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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Microchip Technology SST39WF1602-70-4C-MAQE

Name: SST39WF1602-70-4C-MAQE
Brand: Microchip Technology
SKU: SST39WF1602-70-4C-MAQE
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SST39WF1602-70-4C-MAQE

Manufacturer:: Microchip Technology

Category:: Memory

Package:: 48-WFBGA

Datasheet:: SST39WF1602-70-4C-MAQE.pdf

Description:: IC FLASH 16MBIT PARALLEL 48WFBGA

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Product details

Overview

SST39WF1602-70-4C-MAQE from Microchip Technology (formerly Silicon Storage Technology) is a 16 Mbit (1M × 16) Multi-Purpose Flash Plus (MPF+) memory IC designed for embedded program/data storage in low-voltage systems. It operates from 1.65–1.95 V, delivers 70 ns read access time, supports hardware top-block protection (32 KWord), and features sector/block/chip erase with erase-suspend/resume - used in firmware-updatable industrial controllers and automotive infotainment boot memory.

For engineers reviewing the SST39WF1602-70-4C-MAQE datasheet, SST39WF1602-70-4C-MAQE pinout, SST39WF1602-70-4C-MAQE application, or SST39WF1602-70-4C-MAQE equivalent, key selection criteria include its 1.65–1.95 V single-supply operation, JEDEC-compliant x16 asynchronous interface, top-boot block protection architecture, SuperFlash® endurance (100,000 cycles), and 48-ball TFBGA (6 mm × 8 mm) package compatibility with space-constrained PCB layouts.

Technical Context

This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count - eliminating software de-rating over lifetime. Its command set conforms to JEDEC-standard flash pinouts and protocols, including CFI Query mode (SST and general), Software Data Protection (SDP), and Security ID (128-bit factory + 128-bit user).

It supports three distinct erase granularities: uniform 2 KWord sectors, uniform 32 KWord blocks, and full-chip erase - all initiated via six-byte command sequences. Hardware write protection is implemented via the WP# pin, which disables erase/program on the top 32 KWord block (0F8000H–0FFFFFH) when grounded, while RST# provides hardware reset to Read mode with guaranteed recovery timing.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	16 Mbit (1,048,576 × 16 bits) - supports 2 MB of x16 data storage for firmware images or configuration tables.
Read Access Time	70 ns - enables direct execution from flash (XIP) in microcontroller-based systems without wait states at moderate clock speeds.
Supply Voltage	1.65–1.95 V - compatible with modern ultra-low-power SoCs and battery-backed systems; no external VPP required.
Endurance	100,000 program/erase cycles (typical) - sufficient for field firmware updates over 10+ years in industrial deployments.
Data Retention	>100 years - ensures long-term reliability in unpowered storage applications such as calibration data or security keys.
Erase Granularity	Sector (2 KWord), Block (32 KWord), Chip - allows selective firmware patching without full reflash, reducing update time and risk.
Protection Mode	Hardware top-block protection (0F8000H–0FFFFFH) - prevents accidental overwrite of boot code during field updates.

Pinout & Package

Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), 6 mm × 8 mm footprint, 0.5 mm ball pitch, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A19	Address Inputs	16-bit address bus (A0–A15) plus 4 MSBs (A16–A19) for sector/block selection; AMS = A19 per JEDEC.
DQ0–DQ15	Data I/O	x16 bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# high.
CE#	Chip Enable	Active-low chip select - device enters standby (5 µA) when high; required for all operations.
OE#	Output Enable	Active-low output gate - controls data bus drive; must be low with CE# for valid reads.
WE#	Write Enable	Active-low control for write cycles; latches address/data edges and initiates internal program/erase.
WP#	Write Protect	Active-low hardware lock for top 32 KWord boot block; floating = internally pulled high = unprotected.
RST#	Reset	Active-low hardware reset - forces immediate return to Read mode; requires TRHR delay before next valid read.
VDD	Power Supply	1.65–1.95 V core supply; powers all logic and SuperFlash® array; no separate VPP needed.
VSS	Ground	Reference ground for all signals and internal circuitry; two dedicated balls for low-noise operation.
NC	No Connect	Unbonded balls (e.g., A13, A18, NC positions); must be left unconnected on PCB.

Key Features

Feature	Design Value
Erase-Suspend/Resume	Pause ongoing sector/block erase to read/program other regions - enables real-time firmware validation during update.
Auto Low Power Mode	Reduces active read current from 5 mA to 5 µA after valid access - cuts dynamic power by 1000× during idle polling.
Security ID Space	256-bit segmented ID (128-bit factory locked + 128-bit user programmable) - supports device authentication and secure provisioning.
End-of-Write Detection	Dual status methods: DQ7 Data# Polling and DQ6/DQ2 Toggle Bits - eliminates need for fixed timeout delays in host firmware.
SuperFlash® Reliability	Fixed 28 µs word-program and 36 ms sector/block-erase times across full lifecycle - removes runtime margining in system timing budgets.

Applications

Industrial PLC Firmware Storage	Automotive Infotainment Boot Memory
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments with wide temperature swings (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile program memory providing XIP-capable boot code and application firmware with hardware top-block protection against corruption during remote OTA updates. Use Value: 70 ns read access enables deterministic boot timing; 100,000-cycle endurance supports >10 years of scheduled firmware revisions; top-block protection isolates bootloader integrity.	Use Scenario: Holding boot ROM and critical safety-critical initialization code in head-unit ECUs, where AEC-Q100 qualification and data retention >100 years are mandatory. IC Role / Device Role / Timing Role: Primary boot flash memory interfacing directly with ARM Cortex-A/R processors via x16 asynchronous bus; RST# ensures safe recovery from brown-out events. Use Value: 1.65–1.95 V operation matches low-voltage domain of automotive SoCs; SuperFlash® fixed timing avoids timing drift over lifetime; CFI support simplifies bootloader compatibility across generations.
Medical Device Configuration Storage	Network Equipment FPGA Bitstream Storage
Use Scenario: Retaining calibrated sensor offsets, user preferences, and regulatory audit logs in portable diagnostic equipment requiring long-term data integrity and tamper resistance. IC Role / Device Role / Timing Role: Secure configuration memory with programmable Security ID and hardware write protection - prevents unauthorized parameter modification. Use Value: 256-bit Security ID enables cryptographic binding to host MCU; >100-year data retention meets FDA 21 CFR Part 11 archival requirements; sector-erase allows field calibration updates without full reconfiguration.	Use Scenario: Storing FPGA configuration bitstreams in telecom switches and base station radios, where fast, reliable reconfiguration after power loss is essential. IC Role / Device Role / Timing Role: Configuration memory mapped to FPGA's parallel slave select (PSS) interface; chip-erase (140 ms typical) enables rapid field upgrades of entire logic design. Use Value: 140 ms chip-erase time reduces downtime vs. legacy flash; uniform 2 KWord sectors allow partial reconfiguration of peripheral logic; JEDEC compliance ensures drop-in replacement across vendor toolchains.

Industrial PLC Firmware Storage

Automotive Infotainment Boot Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments with wide temperature swings (-40°C to +85°C).

IC Role / Device Role / Timing Role: Nonvolatile program memory providing XIP-capable boot code and application firmware with hardware top-block protection against corruption during remote OTA updates.

Use Value: 70 ns read access enables deterministic boot timing; 100,000-cycle endurance supports >10 years of scheduled firmware revisions; top-block protection isolates bootloader integrity.

Use Scenario: Holding boot ROM and critical safety-critical initialization code in head-unit ECUs, where AEC-Q100 qualification and data retention >100 years are mandatory.

IC Role / Device Role / Timing Role: Primary boot flash memory interfacing directly with ARM Cortex-A/R processors via x16 asynchronous bus; RST# ensures safe recovery from brown-out events.

Use Value: 1.65–1.95 V operation matches low-voltage domain of automotive SoCs; SuperFlash® fixed timing avoids timing drift over lifetime; CFI support simplifies bootloader compatibility across generations.

Medical Device Configuration Storage

Network Equipment FPGA Bitstream Storage

Use Scenario: Retaining calibrated sensor offsets, user preferences, and regulatory audit logs in portable diagnostic equipment requiring long-term data integrity and tamper resistance.

IC Role / Device Role / Timing Role: Secure configuration memory with programmable Security ID and hardware write protection - prevents unauthorized parameter modification.

Use Value: 256-bit Security ID enables cryptographic binding to host MCU; >100-year data retention meets FDA 21 CFR Part 11 archival requirements; sector-erase allows field calibration updates without full reconfiguration.

Use Scenario: Storing FPGA configuration bitstreams in telecom switches and base station radios, where fast, reliable reconfiguration after power loss is essential.

IC Role / Device Role / Timing Role: Configuration memory mapped to FPGA's parallel slave select (PSS) interface; chip-erase (140 ms typical) enables rapid field upgrades of entire logic design.

Use Value: 140 ms chip-erase time reduces downtime vs. legacy flash; uniform 2 KWord sectors allow partial reconfiguration of peripheral logic; JEDEC compliance ensures drop-in replacement across vendor toolchains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MX29LV160ETTI-70G	3.0 V supply (2.7–3.6 V), 70 ns access, 16 Mbit x16, bottom-boot configuration	Lacks top-boot protection; incompatible voltage range; requires level-shifting in 1.8 V systems	Select only if existing 3.0 V design mandates pin-compatible replacement and boot block location is not critical.
S29GL032N90TFI020	3.0 V supply, 90 ns access, 32 Mbit density, mirror-bit architecture, no RST# pin	Higher density but slower access; no hardware reset; different command set (mirror-bit vs. standard flash)	Choose for cost-sensitive 32 Mbit needs where reset functionality is handled externally and timing budget allows 90 ns latency.

Compared with MX29LV160ETTI-70G and S29GL032N90TFI020, the SST39WF1602-70-4C-MAQE uniquely combines 1.65–1.95 V operation, top-boot hardware protection, RST# pin, and fixed SuperFlash® timing - making it the only option for new ultra-low-voltage designs requiring guaranteed boot integrity and lifetime timing stability.

Availability

SST39WF1602-70-4C-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, medical device configuration storage, and network equipment FPGA bitstream storage requiring stable component supply across extended product lifecycles.

Supply support for SST39WF1602-70-4C-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and now manufactures and supports the SST39WF1602-70-4C-MAQE as part of its broad portfolio of serial and parallel flash memory solutions.

This device belongs to Microchip's Multi-Purpose Flash Plus (MPF+) product line, engineered specifically for ultra-low-voltage embedded systems requiring high reliability, fast in-system updates, and hardware-enforced boot code protection in space-constrained packages.

FAQ

What is the operating voltage range for the SST39WF1602-70-4C-MAQE?

The SST39WF1602-70-4C-MAQE operates from 1.65 V to 1.95 V DC on VDD. This single-supply range eliminates the need for external voltage translators in 1.8 V systems and ensures compatibility with modern low-power microcontrollers and SoCs. Operation outside this range - including during power-up/down - inhibits write functions per built-in VDD detection circuitry.

Does the SST39WF1602-70-4C-MAQE support hardware reset, and how is it implemented?

Yes, the SST39WF1602-70-4C-MAQE includes an active-low RST# pin that provides hardware reset capability. When RST# is held low for ≥ TRP (minimum pulse width), any in-progress program or erase operation terminates immediately and the device returns to Read mode. After RST# is driven high, a minimum TRHR delay is required before a valid read can occur - ensuring internal state stabilization.

How does hardware block protection work on the SST39WF1602-70-4C-MAQE?

The SST39WF1602-70-4C-MAQE implements top-block hardware protection: when WP# is grounded, program and erase operations are disabled on the top 32 KWord block (address range 0F8000H–0FFFFFH). This protects boot code from accidental overwrite. If WP# is left floating, an internal pull-up holds it high, leaving the block unprotected - a deliberate design allowing flexible configuration during development.

What erase capabilities does the SST39WF1602-70-4C-MAQE provide?

The SST39WF1602-70-4C-MAQE supports three erase modes: sector-erase (2 KWord uniform sectors), block-erase (32 KWord uniform blocks), and chip-erase (full 16 Mbit array). All are initiated via standardized six-byte command sequences. Sector-erase and block-erase times are both 36 ms typical; chip-erase takes 140 ms typical - enabling precise, low-risk firmware updates without full device reprogramming.

Is the SST39WF1602-70-4C-MAQE compatible with JEDEC-standard flash interfaces?

Yes, the SST39WF1602-70-4C-MAQE conforms fully to JEDEC Standard JESD21-C for x16 flash EEPROM pin assignments and command sets. It supports both SST-specific and general CFI Query modes, enabling interoperability with standard flash programmers and bootloader frameworks. Its pinout, timing, and command protocol are directly compatible with industry-standard x16 flash controllers.

SST39WF1602-70-4C-MAQE Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: SST39 MPF™

Package/Case:: 48-WFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH

Memory Size:: 16Mbit

Memory Organization:: 1M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 40µs

Access Time:: 70 ns

Voltage - Supply:: 1.65V ~ 1.95V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-WFBGA (6x4)

SST39WF1602-70-4C-MAQE FAQ

1.How can I place an order for SST39WF1602-70-4C-MAQE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39WF1602-70-4C-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39WF1602-70-4C-MAQE reliable?

The price and inventory of SST39WF1602-70-4C-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF1602-70-4C-MAQE is usually 5 days.

3.What payment methods are accepted for SST39WF1602-70-4C-MAQE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF1602-70-4C-MAQE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39WF1602-70-4C-MAQE?

SST39WF1602-70-4C-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39WF1602-70-4C-MAQE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39WF1602-70-4C-MAQE?

For technical support, including SST39WF1602-70-4C-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF1602-70-4C-MAQE requirements.

6.How does Aetrix verify that SST39WF1602-70-4C-MAQE is sourced from the original manufacturer or authorized distributors?

All SST39WF1602-70-4C-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF1602-70-4C-MAQE meets industry standards.

7.What is the process for return or replacement of SST39WF1602-70-4C-MAQE?

All SST39WF1602-70-4C-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF1602-70-4C-MAQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39WF1602-70-4C-MAQE part is unused and in its original packaging.

Return procedure for SST39WF1602-70-4C-MAQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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