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Microchip Technology SST39WF400B-70-4C-B3KE
- Part No.:
- SST39WF400B-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39WF400B-70-4C-B3KE.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,492
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Product details
Overview
SST39WF400B-70-4C-B3KE from Microchip Technology is a 4 Mbit (256K × 16) Multi-Purpose Flash memory IC with JEDEC-standard x16 asynchronous interface, 70 ns read access time, 1.65–1.95 V single-supply operation, and SuperFlash® technology enabling 100,000 program/erase cycles and >100 years data retention. It serves as nonvolatile code/data storage in embedded microcontroller systems requiring low-voltage, high-reliability firmware updates.
For engineers reviewing the SST39WF400B-70-4C-B3KE datasheet, SST39WF400B-70-4C-B3KE pinout, SST39WF400B-70-4C-B3KE application, or SST39WF400B-70-4C-B3KE equivalent, key selection criteria include its 48-ball WFBGA/XFLGA/TFBGA packaging, sector/block/chip-erase flexibility, Toggle Bit/Data# Polling status detection, and hardware/software data protection compliant with JEDEC pinouts and command sets.
Technical Context
The SST39WF400B-70-4C-B3KE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, delivering fixed erase/program times independent of cycle count-unlike conventional flash technologies where timing degrades over endurance life. Its control logic supports standard microprocessor write sequences for command latching via CE# and WE# falling/rising edges.
It features dual software status detection (DQ6 Toggle Bit and DQ7 Data# Polling), JEDEC-compliant CFI Query mode (SST and general), and three-layer data protection: noise/glitch immunity (<5 ns pulse rejection), VDD power-up/down detection (<1.0 V inhibit), and mandatory JEDEC-approved Software Data Protection (SDP) for all program/erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16 (4 Mbit total); enables 16-bit parallel data bus interfacing with MCUs/FPGAs without external data-width conversion. |
| Read Access Time | 70 ns; guarantees deterministic timing for real-time boot code fetch and configuration reads at system clock frequencies up to ~14 MHz. |
| Supply Voltage | 1.65–1.95 V; compatible with modern low-power SoCs and battery-backed systems, eliminating need for level shifters or auxiliary voltage rails. |
| Endurance | 100,000 cycles (typical); supports frequent field firmware updates or dynamic parameter logging in industrial controllers and IoT edge nodes. |
| Data Retention | >100 years; ensures long-term reliability for sealed or maintenance-free deployments including medical devices and infrastructure monitoring. |
| Erase Granularity | Sector (2 KWord), Block (32 KWord), Chip; allows selective firmware patching, secure key wiping, or full reprogramming without erasing entire memory space. |
| Write Detection | Toggle Bit (DQ6) and Data# Polling (DQ7); provides host-agnostic, polling-based completion signaling without requiring dedicated interrupt lines or timer-based timeouts. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), 48-ball XFLGA (4 mm × 6 mm), or 48-ball TFBGA (6 mm × 8 mm). All variants share identical pinout per JEDEC x16 flash standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 select word address; A17 (AMS) used for sector/block address decoding during erase commands per JEDEC specification. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; outputs valid data during read (CE#/OE# low), accepts program data during write; tri-stated when CE# or OE# high. |
| CE# | Chip Enable | Active-low device select; must be low to enable internal logic and respond to commands; high state forces standby current (≤40 µA). |
| OE# | Output Enable | Active-low output gate; controls data bus drive; high or floating disables output drivers, enabling bus sharing with other peripherals. |
| WE# | Write Enable | Active-low control for program/erase command latching; rising edge initiates internal operation; timing-critical for SDP sequence execution. |
| VDD | Power Supply | Single 1.65–1.95 V supply; powers core logic and memory array; internal charge pump generates required programming voltage (no external VPP needed). |
| VSS | Ground | Reference for all I/O and internal circuitry; two dedicated VSS balls ensure low-impedance return path for switching currents. |
| NC | No Connection | Unbonded pins (e.g., A11/A12 on WFBGA/XFLGA); must remain unconnected per datasheet to avoid signal integrity or ESD risks. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide tunneling injector enables fixed 36 ms block/sector erase and 28 µs word-program times across full endurance life-no software derating required. |
| JEDEC Standard Compliance | Fully conforms to JEDEC pinouts, command sets, and CFI Query structure (SST and general modes), ensuring drop-in compatibility with existing x16 flash firmware stacks. |
| Hardware + Software Protection | Combines noise immunity (<5 ns pulse rejection), VDD monitoring (<1.0 V inhibit), and mandatory 3-byte (program) / 6-byte (erase) SDP sequences to prevent accidental writes during power transitions. |
| Latched Address/Data | Internal latches capture address on falling edge of CE# or WE# (whichever occurs last), and data on rising edge (whichever occurs first)-simplifies timing margining for FPGA/CPLD interfaces. |
| Low-Power Operation | 5 mA active current (5 MHz read) and 5 µA typical standby current reduce thermal load and extend battery life in portable and energy-constrained applications. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware and I/O mapping tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with fast 70 ns read access for deterministic boot and runtime instruction fetch; sector-erase capability enables modular firmware patching without full reflash. Use Value: 100,000-cycle endurance and >100-year data retention ensure reliable operation over 15+ year equipment lifecycles without field replacement. | Use Scenario: Holding calibrated sensor offsets, user preferences, and regulatory-compliant audit logs in portable diagnostic instruments such as ultrasound or ECG units. IC Role / Device Role / Timing Role: Secure, low-voltage (1.65–1.95 V) configuration memory with hardware/software write protection preventing corruption during battery swaps or brownout events. Use Value: Toggle Bit and Data# Polling enable robust status detection in safety-critical systems where interrupt latency or external timers are unacceptable. |
| Automotive Infotainment Boot ROM | Network Equipment Parameter Storage |
Use Scenario: Hosting boot code and display firmware for head-unit systems operating across -40°C to +85°C industrial temperature range. IC Role / Device Role / Timing Role: x16 parallel interface reduces MCU GPIO count vs. serial flash; 48-ball WFBGA enables compact PCB layout in space-constrained automotive modules. Use Value: Single 1.8 V supply eliminates need for dedicated flash voltage regulator, simplifying power tree and reducing BOM cost. | Use Scenario: Storing MAC addresses, encryption keys, and port configuration profiles in Ethernet switches and wireless access points requiring field-upgradable settings. IC Role / Device Role / Timing Role: Chip-erase capability (140 ms typical) enables secure zeroization of sensitive data before device decommissioning or resale. Use Value: CFI Query support allows automatic identification and driver initialization by Linux kernel MTD subsystem without hardcoded part assumptions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF400A-70-4C-B3KE | Lower voltage range (2.7–3.6 V); no SuperFlash®-longer and variable erase/program times; 100K cycles rated but not guaranteed at same VDD. | Requires separate 3.3 V rail; unsuitable for 1.8 V systems; less suitable for high-frequency update scenarios due to timing drift over cycles. | Select only if legacy 3.3 V design exists and SuperFlash® timing stability is not required. |
| MX29LV400CBTI-70G | 3.0 V core; 70 ns access; 100K cycles; lacks Toggle Bit/DQ7 polling-relies on Ready/Busy pin or fixed delays; no CFI Query support. | Needs external RY/BY signal routing; firmware must implement timeout-based polling; no auto-detection for multi-vendor BOMs. | Choose when pin count permits RY/BY use and CFI-driven driver portability is unnecessary. |
Compared with SST39VF400A-70-4C-B3KE and MX29LV400CBTI-70G, the SST39WF400B-70-4C-B3KE uniquely delivers stable 70 ns read + fixed 36 ms erase timing across its full 100,000-cycle life at 1.8 V, while integrating dual software status detection and JEDEC CFI for seamless firmware abstraction-reducing validation effort and field failure risk.
Availability
SST39WF400B-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and automotive infotainment boot ROM requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for SST39WF400B-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39WF400B-70-4C-B3KE belongs to the SuperFlash® Multi-Purpose Flash product line, engineered for embedded systems demanding low-voltage operation, high endurance, and deterministic timing in code/data storage roles.
FAQ
What is the operating voltage range for the SST39WF400B-70-4C-B3KE?
The SST39WF400B-70-4C-B3KE operates from 1.65 V to 1.95 V, making it compatible with modern 1.8 V systems. This single-supply range eliminates the need for external voltage translation or auxiliary regulators. The device uses internal charge pumping to generate required programming voltages, and all DC specifications-including active current (15 mA max) and standby current (40 µA max)-are guaranteed across this range per Table 11 of the DS25034A datasheet.
Does the SST39WF400B-70-4C-B3KE support JEDEC-standard command sets and pinouts?
Yes, the SST39WF400B-70-4C-B3KE fully conforms to JEDEC standard pin assignments and command sets for x16 flash memories. It supports both SST-specific and general Common Flash Interface (CFI) Query modes, enabling automatic device identification and driver compatibility across multiple vendors. The datasheet explicitly states compliance on page 2 and details CFI entry sequences and response structures in Tables 5–7.
How does the SST39WF400B-70-4C-B3KE detect completion of Program or Erase operations?
The SST39WF400B-70-4C-B3KE provides two software-based detection methods: Toggle Bit (DQ6) and Data# Polling (DQ7). During internal operations, DQ6 toggles between 0 and 1; cessation indicates completion. DQ7 returns complemented data until complete, then true data. Both are valid after the fourth (Program) or sixth (Erase) WE# pulse, per Figures 8–9 and Section 8 of DS25034A.
What package options are available for the SST39WF400B-70-4C-B3KE?
The SST39WF400B-70-4C-B3KE is offered in three 48-ball packages: TFBGA (6 mm × 8 mm), WFBGA (4 mm × 6 mm), and XFLGA (4 mm × 6 mm). All share identical pinout and electrical characteristics. Pin assignments and mechanical drawings are provided in Figures 2–3 of DS25034A, with WFBGA/XFLGA sharing the same top-view layout.
What data protection mechanisms does the SST39WF400B-70-4C-B3KE include?
The SST39WF400B-70-4C-B3KE integrates hardware and software protection: noise/glitch immunity rejects pulses <5 ns; VDD monitoring inhibits writes below 1.0 V; Write Inhibit mode activates when OE#, CE#, or WE# is asserted incorrectly. Software Data Protection requires mandatory 3-byte (Program) or 6-byte (Erase) command sequences, permanently enabled at shipment per Table 4 and Section 9 of DS25034A.
SST39WF400B-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39WF400B-70-4C-B3KE FAQ
1.How can I place an order for SST39WF400B-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF400B-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF400B-70-4C-B3KE reliable?
The price and inventory of SST39WF400B-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF400B-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39WF400B-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF400B-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF400B-70-4C-B3KE?
SST39WF400B-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF400B-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF400B-70-4C-B3KE?
For technical support, including SST39WF400B-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF400B-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39WF400B-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39WF400B-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF400B-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39WF400B-70-4C-B3KE?
All SST39WF400B-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF400B-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF400B-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39WF400B-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39WF400B-70-4C-B3KE Tags
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