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Microchip Technology SST39WF400B-70-4I-B3KE
- Part No.:
- SST39WF400B-70-4I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39WF400B-70-4I-B3KE.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,472
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Product details
Overview
SST39WF400B-70-4I-B3KE from Microchip Technology is a 4 Mbit (256K × 16) Multi-Purpose Flash memory IC using SuperFlash technology, operating from 1.65–1.95 V, with 70 ns read access time, 100,000 program/erase cycles endurance, and >100-year data retention. It serves as nonvolatile program/data storage in embedded controllers requiring low-voltage, sector/block-erasable flash.
For engineers reviewing the SST39WF400B-70-4I-B3KE datasheet, SST39WF400B-70-4I-B3KE pinout, SST39WF400B-70-4I-B3KE application, or SST39WF400B-70-4I-B3KE equivalent, this page delivers verified JEDEC-compliant x16 flash specifications, WFBGA/XFLGA/TFBGA package details, sector-erase timing, and hardware/software data protection implementation guidance.
Technical Context
The SST39WF400B-70-4I-B3KE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed 28 µs word-program and 36 ms sector/block-erase times independent of cycle count. It supports JEDEC-standard command sets for Software Data Protection (SDP), CFI Query, and Product ID identification.
It uses CMOS-compatible I/O with tri-state outputs controlled by CE# and OE#, latched address/data buses, and dual end-of-write detection via DQ7 Data# Polling and DQ6 Toggle Bit - both valid after the fourth (program) or sixth (erase) WE#/CE# pulse edge.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 16 (4 Mbit total); supports x16 asynchronous parallel interface with AMS = A17 |
| Read Access Time | 70 ns; enables direct replacement for legacy 70 ns NOR flash in boot code or firmware storage |
| Supply Voltage | 1.65–1.95 V; single-supply operation compatible with 1.8 V system rails, no external VPP required |
| Endurance & Retention | 100,000 cycles typical / >100 years data retention; qualified per JEDEC A117/A103 standards |
| Erase Granularity | Uniform 2 KWord sectors (128 sectors) and 32 KWord blocks (8 blocks); enables fine-grained firmware updates |
| Program/Erase Timing | 28 µs word-program (typ), 36 ms sector/block-erase (typ), 140 ms chip-erase (typ); fixed timing unaffected by wear |
| Power Consumption | 5 mA active current (5 MHz), 5 µA standby current (typ); optimized for low-power embedded systems |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm) and XFLGA (4 mm × 6 mm), plus 48-ball TFBGA (6 mm × 8 mm); RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 select byte/word location; A17 = AMS (most significant address) used for sector/block selection during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; outputs tri-stated when CE# or OE# high; latched on rising edge of WE#/CE# |
| CE# | Chip Enable | Active-low device selection; must be low for read/program/erase; inhibits writes when high |
| OE# | Output Enable | Active-low output gating; controls DQ bus drive; high-Z state when high or CE# high |
| WE# | Write Enable | Active-low control for program/erase initiation; latches address/data on falling/rising edges per JEDEC sequence |
| VDD | Power Supply | 1.65–1.95 V core supply; internal charge pump generates programming voltage - no external VPP needed |
| VSS | Ground | Two dedicated ground balls (pins J1, L1 in WFBGA/XFLGA) ensure stable reference for low-noise operation |
| NC | No Connection | Unbonded pins (e.g., A11, A13 in some ball maps); must be left floating or tied to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide injector enables fixed erase/program timing and superior reliability vs. conventional NOR flash |
| JEDEC-Compliant Interface | Standard x16 pinout and command set (e.g., 5555H/2AAAH sequences) ensures drop-in compatibility with existing flash controllers |
| Hardware + Software Protection | Glitch filtering (<5 ns), VDD power-up detection (<1.0 V inhibit), and mandatory 3-byte (program)/6-byte (erase) SDP commands prevent accidental writes |
| CFI & Product ID Support | Built-in Common Flash Interface (CFI) and software ID entry (00BFH/272EH) enable automatic driver detection and multi-vendor socket management |
| Low-Voltage Erase/Program | Full functionality at 1.65–1.95 V eliminates need for voltage translators or level shifters in 1.8 V systems |
Applications
| Industrial HMI Firmware Storage | Medical Device Configuration Memory |
|---|---|
|
Use Scenario: Storing boot loader, GUI assets, and calibration tables in panel-mounted HMIs with extended temperature requirements. IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash providing fast 70 ns read access for real-time UI rendering and secure field-upgradable firmware. Use Value: 100,000-cycle endurance and >100-year retention ensure long-term reliability across industrial lifecycle; 1.65–1.95 V operation simplifies power design. |
Use Scenario: Holding device-specific configuration profiles, sensor calibration data, and regulatory compliance logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, sector-erasable flash supporting encrypted parameter updates without full reprogramming. Use Value: Hardware write-inhibit and mandatory SDP commands prevent corruption during battery swaps or brownouts; RoHS compliance meets medical safety standards. |
| Automotive Telematics Boot Memory | Networking Equipment Code Storage |
|
Use Scenario: Hosting bootloader and secure boot keys in LTE/Wi-Fi telematics modules operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade flash with guaranteed 1.65–1.95 V operation and JEDEC-standard timing for deterministic boot sequencing. Use Value: Fixed 36 ms block-erase time enables predictable OTA update windows; CFI support allows auto-negotiation with host SoC flash controllers. |
Use Scenario: Storing FPGA bitstreams, PHY initialization code, and protocol stacks in enterprise switches and routers. IC Role / Device Role / Timing Role: High-reliability parallel flash interfacing directly with MIPS/ARM bus masters for zero-wait-state execution. Use Value: 48-ball WFBGA footprint minimizes PCB area vs. TSOP; 5 µA standby current reduces idle power in always-on network infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF400A-70-4C-B3KE | Same 4 Mbit x16 organization, but rated for 2.7–3.6 V supply; 70 ns access, 100K cycles, identical pinout and command set | Requires 3.3 V rail; not suitable for 1.8 V systems; higher active current (15 mA typ) | Select only if legacy 3.3 V design requires direct pin-compatible upgrade without voltage regulator change |
| MX29LV400CTTI-70G | 4 Mbit x16 CFI-compliant flash; 70 ns access; 1.65–1.95 V operation; 100K cycles; same WFBGA package option | Uses different SDP command sequence (5555H/2AAAH/5555H/80H/5555H/10H for chip-erase); minor CFI table offset differences | Valid alternative for new designs where firmware abstraction layer handles command variation; verify CFI query response parsing |
Compared with SST39WF400B-70-4I-B3KE, the SST39VF400A variant demands higher voltage and draws more active current, while MX29LV400CTTI offers matching voltage and density but requires validation of command sequence integration - neither is pin-identical in electrical behavior across all modes.
Availability
SST39WF400B-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial HMI firmware storage, medical device configuration memory, automotive telematics boot memory, and networking equipment code storage requiring stable component supply across extended temperature ranges (-40°C to +85°C).
Supply support for SST39WF400B-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and integrates its SuperFlash IP into high-reliability nonvolatile memory products for industrial, automotive, and communications markets.
The SST39WF400B product line delivers low-voltage, sector-erasable parallel flash targeting cost-sensitive embedded systems needing robust firmware storage with minimal power and board space - a direct evolution of SST's proprietary SuperFlash architecture.
FAQ
What is the operating voltage range for SST39WF400B-70-4I-B3KE?
The SST39WF400B-70-4I-B3KE operates from 1.65 V to 1.95 V for all functions including read, program, and erase. This single-supply range eliminates the need for external VPP generation and ensures compatibility with 1.8 V system rails. The device incorporates internal charge-pump circuitry to generate required programming voltages, and VDD must remain within this window during active operations to guarantee specified timing and endurance.
Does SST39WF400B-70-4I-B3KE support JEDEC-standard command sets?
Yes, SST39WF400B-70-4I-B3KE fully conforms to JEDEC standard pinouts and command sets for x16 flash memories. It implements the mandatory Software Data Protection (SDP) sequences - three-byte for word-program and six-byte for sector/block/chip-erase - as well as CFI Query mode (via 5555H/2AAAH/5555H/98H) and Product ID entry (5555H/2AAAH/5555H/90H). These ensure interoperability with standard flash controllers and BIOS/firmware drivers.
What package options are available for SST39WF400B-70-4I-B3KE?
SST39WF400B-70-4I-B3KE is offered in three RoHS-compliant packages: 48-ball WFBGA (4 mm × 6 mm), 48-ball XFLGA (4 mm × 6 mm), and 48-ball TFBGA (6 mm × 8 mm). All share identical pin assignments per JEDEC standard, with differences limited to ball pitch and overall footprint. The WFBGA and XFLGA variants are optimized for space-constrained applications, while TFBGA provides enhanced thermal dissipation for high-duty-cycle use cases.
How does SST39WF400B-70-4I-B3KE detect completion of program or erase operations?
SST39WF400B-70-4I-B3KE provides two hardware-supported detection methods: Data# Polling on DQ7 and Toggle Bit on DQ6. After initiating a program (fourth WE#/CE# edge) or erase (sixth WE#/CE# edge), DQ7 toggles between complement and true data, while DQ6 alternates logic states until completion. Both signals are valid without additional hardware and require no timeout polling - enabling efficient CPU utilization during nonvolatile write cycles.
What is the endurance and data retention specification for SST39WF400B-70-4I-B3KE?
SST39WF400B-70-4I-B3KE is rated for 100,000 program/erase cycles minimum (typical) and greater than 100 years of data retention at 25°C, qualified per JEDEC standards A117 (endurance) and A103 (retention). These values are guaranteed across the full industrial temperature range (-40°C to +85°C) and reflect the inherent reliability of SST's SuperFlash split-gate cell structure, which maintains consistent performance regardless of accumulated wear.
SST39WF400B-70-4I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 40µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 1.65V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39WF400B-70-4I-B3KE FAQ
1.How can I place an order for SST39WF400B-70-4I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39WF400B-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39WF400B-70-4I-B3KE reliable?
The price and inventory of SST39WF400B-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39WF400B-70-4I-B3KE is usually 5 days.
3.What payment methods are accepted for SST39WF400B-70-4I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39WF400B-70-4I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39WF400B-70-4I-B3KE?
SST39WF400B-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39WF400B-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39WF400B-70-4I-B3KE?
For technical support, including SST39WF400B-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39WF400B-70-4I-B3KE requirements.
6.How does Aetrix verify that SST39WF400B-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39WF400B-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39WF400B-70-4I-B3KE meets industry standards.
7.What is the process for return or replacement of SST39WF400B-70-4I-B3KE?
All SST39WF400B-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39WF400B-70-4I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39WF400B-70-4I-B3KE part is unused and in its original packaging.
Return procedure for SST39WF400B-70-4I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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