveraging 256-bit Security ID for traceability and tamper evidence. Use Value: Meets IEC 62304 data integrity requirements; 100,000-cycle endurance supports frequent recalibration without wear-out risk. |
Use Scenario: Hosting upgradable firmware and tariff tables in utility smart meters deployed in remote, unattended locations. IC Role / Device Role / Timing Role: Field-updatable program memory with sector-erase capability enabling delta updates without full reflash. Use Value: Reduces OTA update time and bandwidth usage; erase-suspend allows metering continuity during background firmware patching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1602-70-4C-B3KE-T | 3.0 V operation (2.7–3.6 V), slower 70 ns access, identical 1M×16 organization and command set. | Requires higher VDD; unsuitable for 1.8 V systems but offers better noise immunity in electrically noisy industrial environments. | Select only if system rail is ≥2.7 V and legacy 3 V design reuse is prioritized over power efficiency. |
| MX29LV160ETTI-70G | 3.0 V operation, 70 ns access, same JEDEC x16 interface, but lacks erase-suspend and Security ID features. | No hardware suspend capability limits safe firmware update scenarios; no factory/user ID space for security binding. | Acceptable for cost-sensitive, non-safety-critical applications where full feature parity is not required. |
Compared with SST39VF1602-70-4C-B3KE-T and MX29LV160ETTI-70G, the SST39WF1602-70-4C-B3KE-T uniquely delivers 1.65–1.95 V operation with erase-suspend and 256-bit Security ID-making it the only choice for next-gen ultra-low-power, secure, and fail-safe embedded firmware storage.
Availability
SST39WF1602-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial automation, automotive infotainment, and medical diagnostics requiring stable component supply, long-life firmware storage, and AEC-Q100-qualified variants.
Supply support for SST39WF1602-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and maintains the MPF+ Flash portfolio for high-reliability embedded applications.
The SST39WF1602 belongs to the Multi-Purpose Flash Plus family, engineered specifically for low-voltage, high-endurance firmware and configuration storage in space-constrained, power-sensitive systems.
FAQ
What is the exact memory organization and density of the SST39WF1602-70-4C-B3KE-T?
The SST39WF1602-70-4C-B3KE-T is organized as 1M × 16, delivering 16 Mbit (2 MByte) of nonvolatile storage. This configuration provides full 16-bit data bus alignment, eliminating the need for external data multiplexing in microcontroller-based designs. Each word is individually addressable, and the device supports uniform 2 KWord sectors and 32 KWord blocks for granular erase control.
Does the SST39WF1602-70-4C-B3KE-T support hardware write protection, and how is it configured?
Yes, the SST39WF1602-70-4C-B3KE-T implements hardware top-block protection via the WP# pin. When WP# is driven low, the top 32 KWord (256 KB) boot block (address range 0F8000H–0FFFFFH) is locked against program and erase operations. If WP# is left floating, an internal pull-up holds it high, disabling protection. This mechanism safeguards critical bootloader code without software overhead.
How does the SST39WF1602-70-4C-B3KE-T indicate completion of a program or erase operation?
The SST39WF1602-70-4C-B3KE-T provides two hardware-supported status detection methods: Data# Polling on DQ7 and Toggle Bit on DQ6 (and DQ2 for erase-suspend context). During internal operations, DQ7 toggles between complement and true data, while DQ6 alternates 0/1 until completion. These signals allow host processors to poll asynchronously-without timers-ensuring deterministic, low-overhead write cycle management.
Is the SST39WF1602-70-4C-B3KE-T compatible with standard JEDEC flash command sets and interfaces?
Yes, the SST39WF1602-70-4C-B3KE-T fully complies with JEDEC standard pin assignments and command definitions for x16 asynchronous flash memories. It supports both SST-specific and general Common Flash Interface (CFI) Query modes, enabling seamless integration with industry-standard flash drivers, programming tools, and BIOS/firmware update utilities without custom adaptation.
What package type and footprint does the SST39WF1602-70-4C-B3KE-T use, and are there alternatives?
The SST39WF1602-70-4C-B3KE-T uses a 48-ball TFBGA package measuring 6 mm × 8 mm with 0.8 mm ball pitch. This compact, surface-mount footprint supports high-density PCB layouts. An alternative 48-ball WFBGA (4 mm × 6 mm) variant exists-but the B3KE-T suffix explicitly denotes the TFBGA version. Both packages share identical pinouts and electrical behavior.
SST39WF1602-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39WF1602-70-4C-B3KE-T FAQ
1.How can I place an order for SST39WF1602-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF1602-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF1602-70-4C-B3KE-T reliable?
The price and inventory of SST39WF1602-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1602-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39WF1602-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1602-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF1602-70-4C-B3KE-T?
SST39WF1602-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF1602-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF1602-70-4C-B3KE-T?
For technical support, including SST39WF1602-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1602-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39WF1602-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39WF1602-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1602-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39WF1602-70-4C-B3KE-T?
All SST39WF1602-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1602-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF1602-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39WF1602-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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